JPS56114343A - Chip structure for automatic wafer alignment - Google Patents

Chip structure for automatic wafer alignment

Info

Publication number
JPS56114343A
JPS56114343A JP1750380A JP1750380A JPS56114343A JP S56114343 A JPS56114343 A JP S56114343A JP 1750380 A JP1750380 A JP 1750380A JP 1750380 A JP1750380 A JP 1750380A JP S56114343 A JPS56114343 A JP S56114343A
Authority
JP
Japan
Prior art keywords
wafer
regions
chip structure
automatically
wafer alignment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1750380A
Other languages
Japanese (ja)
Inventor
Junichi Inoue
Masao Kubodera
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TERUMETSUKU KK
TELMEC CO Ltd
Original Assignee
TERUMETSUKU KK
TELMEC CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TERUMETSUKU KK, TELMEC CO Ltd filed Critical TERUMETSUKU KK
Priority to JP1750380A priority Critical patent/JPS56114343A/en
Publication of JPS56114343A publication Critical patent/JPS56114343A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54453—Marks applied to semiconductor devices or parts for use prior to dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

PURPOSE:To align a wafer automatically by properly giving limited regions at the outside of a bonding pad row against individual chip structure in the wafer. CONSTITUTION:One chip in a wafer has an Al pad row 1 for test, and regions 2- 5 are semiconductor regions. Limiting conditions are given to the regions 2-5 for automatically aligning the wafer. The conditions are as follows. A specified mark is inserted, e.g. to one location of the regions 2-5 or the L-shaped regions of 2- 3 or either one of them, or the location is changed into a mirror surface or made to cause a diffused-reflection. The direction of the wafer is easily confirmed by the limitation, and the wafer is readily aligned automatically.
JP1750380A 1980-02-14 1980-02-14 Chip structure for automatic wafer alignment Pending JPS56114343A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1750380A JPS56114343A (en) 1980-02-14 1980-02-14 Chip structure for automatic wafer alignment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1750380A JPS56114343A (en) 1980-02-14 1980-02-14 Chip structure for automatic wafer alignment

Publications (1)

Publication Number Publication Date
JPS56114343A true JPS56114343A (en) 1981-09-08

Family

ID=11945781

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1750380A Pending JPS56114343A (en) 1980-02-14 1980-02-14 Chip structure for automatic wafer alignment

Country Status (1)

Country Link
JP (1) JPS56114343A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5536974A (en) * 1992-05-22 1996-07-16 Sumitomo Electric Industries, Ltd. Semiconductor device with light reflecting substrate area

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5536974A (en) * 1992-05-22 1996-07-16 Sumitomo Electric Industries, Ltd. Semiconductor device with light reflecting substrate area

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