JPH0371652U - - Google Patents

Info

Publication number
JPH0371652U
JPH0371652U JP13320789U JP13320789U JPH0371652U JP H0371652 U JPH0371652 U JP H0371652U JP 13320789 U JP13320789 U JP 13320789U JP 13320789 U JP13320789 U JP 13320789U JP H0371652 U JPH0371652 U JP H0371652U
Authority
JP
Japan
Prior art keywords
frame
lead
lead part
external lead
internal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13320789U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP13320789U priority Critical patent/JPH0371652U/ja
Publication of JPH0371652U publication Critical patent/JPH0371652U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図a,b及び第2図a,bは本考案の第1
及び第2の実施例の平面図及び断面図、第3図a
,bは従来例の平面図及び断面図である。 1……アイランド、2……釣りピン、3……ス
テツチ部、4……内部リード部、5……外部リー
ド部、6……開孔部、7……金属片、8……IC
チツプ、10……フレーム。
Figure 1 a, b and Figure 2 a, b are the first diagrams of the present invention.
and a plan view and a sectional view of the second embodiment, FIG. 3a
, b are a plan view and a sectional view of a conventional example. DESCRIPTION OF SYMBOLS 1... Island, 2... Fishing pin, 3... Stitch part, 4... Inner lead part, 5... Outer lead part, 6... Opening part, 7... Metal piece, 8... IC
Chip, 10...frame.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 釣りピンによりフレームに接続されかつフレー
ム面より下方に形成されたアイランドと、前記フ
レームに連結された複数の外部リード部と、この
外部リード部の先端に一体的に形成された内部リ
ード部とを有する半導体集積回路用リードフレー
ムにおいて、前記内部リード部は前記フレーム面
より下方にL字形に形成されていることを特徴と
する半導体集積回路用リードフレーム。
An island connected to the frame by a fishing pin and formed below the frame surface, a plurality of external lead parts connected to the frame, and an internal lead part integrally formed at the tip of the external lead part. 1. A lead frame for a semiconductor integrated circuit, wherein the internal lead portion is formed in an L-shape below the frame surface.
JP13320789U 1989-11-15 1989-11-15 Pending JPH0371652U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13320789U JPH0371652U (en) 1989-11-15 1989-11-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13320789U JPH0371652U (en) 1989-11-15 1989-11-15

Publications (1)

Publication Number Publication Date
JPH0371652U true JPH0371652U (en) 1991-07-19

Family

ID=31680619

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13320789U Pending JPH0371652U (en) 1989-11-15 1989-11-15

Country Status (1)

Country Link
JP (1) JPH0371652U (en)

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