JPH02133384U - - Google Patents
Info
- Publication number
- JPH02133384U JPH02133384U JP4248189U JP4248189U JPH02133384U JP H02133384 U JPH02133384 U JP H02133384U JP 4248189 U JP4248189 U JP 4248189U JP 4248189 U JP4248189 U JP 4248189U JP H02133384 U JPH02133384 U JP H02133384U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- module
- chip
- contact surface
- outer periphery
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 5
- 239000012778 molding material Substances 0.000 claims 1
Landscapes
- Credit Cards Or The Like (AREA)
Description
第１図は本考案の一実施例を示すモジユール基
板の平面図、第２図は第１図−線断面図、第
３図は本考案の他の実施例を示すモジユール基板
の平面図で、第４図は従来のモジユール基板の１
例を示す平面図、第５図は第４図の−線断面
図である。
１，１１……コンタクト基板、２……ＩＣチツ
プ、３，１３……ダム基板、４，１４……モール
ド材、Ｃ１〜Ｃ８……外部端子、Ｃ１１〜Ｃ１８
……コンタクト面。
FIG. 1 is a plan view of a module board showing one embodiment of the present invention, FIG. 2 is a sectional view taken along the line of FIG. 1, and FIG. 3 is a plan view of a module board showing another embodiment of the present invention. Figure 4 shows one of the conventional module boards.
FIG. 5 is a plan view showing an example, and FIG. 5 is a sectional view taken along the - line in FIG. 4. 1, 11... Contact board, 2... IC chip, 3, 13... Dam board, 4, 14... Mold material, C1-C8... External terminal, C11-C18
...Contact surface.
Claims (1)
えた外部端子を配設し裏面にＩＣチツプを備えた
コンタクト基板と、前記ＩＣチツプを封止したモ
ールド材を包囲したダム基板とを重ね合わせたモ
ジユール基板で構成された１チツプＩＣカード用
モジユールにおいて、モジユール基板の外周を前
記コンタクト面の位置の外周に沿つた形状寸法と
ほぼ同一にし、前記ダム基板を前記コンタクト面
を覆う如き形状としたことを特徴とするＩＣカー
ド用モジユール。 A module in which a contact substrate with an external terminal having a contact surface in accordance with ISO standards on the front side and an IC chip on the back side and a dam substrate surrounding a molding material that encapsulates the IC chip are stacked together. In a module for a one-chip IC card constituted by a substrate, the outer periphery of the module substrate is made almost the same as the shape and dimensions along the outer periphery of the position of the contact surface, and the dam substrate is shaped so as to cover the contact surface. Features of IC card module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4248189U JPH02133384U (en) | 1989-04-13 | 1989-04-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4248189U JPH02133384U (en) | 1989-04-13 | 1989-04-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02133384U true JPH02133384U (en) | 1990-11-06 |
Family
ID=31554065
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4248189U Pending JPH02133384U (en) | 1989-04-13 | 1989-04-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02133384U (en) |
-
1989
- 1989-04-13 JP JP4248189U patent/JPH02133384U/ja active Pending
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