JPS6298260U - - Google Patents
Info
- Publication number
- JPS6298260U JPS6298260U JP19176185U JP19176185U JPS6298260U JP S6298260 U JPS6298260 U JP S6298260U JP 19176185 U JP19176185 U JP 19176185U JP 19176185 U JP19176185 U JP 19176185U JP S6298260 U JPS6298260 U JP S6298260U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- board according
- printing
- adhesive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 4
- 239000012790 adhesive layer Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Description
第１図は本考案の一実施例を示す断面図、第２
図ないし第５図は本考案のプリント配線基板を製
造する方法を説明する断面図、第６図および第７
図は従来のプリント配線基板を製造する方法を説
明する断面図である。
１……絶縁性基板、２……接着剤層、３……導
体薄板、４……電気回路、５……スルーホール、
６……導体ペースト。
Fig. 1 is a sectional view showing one embodiment of the present invention;
5 through 5 are sectional views explaining the method of manufacturing the printed wiring board of the present invention, and FIGS. 6 and 7.
The figure is a cross-sectional view illustrating a conventional method of manufacturing a printed wiring board. 1... Insulating substrate, 2... Adhesive layer, 3... Conductor thin plate, 4... Electric circuit, 5... Through hole,
6...Conductor paste.
Claims (1)
ーストにより電気回路が形成されてなることを特
徴とするプリント配線基板。 (2) 導体ペーストは、印刷により塗布される実
用新案登録請求の範囲第１項記載のプリント配線
基板。 (3) 印刷は、ロータリー印刷である実用新案登
録請求の範囲第２項記載のプリント配線基板。 (4) 導体ペーストは、塗布後、加熱、加圧によ
り接着剤層に密着される実用新案登録請求の範囲
第１項ないし第３項のいずれか１項記載のプリン
ト配線基板。[Claims for Utility Model Registration] (1) A printed wiring board characterized in that an electric circuit is formed on an insulating substrate using a conductive paste via an adhesive layer. (2) The printed wiring board according to claim 1, wherein the conductor paste is applied by printing. (3) The printed wiring board according to claim 2 of the utility model registration claim, wherein the printing is rotary printing. (4) The printed wiring board according to any one of claims 1 to 3, wherein the conductor paste is adhered to the adhesive layer by heating and pressurizing after application.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19176185U JPS6298260U (en) | 1985-12-12 | 1985-12-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19176185U JPS6298260U (en) | 1985-12-12 | 1985-12-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6298260U true JPS6298260U (en) | 1987-06-23 |
Family
ID=31146202
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19176185U Pending JPS6298260U (en) | 1985-12-12 | 1985-12-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6298260U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007300038A (en) * | 2006-05-08 | 2007-11-15 | Matsushita Electric Ind Co Ltd | Electronic component package, and its manufacturing method |
-
1985
- 1985-12-12 JP JP19176185U patent/JPS6298260U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007300038A (en) * | 2006-05-08 | 2007-11-15 | Matsushita Electric Ind Co Ltd | Electronic component package, and its manufacturing method |
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