JPS5756773B2 - - Google Patents
Info
- Publication number
- JPS5756773B2 JPS5756773B2 JP51076949A JP7694976A JPS5756773B2 JP S5756773 B2 JPS5756773 B2 JP S5756773B2 JP 51076949 A JP51076949 A JP 51076949A JP 7694976 A JP7694976 A JP 7694976A JP S5756773 B2 JPS5756773 B2 JP S5756773B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7694976A JPS534472A (en) | 1976-06-29 | 1976-06-29 | Semiconductor package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7694976A JPS534472A (en) | 1976-06-29 | 1976-06-29 | Semiconductor package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS534472A JPS534472A (en) | 1978-01-17 |
| JPS5756773B2 true JPS5756773B2 (en) | 1982-12-01 |
Family
ID=13620006
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7694976A Granted JPS534472A (en) | 1976-06-29 | 1976-06-29 | Semiconductor package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS534472A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018134874A1 (en) | 2017-01-17 | 2018-07-26 | 新日鐵住金株式会社 | Hot stamp molded body and method for producing same |
| WO2018134872A1 (en) | 2017-01-17 | 2018-07-26 | 新日鐵住金株式会社 | Steel plate for hot stamping |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5571050A (en) * | 1978-11-24 | 1980-05-28 | Hitachi Ltd | Semiconductor device |
| JPS5884961U (en) * | 1981-12-01 | 1983-06-09 | ヤマハ株式会社 | Storage and transportation equipment for heavy objects |
| JPS58182292A (en) * | 1982-04-19 | 1983-10-25 | 松下電器産業株式会社 | High density mounting method |
| JPH0322114Y2 (en) * | 1985-09-30 | 1991-05-14 | ||
| JP5213663B2 (en) * | 2008-11-26 | 2013-06-19 | 京セラ株式会社 | Electronic device mounting structure |
-
1976
- 1976-06-29 JP JP7694976A patent/JPS534472A/en active Granted
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018134874A1 (en) | 2017-01-17 | 2018-07-26 | 新日鐵住金株式会社 | Hot stamp molded body and method for producing same |
| WO2018134872A1 (en) | 2017-01-17 | 2018-07-26 | 新日鐵住金株式会社 | Steel plate for hot stamping |
| KR20190085025A (en) | 2017-01-17 | 2019-07-17 | 닛폰세이테츠 가부시키가이샤 | Hot stamping steel plate |
| KR20190093613A (en) | 2017-01-17 | 2019-08-09 | 닛폰세이테츠 가부시키가이샤 | Hot Stamped Molded Body and Method of Manufacturing the Same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS534472A (en) | 1978-01-17 |