JPS59185852U

JPS59185852U - hybrid IC

Info

Publication number: JPS59185852U
Application number: JP7981883U
Authority: JP
Inventors: 内山　元司
Original assignee: 日本電気株式会社
Priority date: 1983-05-27
Filing date: 1983-05-27
Publication date: 1984-12-10

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Brief explanation of drawings]

第１図は従来のリードを用いた混成ＩＣをソケットへ実
装した時の断面図、第２図は本考案の実施例を示すもの
でリード接続用の電極とソケットの電極を直接接続させ
た時の断面図、第３図は本考案の他の実施例を示す本の
でソケットの電極を　　　−両面刷電極とじた時の断面
図である。尚、図において、１□・・・部品搭載に必要な基板の高
さ、１２・・・リード接続に必要な電極の高さ、１３・
・・外装の厚さく上）、１．・・・外装の厚さく下）、
１５・・・ソケットの高さ、Ｌ・・・従来型の全高さ、
Ｌ′・・・本考案実施時の全高さ、１・・・外装、２・
・・基板、３・・・リード接続用電極、４・・・リード
、５．　１５．　２５・・・ソケット外装、６，１６，
２６．２６’・・・ソケット電極、１３，２３．２３’
・・・電極である。Figure 1 is a cross-sectional view of a hybrid IC using conventional leads mounted in a socket, and Figure 2 shows an embodiment of the present invention, in which the lead connection electrode and the socket electrode are directly connected. FIG. 3 is a cross-sectional view of a book showing another embodiment of the present invention, when the socket electrode is closed to the double-sided printed electrode. In the figure, 1□... Height of the board required for mounting components, 12... Height of electrodes required for lead connection, 13.
・・Exterior thickness), 1. ...thickness of the exterior),
15... Height of socket, L... Total height of conventional type,
L'...Total height when implementing the present invention, 1...Exterior, 2.
... Substrate, 3... Lead connection electrode, 4... Lead, 5. 15. 25... socket exterior, 6, 16,
26.26'...Socket electrode, 13, 23.23'
...It is an electrode.

Claims

[Scope of utility model registration request]

A hybrid IC to be mounted in a socket, which is characterized in that the board is directly mounted on the socket without using leads, and the socket electrode and the electrode on the board can be brought into direct contact.