JPH0270472U - - Google Patents
Info
- Publication number
- JPH0270472U JPH0270472U JP14980988U JP14980988U JPH0270472U JP H0270472 U JPH0270472 U JP H0270472U JP 14980988 U JP14980988 U JP 14980988U JP 14980988 U JP14980988 U JP 14980988U JP H0270472 U JPH0270472 U JP H0270472U
- Authority
- JP
- Japan
- Prior art keywords
- metal plate
- hole
- holes
- plate
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structure Of Printed Boards (AREA)
Description
第１図はこの考案の一実施例を示す断面斜視図
、第２図は第１図に示したものの断面図、第３図
はヒートシンクを使用した従来のセラミツク基板
の例を示す断面図、第４図は従来の金属張りセラ
ミツク基板の例を示す断面斜視図、第５図は第４
図に示したものの断面図である。図において、１
はアルミナセラミツク板、２は回路パターン、３
はヒートシンク、４は発熱素子チツプ、５は高熱
伝導性セラミツク板、６，１２は金属板パターン
、７，１４は金属板、１０はセラミツク板、１１
は貫通孔、１３は柱状突起である。なお、図中同
一符号は同一または相当部分を示す。
Fig. 1 is a cross-sectional perspective view showing one embodiment of this invention, Fig. 2 is a cross-sectional view of the one shown in Fig. 1, Fig. 3 is a cross-sectional view showing an example of a conventional ceramic substrate using a heat sink, Figure 4 is a cross-sectional perspective view showing an example of a conventional metal-clad ceramic substrate, and Figure 5 is a perspective view of a conventional metal-clad ceramic substrate.
FIG. 3 is a cross-sectional view of what is shown in the figure. In the figure, 1
is an alumina ceramic board, 2 is a circuit pattern, 3 is
1 is a heat sink, 4 is a heating element chip, 5 is a highly thermally conductive ceramic plate, 6 and 12 are metal plate patterns, 7 and 14 are metal plates, 10 is a ceramic plate, and 11
1 is a through hole, and 13 is a columnar projection. Note that the same reference numerals in the figures indicate the same or corresponding parts.
Claims (1)
の一方の面に、前記貫通孔内に突き出る柱状突起
を有すと共に前記貫通孔を覆う形状の金属板パタ
ーンが貼り付けられ、前記セラミツク板の他方の
面に、前記貫通孔に対応する位置に穴をあけてあ
る金属板が張り付けられ、前記一方の両側の金属
板パターンから貫通孔内に突き出る前記の柱状突
起の先端面が、前記他方の面の金属板と同一平面
にある構造となつていることを特徴とする金属張
りセラミツク基板。 A metal plate pattern having a columnar protrusion protruding into the through hole and having a shape that covers the through hole is pasted on one side of a ceramic plate having a through hole provided at a predetermined position, and the other side of the ceramic plate A metal plate with holes formed at positions corresponding to the through holes is attached to the surface of the metal plate, and the tip surfaces of the columnar protrusions that protrude into the through holes from the metal plate patterns on both sides of the one side are attached to the other surface. A metal-clad ceramic substrate characterized by having a structure that is flush with a metal plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14980988U JPH0513023Y2 (en) | 1988-11-17 | 1988-11-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14980988U JPH0513023Y2 (en) | 1988-11-17 | 1988-11-17 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0270472U true JPH0270472U (en) | 1990-05-29 |
| JPH0513023Y2 JPH0513023Y2 (en) | 1993-04-06 |
Family
ID=31422379
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14980988U Expired - Lifetime JPH0513023Y2 (en) | 1988-11-17 | 1988-11-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0513023Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006128265A (en) * | 2004-10-27 | 2006-05-18 | Kyocera Corp | Wiring board for light emitting element and light emitting device |
-
1988
- 1988-11-17 JP JP14980988U patent/JPH0513023Y2/ja not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006128265A (en) * | 2004-10-27 | 2006-05-18 | Kyocera Corp | Wiring board for light emitting element and light emitting device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0513023Y2 (en) | 1993-04-06 |