JPS63134553U - - Google Patents
Info
- Publication number
- JPS63134553U JPS63134553U JP2698187U JP2698187U JPS63134553U JP S63134553 U JPS63134553 U JP S63134553U JP 2698187 U JP2698187 U JP 2698187U JP 2698187 U JP2698187 U JP 2698187U JP S63134553 U JPS63134553 U JP S63134553U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- semiconductor element
- semiconductor device
- electrode
- tab
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 9
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案に係る半導体装置を示す平面図
、第２図ａおよびｂは同じく半導体装置の組立方
法を説明するための平面図と側面図、第３図は従
来の半導体装置を示す平面図、第４図ａおよびｂ
はその組立方法を説明するための平面図と側面図
である。
１……タブ、２……半導体素子、３……電極、
５……ワイヤ、１１……リード、１１ａ……内部
リード、１１ｂ……外部リード。
FIG. 1 is a plan view showing a semiconductor device according to the present invention, FIGS. 2 a and b are a plan view and side view for explaining the method of assembling the semiconductor device, and FIG. 3 is a plan view showing a conventional semiconductor device. Figure 4a and b
FIG. 2 is a plan view and a side view for explaining the assembly method. 1...Tab, 2...Semiconductor element, 3...Electrode,
5... Wire, 11... Lead, 11a... Internal lead, 11b... External lead.
Claims (1)
状のタブと、このタブ上の半導体素子にワイヤに
よつて接続され内部リードおよび外部リードから
なるリードとを備え、このリードを前記外部リー
ドが前記半導体素子の電極側に突出する位置に位
置付けたことを特徴とする半導体装置。 A strip-shaped tab on which the electrode of the semiconductor element is located on the short side thereof, and a lead connected to the semiconductor element on this tab by a wire and consisting of an internal lead and an external lead, and this lead is connected to the external lead. A semiconductor device characterized in that the semiconductor device is located at a position protruding toward an electrode side of the semiconductor element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2698187U JPS63134553U (en) | 1987-02-25 | 1987-02-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2698187U JPS63134553U (en) | 1987-02-25 | 1987-02-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63134553U true JPS63134553U (en) | 1988-09-02 |
Family
ID=30828587
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2698187U Pending JPS63134553U (en) | 1987-02-25 | 1987-02-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63134553U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62122253A (en) * | 1985-11-22 | 1987-06-03 | Hitachi Ltd | Semiconductor device |
-
1987
- 1987-02-25 JP JP2698187U patent/JPS63134553U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62122253A (en) * | 1985-11-22 | 1987-06-03 | Hitachi Ltd | Semiconductor device |