JPS55145353A - Fabricating method of semiconductor chip - Google Patents

Fabricating method of semiconductor chip

Info

Publication number
JPS55145353A
JPS55145353A JP5237879A JP5237879A JPS55145353A JP S55145353 A JPS55145353 A JP S55145353A JP 5237879 A JP5237879 A JP 5237879A JP 5237879 A JP5237879 A JP 5237879A JP S55145353 A JPS55145353 A JP S55145353A
Authority
JP
Japan
Prior art keywords
chips
recesses
divided
wax
semiconductor chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5237879A
Other languages
Japanese (ja)
Other versions
JPS5929152B2 (en
Inventor
Kanichi Tateishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shindengen Electric Manufacturing Co Ltd
Original Assignee
Shindengen Electric Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shindengen Electric Manufacturing Co Ltd filed Critical Shindengen Electric Manufacturing Co Ltd
Priority to JP54052378A priority Critical patent/JPS5929152B2/en
Publication of JPS55145353A publication Critical patent/JPS55145353A/en
Publication of JPS5929152B2 publication Critical patent/JPS5929152B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Abstract

PURPOSE:To fully automate the fabrication of a diode chip or the like by containing and conveying divided semiconductor chips while regularly aligning the chips to eliminate the necessity of checking or realigning the aigned chips by a manual work. CONSTITUTION:A semiconductor wafer 1 to be divided into a plurality of chips is so adhered to a retainer jig 2 of transparent member having recesses 2a-2c responsive to the number of chips through wax 3 that the chip regions face oppositely the recesses 2a-2c, respectively. Then, the wafer 1 on the jig 2 is divided into independent chips 1a-1f, the wax 3 is dissolved and removed by solvent in adhered state, and the chips 1a-1f are accommodated in the recesses 2a-2c, respectively of the tool 2.
JP54052378A 1979-04-27 1979-04-27 Method of manufacturing semiconductor chips Expired JPS5929152B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP54052378A JPS5929152B2 (en) 1979-04-27 1979-04-27 Method of manufacturing semiconductor chips

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP54052378A JPS5929152B2 (en) 1979-04-27 1979-04-27 Method of manufacturing semiconductor chips

Publications (2)

Publication Number Publication Date
JPS55145353A true JPS55145353A (en) 1980-11-12
JPS5929152B2 JPS5929152B2 (en) 1984-07-18

Family

ID=12913132

Family Applications (1)

Application Number Title Priority Date Filing Date
JP54052378A Expired JPS5929152B2 (en) 1979-04-27 1979-04-27 Method of manufacturing semiconductor chips

Country Status (1)

Country Link
JP (1) JPS5929152B2 (en)

Also Published As

Publication number Publication date
JPS5929152B2 (en) 1984-07-18

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