JPS6355434U - - Google Patents

Info

Publication number
JPS6355434U
JPS6355434U JP1986146415U JP14641586U JPS6355434U JP S6355434 U JPS6355434 U JP S6355434U JP 1986146415 U JP1986146415 U JP 1986146415U JP 14641586 U JP14641586 U JP 14641586U JP S6355434 U JPS6355434 U JP S6355434U
Authority
JP
Japan
Prior art keywords
circuit element
hole
insulating layer
electrically connected
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986146415U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986146415U priority Critical patent/JPS6355434U/ja
Publication of JPS6355434U publication Critical patent/JPS6355434U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05556—Shape in side view
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の一実施例の断面図、第２図は
同全体を模式的に示す平面図である。 １…パツド、２…スルーホール、３…回路素子
、４…保護膜、５…シリコンチツプ、６…回路素
子部、７…配線パターン。 FIG. 1 is a cross-sectional view of an embodiment of the present invention, and FIG. 2 is a plan view schematically showing the whole. DESCRIPTION OF SYMBOLS 1... Pad, 2... Through hole, 3... Circuit element, 4... Protective film, 5... Silicon chip, 6... Circuit element part, 7... Wiring pattern.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体回路素子の上に形成された絶縁層上にス
ルーホールを介して導通する外部リード取り出し
用パツドを具備したことを特徴とする半導体装置
。 1. A semiconductor device comprising an external lead extraction pad that is electrically connected via a through hole on an insulating layer formed on a semiconductor circuit element.
JP1986146415U 1986-09-26 1986-09-26 Pending JPS6355434U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986146415U JPS6355434U (en) 1986-09-26 1986-09-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986146415U JPS6355434U (en) 1986-09-26 1986-09-26

Publications (1)

Publication Number Publication Date
JPS6355434U true JPS6355434U (en) 1988-04-13

Family

ID=31058862

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986146415U Pending JPS6355434U (en) 1986-09-26 1986-09-26

Country Status (1)

Country Link
JP (1) JPS6355434U (en)

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