JPH02138468U - - Google Patents
Info
- Publication number
- JPH02138468U JPH02138468U JP4842889U JP4842889U JPH02138468U JP H02138468 U JPH02138468 U JP H02138468U JP 4842889 U JP4842889 U JP 4842889U JP 4842889 U JP4842889 U JP 4842889U JP H02138468 U JPH02138468 U JP H02138468U
- Authority
- JP
- Japan
- Prior art keywords
- conductor pattern
- pattern
- conductor
- printed
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 10
- 238000010586 diagram Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Description
第１図は本考案の一実施例を示す斜視図、第２
図ａ，ｂはプリント配線板と転写用フイルムとの
関係を示す図、第３図、第４図は実施例における
プリント導体パターンを作成するための手順を示
す図、第５図は実施例における超高層プリント導
体パターンをプリント配線板に積層した状態を示
す図である。
１……プリント導体パターン、２……プリント
配線板、５……転写用フイルム、６……導電性接
着材、７……導体部、８……導体パターン、９…
…導体層。
Fig. 1 is a perspective view showing one embodiment of the present invention;
Figures a and b are diagrams showing the relationship between the printed wiring board and the transfer film, Figures 3 and 4 are diagrams showing the procedure for creating the printed conductor pattern in the example, and Figure 5 is the diagram in the example. FIG. 3 is a diagram showing a state in which a super high-rise printed conductor pattern is laminated on a printed wiring board. DESCRIPTION OF SYMBOLS 1... Printed conductor pattern, 2... Printed wiring board, 5... Transfer film, 6... Conductive adhesive, 7... Conductor portion, 8... Conductor pattern, 9...
...conductor layer.
Claims (1)
面上に、フイルム上に設けた同一形状のパターン
を転写密着、接合させ垂直方向に導体部を積層し
た所望の厚さをもつ導体パターンを有することを
特徴とするプリント導体パターン。 It is characterized by having a conductor pattern with a desired thickness, in which a pattern of the same shape formed on a film is transferred and bonded to the surface of a conductor pattern formed on a printed wiring board, and conductor portions are laminated in the vertical direction. printed conductor pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4842889U JPH02138468U (en) | 1989-04-25 | 1989-04-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4842889U JPH02138468U (en) | 1989-04-25 | 1989-04-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02138468U true JPH02138468U (en) | 1990-11-19 |
Family
ID=31565225
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4842889U Pending JPH02138468U (en) | 1989-04-25 | 1989-04-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02138468U (en) |
-
1989
- 1989-04-25 JP JP4842889U patent/JPH02138468U/ja active Pending
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