JPS57113244A - Inspecting device of wafer surface - Google Patents

Inspecting device of wafer surface

Info

Publication number
JPS57113244A
JPS57113244A JP18922180A JP18922180A JPS57113244A JP S57113244 A JPS57113244 A JP S57113244A JP 18922180 A JP18922180 A JP 18922180A JP 18922180 A JP18922180 A JP 18922180A JP S57113244 A JPS57113244 A JP S57113244A
Authority
JP
Japan
Prior art keywords
picture element
color signals
wafer
intensity signal
signal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18922180A
Other languages
Japanese (ja)
Inventor
Yoshie Hasegawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP18922180A priority Critical patent/JPS57113244A/en
Publication of JPS57113244A publication Critical patent/JPS57113244A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Abstract

PURPOSE:To automatically identify the propriety of a wafer in comparison with preset estimated value by digitally converting the image on the surface of the wafer to be expanded for each predetermined picture element. CONSTITUTION:A composite video signal from a color image pickup device ITV is separated by a color demodulator DEM into color signals R, B, G and intensity signal Y, and a synchronizing signal. The color signals R, B, G and intensity signal Y are sampled for each picture element by an A/D converter A/D, to be converted into digital signal. After the picture element data of the IC chip of good part is written in a memory M1, it is transferred to a memory M2. The picture element data of the IC chip of the wafer to be inspected is written in the memory M1. Then, the differences between the color signals R, B, G, and intensity signal Y for each picture element, and the color signals R, B, G, and intensity signal Y corresponding to expected values are obtained to identify by a CPU whether or not the predetermined allowable range.
JP18922180A 1980-12-29 1980-12-29 Inspecting device of wafer surface Pending JPS57113244A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18922180A JPS57113244A (en) 1980-12-29 1980-12-29 Inspecting device of wafer surface

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18922180A JPS57113244A (en) 1980-12-29 1980-12-29 Inspecting device of wafer surface

Publications (1)

Publication Number Publication Date
JPS57113244A true JPS57113244A (en) 1982-07-14

Family

ID=16237589

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18922180A Pending JPS57113244A (en) 1980-12-29 1980-12-29 Inspecting device of wafer surface

Country Status (1)

Country Link
JP (1) JPS57113244A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5980965A (en) * 1982-10-29 1984-05-10 Matsushita Electric Ind Co Ltd Solid-state image pickup element inspection device
JPS6199845A (en) * 1984-10-22 1986-05-17 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション Optical defect detector
JPS61273088A (en) * 1985-05-29 1986-12-03 Hitachi Ltd Inspection method for surface pattern
JPS63121756A (en) * 1986-10-31 1988-05-25 テクトロニックス・インコーポレイテッド Picture signal processor
JPS63124939A (en) * 1986-11-14 1988-05-28 Hitachi Ltd Pattern inspecting method
JP2003014437A (en) * 2001-06-29 2003-01-15 Shin Etsu Handotai Co Ltd Evaluation method and evaluation device of compound semiconductor wafer

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5120253A (en) * 1974-08-13 1976-02-18 Toray Industries Kinzokuhifukuyojushi soseibutsu
JPS5474678A (en) * 1977-11-28 1979-06-14 Hitachi Ltd Detection method of chip location on semiconductor wafer

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5120253A (en) * 1974-08-13 1976-02-18 Toray Industries Kinzokuhifukuyojushi soseibutsu
JPS5474678A (en) * 1977-11-28 1979-06-14 Hitachi Ltd Detection method of chip location on semiconductor wafer

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5980965A (en) * 1982-10-29 1984-05-10 Matsushita Electric Ind Co Ltd Solid-state image pickup element inspection device
JPH0522176B2 (en) * 1982-10-29 1993-03-26 Matsushita Electric Ind Co Ltd
JPS6199845A (en) * 1984-10-22 1986-05-17 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション Optical defect detector
JPS61273088A (en) * 1985-05-29 1986-12-03 Hitachi Ltd Inspection method for surface pattern
JPS63121756A (en) * 1986-10-31 1988-05-25 テクトロニックス・インコーポレイテッド Picture signal processor
JPS63124939A (en) * 1986-11-14 1988-05-28 Hitachi Ltd Pattern inspecting method
JP2003014437A (en) * 2001-06-29 2003-01-15 Shin Etsu Handotai Co Ltd Evaluation method and evaluation device of compound semiconductor wafer

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