JPH0158959U - - Google Patents
Info
- Publication number
- JPH0158959U JPH0158959U JP15340387U JP15340387U JPH0158959U JP H0158959 U JPH0158959 U JP H0158959U JP 15340387 U JP15340387 U JP 15340387U JP 15340387 U JP15340387 U JP 15340387U JP H0158959 U JPH0158959 U JP H0158959U
- Authority
- JP
- Japan
- Prior art keywords
- island
- chip
- lead frame
- lead
- region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 description 3
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図ａ及びｂは本考案の第１の実施例の平面
図及びそのアイランドにＩＣチツプを載置してボ
ンデイングした半導体装置に対応するＡ―Ａ′線
断面図、第２図ａ及びｂは本考案の第２の実施例
の平面図及びそのアイランドにＩＣチツプを載置
してボンデイングした半導体装置に対応するＡ―
Ａ′線断面図、第３図は従来のリードフレームの
一例のアイランドにＩＣチツプを載置してボンデ
イングした半導体装置に対応するＡ―Ａ′線断面
図である。
１……ＩＣチツプ、２及び２ａ……アイランド
、Ｄ……リード板厚、ｄ……アイランド板厚、ｌ
１……リード。
Figures 1a and b are a plan view of the first embodiment of the present invention, a sectional view taken along the line A-A' corresponding to a semiconductor device in which an IC chip is mounted and bonded on the island, and Figures 2a and b is a plan view of the second embodiment of the present invention, and A--corresponding to a semiconductor device in which an IC chip is mounted and bonded on the island.
FIG. 3 is a cross-sectional view taken along line A--A' corresponding to a semiconductor device in which an IC chip is placed and bonded on an island of an example of a conventional lead frame. 1...IC chip, 2 and 2 a ...Island, D...Lead plate thickness, d...Island plate thickness, l
1 ...Lead.
Claims (1)
ンドを囲んで配置された複数のリードとを含むリ
ードフレームにおいて、前記アイランドの前記Ｉ
Ｃチツプを載置する領域の板厚が前記リードの板
厚よりも薄いことを特徴とするリードフレーム。 In a lead frame including an island on which an IC chip is mounted and a plurality of leads arranged surrounding the island, the I of the island
A lead frame characterized in that a region on which a C chip is placed has a thickness thinner than the lead.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15340387U JPH0158959U (en) | 1987-10-06 | 1987-10-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15340387U JPH0158959U (en) | 1987-10-06 | 1987-10-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0158959U true JPH0158959U (en) | 1989-04-13 |
Family
ID=31429210
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15340387U Pending JPH0158959U (en) | 1987-10-06 | 1987-10-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0158959U (en) |
-
1987
- 1987-10-06 JP JP15340387U patent/JPH0158959U/ja active Pending