JPS62197866U - - Google Patents

Info

Publication number
JPS62197866U
JPS62197866U JP8610386U JP8610386U JPS62197866U JP S62197866 U JPS62197866 U JP S62197866U JP 8610386 U JP8610386 U JP 8610386U JP 8610386 U JP8610386 U JP 8610386U JP S62197866 U JPS62197866 U JP S62197866U
Authority
JP
Japan
Prior art keywords
insulating layer
layer
conductive layer
terminal
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8610386U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8610386U priority Critical patent/JPS62197866U/ja
Publication of JPS62197866U publication Critical patent/JPS62197866U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の一実施例を示す斜視図、第２
図は断面図である。第３図は従来例の針視図であ
る。 １，２１……グランド端子、２，２２……セラ
ミツク基板、３……導体層、４……絶縁層、５，
２５……ＩＣチツプ、６，２６……ＩＣチツプグ
ランド、７，２７……端子ランド、８，２８……
ボンデイングランド、９，２９……配線導体、１
０，３０……受動素子。 Fig. 1 is a perspective view showing one embodiment of the present invention;
The figure is a sectional view. FIG. 3 is a needle perspective view of a conventional example. 1, 21... Ground terminal, 2, 22... Ceramic substrate, 3... Conductor layer, 4... Insulating layer, 5,
25...IC chip, 6,26...IC chip ground, 7,27...terminal land, 8,28...
Bonding ground, 9, 29...Wiring conductor, 1
0,30...Passive element.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 回路基板全面に一層目の導体層を設け、その導
体層上にボンデイング用窓を有する絶縁層を重ね
、絶縁層上に導体、半導体及びデイスクリートの
マウントランドを設け、回路を構成して回路上の
端子を一層目の導体層に接続したことを特徴とす
る混成集積回路装置。 A first conductive layer is provided on the entire surface of the circuit board, an insulating layer with bonding windows is placed on top of the conductive layer, mounting lands for conductors, semiconductors, and discretes are provided on the insulating layer, and a circuit is constructed. A hybrid integrated circuit device characterized in that a terminal of the above is connected to a first conductor layer.
JP8610386U 1986-06-05 1986-06-05 Pending JPS62197866U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8610386U JPS62197866U (en) 1986-06-05 1986-06-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8610386U JPS62197866U (en) 1986-06-05 1986-06-05

Publications (1)

Publication Number Publication Date
JPS62197866U true JPS62197866U (en) 1987-12-16

Family

ID=30942108

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8610386U Pending JPS62197866U (en) 1986-06-05 1986-06-05

Country Status (1)

Country Link
JP (1) JPS62197866U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0461367A (en) * 1990-06-29 1992-02-27 Sanyo Electric Co Ltd Control unit module and washing machine using same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0461367A (en) * 1990-06-29 1992-02-27 Sanyo Electric Co Ltd Control unit module and washing machine using same

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