JPS5248470A - Method of bonding semiconductor chips - Google Patents

Method of bonding semiconductor chips

Info

Publication number
JPS5248470A
JPS5248470A JP12452075A JP12452075A JPS5248470A JP S5248470 A JPS5248470 A JP S5248470A JP 12452075 A JP12452075 A JP 12452075A JP 12452075 A JP12452075 A JP 12452075A JP S5248470 A JPS5248470 A JP S5248470A
Authority
JP
Japan
Prior art keywords
semiconductor chips
bonding semiconductor
bonding
pressing
provent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12452075A
Other languages
Japanese (ja)
Inventor
Masanori Fujita
Yoshinori Suzuki
Takeshi Taguchi
Hajime Oda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seikosha KK
Original Assignee
Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seikosha KK filed Critical Seikosha KK
Priority to JP12452075A priority Critical patent/JPS5248470A/en
Publication of JPS5248470A publication Critical patent/JPS5248470A/en
Pending legal-status Critical Current

Links

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: To provent shorting between leads at the bonding of pellets by using a bonding agent which has high insulating properties when not pressed, and exhibits conductivity in the pressing direction only when set by pressing.
COPYRIGHT: (C)1977,JPO&Japio
JP12452075A 1975-10-16 1975-10-16 Method of bonding semiconductor chips Pending JPS5248470A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12452075A JPS5248470A (en) 1975-10-16 1975-10-16 Method of bonding semiconductor chips

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12452075A JPS5248470A (en) 1975-10-16 1975-10-16 Method of bonding semiconductor chips

Publications (1)

Publication Number Publication Date
JPS5248470A true JPS5248470A (en) 1977-04-18

Family

ID=14887504

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12452075A Pending JPS5248470A (en) 1975-10-16 1975-10-16 Method of bonding semiconductor chips

Country Status (1)

Country Link
JP (1) JPS5248470A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0340445A (en) * 1989-07-07 1991-02-21 Oki Electric Ind Co Ltd Mounting of integrated circuit using anisotropic conductive bonding agent

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0340445A (en) * 1989-07-07 1991-02-21 Oki Electric Ind Co Ltd Mounting of integrated circuit using anisotropic conductive bonding agent

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