JPS5474678A - Detection method of chip location on semiconductor wafer - Google Patents
Detection method of chip location on semiconductor waferInfo
- Publication number
- JPS5474678A JPS5474678A JP14164377A JP14164377A JPS5474678A JP S5474678 A JPS5474678 A JP S5474678A JP 14164377 A JP14164377 A JP 14164377A JP 14164377 A JP14164377 A JP 14164377A JP S5474678 A JPS5474678 A JP S5474678A
- Authority
- JP
- Japan
- Prior art keywords
- detection
- chip
- location
- illumination
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Dicing (AREA)
Abstract
PURPOSE: To enable to simple detection for the chip location on a semiconductor wafer not by complicated electric method but by changing the method of illumina- tion merely.
CONSTITUTION: The detection area 7 on the wafer 1 is image-formed on the primary dimension image elment 26 with the condition of light flux compressed toward a given direction via the otical system consisting of the objective lens 8, cylindrical lens 25, and the location of the chip 2 is calculated with the location detection circuit 27 from the image signal photo electric converted, and the alignment of the chip 2 on the wafer 1 is made by moving the table 14 via the motor control circuit 12 and motor drive mechanism 18 based on this detection value. The detection is made with the circuit 27 by using the coarseness detection illumination 28 which is tilt illumination from orthogonal direction to the pick up element 26, it is changed over to the fine detection illumination 29 tilt from the left and fright direction in parallel with the pick up element 26, fine detection is made with the coarse and fine detection, performing alignment.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14164377A JPS5474678A (en) | 1977-11-28 | 1977-11-28 | Detection method of chip location on semiconductor wafer |
| US05/964,353 US4213117A (en) | 1977-11-28 | 1978-11-28 | Method and apparatus for detecting positions of chips on a semiconductor wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14164377A JPS5474678A (en) | 1977-11-28 | 1977-11-28 | Detection method of chip location on semiconductor wafer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5474678A true JPS5474678A (en) | 1979-06-14 |
| JPS5610787B2 JPS5610787B2 (en) | 1981-03-10 |
Family
ID=15296808
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14164377A Granted JPS5474678A (en) | 1977-11-28 | 1977-11-28 | Detection method of chip location on semiconductor wafer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5474678A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5742179A (en) * | 1980-08-27 | 1982-03-09 | Nec Corp | Semiconductor device with recognition pattern |
| JPS5758332A (en) * | 1980-09-24 | 1982-04-08 | Fujitsu Ltd | Manufacture of semiconductor device |
| JPS57113244A (en) * | 1980-12-29 | 1982-07-14 | Yoshie Hasegawa | Inspecting device of wafer surface |
| KR20200013008A (en) | 2017-03-31 | 2020-02-05 | 제이엑스금속주식회사 | Laminated body and method of producing shaped article |
-
1977
- 1977-11-28 JP JP14164377A patent/JPS5474678A/en active Granted
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5742179A (en) * | 1980-08-27 | 1982-03-09 | Nec Corp | Semiconductor device with recognition pattern |
| JPS5758332A (en) * | 1980-09-24 | 1982-04-08 | Fujitsu Ltd | Manufacture of semiconductor device |
| JPS57113244A (en) * | 1980-12-29 | 1982-07-14 | Yoshie Hasegawa | Inspecting device of wafer surface |
| KR20200013008A (en) | 2017-03-31 | 2020-02-05 | 제이엑스금속주식회사 | Laminated body and method of producing shaped article |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5610787B2 (en) | 1981-03-10 |
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