JPH01104058U - - Google Patents
Info
- Publication number
- JPH01104058U JPH01104058U JP19803587U JP19803587U JPH01104058U JP H01104058 U JPH01104058 U JP H01104058U JP 19803587 U JP19803587 U JP 19803587U JP 19803587 U JP19803587 U JP 19803587U JP H01104058 U JPH01104058 U JP H01104058U
- Authority
- JP
- Japan
- Prior art keywords
- flexible
- circuit board
- insulating film
- flexible circuit
- wiring pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920006267 polyester film Polymers 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 239000010408 film Substances 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 1
- 239000010409 thin film Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Structure Of Printed Boards (AREA)
Description
第１図は本考案の一実施例の構成を示す斜視図
、第２図は第１図のフレキシブル回路基板に電子
部分を実装した状態を示す斜視図、第３図は第２
図の切断面線Ａ―Ａから見た断線図、第４図は従
来例を示す図である。
１……フレキシブル回路基板、２……ポリエス
テルフイルムベース（フレキシブル基板）、３…
…配線パターン、４……異方性導電接着剤、５…
…ポリエステルフイルム（絶縁性フイルム）。
FIG. 1 is a perspective view showing the configuration of an embodiment of the present invention, FIG. 2 is a perspective view showing the state in which electronic parts are mounted on the flexible circuit board of FIG. 1, and FIG.
FIG. 4, which is a cross-sectional view taken along the cross-section line AA in the figure, is a diagram showing a conventional example. 1...Flexible circuit board, 2...Polyester film base (flexible board), 3...
...Wiring pattern, 4...Anisotropic conductive adhesive, 5...
...Polyester film (insulating film).
Claims (1)
ル基板上の全面に、異方性導電接着剤が塗布され
、さらに、その上から部品実装領域に合わせて穴
開け加工された絶縁性フイルムがラミネートされ
てなるフレキシブル回路基板。 (2) 前記フレキジブル基板および前記絶縁性フ
イルムは、ポリエステルフイルムである前記実用
新案登録請求の範囲第１項に記載のフレキシブル
回路基板。[Claims for Utility Model Registration] (1) An anisotropic conductive adhesive is applied to the entire surface of a flexible substrate on which a thin film wiring pattern is formed, and then holes are drilled from above in accordance with the component mounting area. A flexible circuit board made of laminated insulating film. (2) The flexible circuit board according to claim 1, wherein the flexible board and the insulating film are polyester films.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19803587U JPH01104058U (en) | 1987-12-26 | 1987-12-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19803587U JPH01104058U (en) | 1987-12-26 | 1987-12-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01104058U true JPH01104058U (en) | 1989-07-13 |
Family
ID=31488560
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19803587U Pending JPH01104058U (en) | 1987-12-26 | 1987-12-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01104058U (en) |
-
1987
- 1987-12-26 JP JP19803587U patent/JPH01104058U/ja active Pending
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