JPS5756773B2 - - Google Patents

Info

Publication number
JPS5756773B2
JPS5756773B2 JP51076949A JP7694976A JPS5756773B2 JP S5756773 B2 JPS5756773 B2 JP S5756773B2 JP 51076949 A JP51076949 A JP 51076949A JP 7694976 A JP7694976 A JP 7694976A JP S5756773 B2 JPS5756773 B2 JP S5756773B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP51076949A
Other languages
Japanese (ja)
Other versions
JPS534472A (en
Inventor
Katsuhiko Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP7694976A priority Critical patent/JPS534472A/en
Publication of JPS534472A publication Critical patent/JPS534472A/en
Publication of JPS5756773B2 publication Critical patent/JPS5756773B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161Cap
    • H01L2924/1615Shape
    • H01L2924/16152Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP7694976A 1976-06-29 1976-06-29 Semiconductor package Granted JPS534472A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7694976A JPS534472A (en) 1976-06-29 1976-06-29 Semiconductor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7694976A JPS534472A (en) 1976-06-29 1976-06-29 Semiconductor package

Publications (2)

Publication Number Publication Date
JPS534472A JPS534472A (en) 1978-01-17
JPS5756773B2 true JPS5756773B2 (en) 1982-12-01

Family

ID=13620006

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7694976A Granted JPS534472A (en) 1976-06-29 1976-06-29 Semiconductor package

Country Status (1)

Country Link
JP (1) JPS534472A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018134874A1 (en) 2017-01-17 2018-07-26 新日鐵住金株式会社 Hot stamp molded body and method for producing same
WO2018134872A1 (en) 2017-01-17 2018-07-26 新日鐵住金株式会社 Steel plate for hot stamping

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5571050A (en) * 1978-11-24 1980-05-28 Hitachi Ltd Semiconductor device
JPS5884961U (en) * 1981-12-01 1983-06-09 ヤマハ株式会社 Storage and transportation equipment for heavy objects
JPS58182292A (en) * 1982-04-19 1983-10-25 松下電器産業株式会社 High density mounting method
JPH0322114Y2 (en) * 1985-09-30 1991-05-14
JP5213663B2 (en) * 2008-11-26 2013-06-19 京セラ株式会社 Electronic device mounting structure

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018134874A1 (en) 2017-01-17 2018-07-26 新日鐵住金株式会社 Hot stamp molded body and method for producing same
WO2018134872A1 (en) 2017-01-17 2018-07-26 新日鐵住金株式会社 Steel plate for hot stamping
KR20190085025A (en) 2017-01-17 2019-07-17 닛폰세이테츠 가부시키가이샤 Hot stamping steel plate
KR20190093613A (en) 2017-01-17 2019-08-09 닛폰세이테츠 가부시키가이샤 Hot Stamped Molded Body and Method of Manufacturing the Same

Also Published As

Publication number Publication date
JPS534472A (en) 1978-01-17

Similar Documents

Publication Publication Date Title
DK212977A (en)
DE2714346C3 (en)
DE2760279A1 (en)
DK138564C (en)
DK141392C (en)
DK140581C (en)
DK142676C (en)
DK138283C (en)
DE2732896C2 (en)
DE2615739C2 (en)
JPS5756773B2 (en)
DK139459C (en)
DK219377A (en)
DK141294C (en)
JPS5429435B2 (en)
JPS5712935B2 (en)
JPS5611857B2 (en)
JPS5360257U (en)
JPS52144692U (en)
DE2637745C2 (en)
DK135905C (en)
JPS577424Y2 (en)
JPS554849Y2 (en)
DK138293C (en)
JPS5312257U (en)