JPS583068U - printed wiring board - Google Patents

printed wiring board

Info

Publication number
JPS583068U
JPS583068U JP9758981U JP9758981U JPS583068U JP S583068 U JPS583068 U JP S583068U JP 9758981 U JP9758981 U JP 9758981U JP 9758981 U JP9758981 U JP 9758981U JP S583068 U JPS583068 U JP S583068U
Authority
JP
Japan
Prior art keywords
printed wiring
wiring board
print
adhesive application
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9758981U
Other languages
Japanese (ja)
Inventor
溝口 清
Original Assignee
シャープ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by シャープ株式会社 filed Critical シャープ株式会社
Priority to JP9758981U priority Critical patent/JPS583068U/en
Publication of JPS583068U publication Critical patent/JPS583068U/en
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の1実施例のプリント配線基板の要部平
面図、第2図は同実施例のプリント配線基板にチップ状
部品を取付けたときの断面図であ1・・・基板、2・・
・導体箔、3・・・半田付箇所、4・・・接着剤塗付箇
所、5・・・ソルダーレジストインキS6・・・接着剤
、7・・・チップ状部品、訃・・半田。
Fig. 1 is a plan view of essential parts of a printed wiring board according to an embodiment of the present invention, and Fig. 2 is a cross-sectional view of a printed wiring board of the same embodiment with chip-like components attached. 2...
- Conductor foil, 3... Soldering location, 4... Adhesive application location, 5... Solder resist ink S6... Adhesive, 7... Chip-shaped parts, End... Solder.

Claims (1)

【実用新案登録請求の範囲】 絶縁基板上に導体箔をプリント配線してなるプリント配
線基板において、チップ状部品の仮固定用の接着剤塗付
箇所及び他9半田付箇所を除いてソルダレジストインキ
を印、刷し、このソルダーレ。 シスト印刷によって接着剤塗布箇所を表示するようにし
たことを特徴とするプリント配線基板。
[Scope of Utility Model Registration Claim] In a printed wiring board formed by printed wiring of conductor foil on an insulating substrate, solder resist ink is not applied except for the adhesive application area for temporary fixing of chip-shaped parts and 9 other soldering areas. Print, print, and soldere. A printed wiring board characterized in that adhesive application locations are displayed by cyst printing.
JP9758981U 1981-06-29 1981-06-29 printed wiring board Pending JPS583068U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9758981U JPS583068U (en) 1981-06-29 1981-06-29 printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9758981U JPS583068U (en) 1981-06-29 1981-06-29 printed wiring board

Publications (1)

Publication Number Publication Date
JPS583068U true JPS583068U (en) 1983-01-10

Family

ID=29892387

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9758981U Pending JPS583068U (en) 1981-06-29 1981-06-29 printed wiring board

Country Status (1)

Country Link
JP (1) JPS583068U (en)

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