JPS6420747U - - Google Patents
Info
- Publication number
- JPS6420747U JPS6420747U JP1987115425U JP11542587U JPS6420747U JP S6420747 U JPS6420747 U JP S6420747U JP 1987115425 U JP1987115425 U JP 1987115425U JP 11542587 U JP11542587 U JP 11542587U JP S6420747 U JPS6420747 U JP S6420747U
- Authority
- JP
- Japan
- Prior art keywords
- island
- leads
- lead frame
- branched
- region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05553—Shape in top view being rectangular
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
- H01L2224/0601—Structure
- H01L2224/0603—Bonding areas having different sizes, e.g. different heights or widths
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第1図は本考案の一実施例とアイランドに載置
されたICチツプの平面模式図、第2図は第1図
の実施例を組立たICの効果を説明するための等
価回路図、第3図は従来のリードフレームの一例
とアイランドに載置されたICチツプの平面模式
図、第4図は第3図の実施例を組立たICの問題
点を説明するための等価回路図である。
2……アイランド、L……外部ピン、lp……
電流パルス用内部リード、ls……小信号用内部
リード。
FIG. 1 is a schematic plan view of an embodiment of the present invention and an IC chip mounted on an island, FIG. 2 is an equivalent circuit diagram for explaining the effect of an IC assembled from the embodiment of FIG. 1, and FIG. Fig. 3 is a schematic plan view of an example of a conventional lead frame and an IC chip mounted on an island, and Fig. 4 is an equivalent circuit diagram for explaining the problems of the IC assembled using the embodiment shown in Fig. 3. . 2...Island, L...External pin, lp...
Internal lead for current pulse, ls...Internal lead for small signal.
Claims (1)
金属帯板に連続して設けたリードフレームにおい
て、少なくとも1つの前記リードの前記アイラン
ド側が分岐されていることを特徴とするリードフ
レーム。 1. A lead frame in which a region in which a plurality of leads surround an island is continuously provided on a metal band plate, wherein at least one of the leads is branched on the island side.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987115425U JPS6420747U (en) | 1987-07-27 | 1987-07-27 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987115425U JPS6420747U (en) | 1987-07-27 | 1987-07-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6420747U true JPS6420747U (en) | 1989-02-01 |
Family
ID=31357069
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987115425U Pending JPS6420747U (en) | 1987-07-27 | 1987-07-27 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6420747U (en) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5571030A (en) * | 1978-11-24 | 1980-05-28 | Hitachi Ltd | Mounting system for semiconductor device |
JPS5878448A (en) * | 1982-10-18 | 1983-05-12 | Hitachi Ltd | Package for integrated circuit |
JPS6119151A (en) * | 1984-07-05 | 1986-01-28 | Nec Corp | Semiconductor device |
JPS6211256A (en) * | 1985-07-09 | 1987-01-20 | Fujitsu Ltd | Semiconductor integrated circuit device |
JPS6214748B2 (en) * | 1984-02-08 | 1987-04-03 | Hitachi Ltd |
-
1987
- 1987-07-27 JP JP1987115425U patent/JPS6420747U/ja active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5571030A (en) * | 1978-11-24 | 1980-05-28 | Hitachi Ltd | Mounting system for semiconductor device |
JPS5878448A (en) * | 1982-10-18 | 1983-05-12 | Hitachi Ltd | Package for integrated circuit |
JPS6214748B2 (en) * | 1984-02-08 | 1987-04-03 | Hitachi Ltd | |
JPS6119151A (en) * | 1984-07-05 | 1986-01-28 | Nec Corp | Semiconductor device |
JPS6211256A (en) * | 1985-07-09 | 1987-01-20 | Fujitsu Ltd | Semiconductor integrated circuit device |
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