JPS543465A - Scribing device for wafer - Google Patents

Scribing device for wafer

Info

Publication number
JPS543465A
JPS543465A JP6831477A JP6831477A JPS543465A JP S543465 A JPS543465 A JP S543465A JP 6831477 A JP6831477 A JP 6831477A JP 6831477 A JP6831477 A JP 6831477A JP S543465 A JPS543465 A JP S543465A
Authority
JP
Japan
Prior art keywords
wafer
scribing device
adjusting
mark
microcomputer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6831477A
Other languages
Japanese (ja)
Inventor
Mitsuo Sumiya
Nobuo Ochiai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP6831477A priority Critical patent/JPS543465A/en
Publication of JPS543465A publication Critical patent/JPS543465A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/042—Automatically aligning the laser beam

Abstract

PURPOSE: To perform the fine adjusting line feed and the rotation by detecting the mark near the scribe line provided to the wafer by means of the microscope plus the mark detector in which several hundreds of photo diodes are arranged and then adjusting the wafer support board by means of the microcomputer and the control circuit.
COPYRIGHT: (C)1979,JPO&Japio
JP6831477A 1977-06-09 1977-06-09 Scribing device for wafer Pending JPS543465A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6831477A JPS543465A (en) 1977-06-09 1977-06-09 Scribing device for wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6831477A JPS543465A (en) 1977-06-09 1977-06-09 Scribing device for wafer

Publications (1)

Publication Number Publication Date
JPS543465A true JPS543465A (en) 1979-01-11

Family

ID=13370222

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6831477A Pending JPS543465A (en) 1977-06-09 1977-06-09 Scribing device for wafer

Country Status (1)

Country Link
JP (1) JPS543465A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5758332A (en) * 1980-09-24 1982-04-08 Fujitsu Ltd Manufacture of semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5758332A (en) * 1980-09-24 1982-04-08 Fujitsu Ltd Manufacture of semiconductor device

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