JPS62144674U - - Google Patents
Info
- Publication number
- JPS62144674U JPS62144674U JP3185986U JP3185986U JPS62144674U JP S62144674 U JPS62144674 U JP S62144674U JP 3185986 U JP3185986 U JP 3185986U JP 3185986 U JP3185986 U JP 3185986U JP S62144674 U JPS62144674 U JP S62144674U
- Authority
- JP
- Japan
- Prior art keywords
- module
- substrate
- recess
- card
- resin layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims 3
- 238000000465 moulding Methods 0.000 claims 1
Landscapes
- Credit Cards Or The Like (AREA)
Description
第１図は、本考案の一実施例を示す断面図、第
２図は一般的なＩＣカードの分解斜視図、第３図
および第４は従来のＩＣカード用モジユールを模
式的に示す断面図である。
Ａ……ＩＣモジユール、１……基板、１ａ……
凹陥部、１ｂ……座ぐり部、６……モールド樹脂
層。
FIG. 1 is a sectional view showing an embodiment of the present invention, FIG. 2 is an exploded perspective view of a general IC card, and FIGS. 3 and 4 are sectional views schematically showing a conventional IC card module. It is. A...IC module, 1... Board, 1a...
Recessed portion, 1b...Spotted portion, 6...Mold resin layer.
補正 昭６１．５．２６
図面の簡単な説明を次のように補正する。
明細書第７頁第５行目の「第４は」を「第４図
は」と訂正する。Amendment May 26, 1980 The brief description of the drawing is amended as follows. "4th wa" in the 5th line of page 7 of the specification is corrected to "Fig. 4 wa".
Claims (1)
ツプを搭載したＩＣカード用ＩＣモジユールにお
いて、該基板のモールド樹脂層を形成した側と反
対側に凹部を形成し、該凹部にモールド樹脂を充
填したことを特徴とするＩＣカード用ＩＣモジユ
ール。 (2) 基板に形成した凹部に貫通孔を設けたこと
を特徴とする実用新案登録請求の範囲(1)記載の
ＩＣカード用ＩＣモジユール。[Claims for Utility Model Registration] (1) In an IC module for an IC card in which an IC chip is mounted on a substrate on which a lead pattern is formed, a recess is formed on the side opposite to the side on which the molded resin layer is formed on the substrate, An IC module for an IC card, characterized in that the recess is filled with molding resin. (2) The IC module for an IC card according to claim (1), characterized in that a through hole is provided in a recess formed in the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3185986U JPS62144674U (en) | 1986-03-07 | 1986-03-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3185986U JPS62144674U (en) | 1986-03-07 | 1986-03-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62144674U true JPS62144674U (en) | 1987-09-11 |
Family
ID=30837981
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3185986U Pending JPS62144674U (en) | 1986-03-07 | 1986-03-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62144674U (en) |
-
1986
- 1986-03-07 JP JP3185986U patent/JPS62144674U/ja active Pending