JPS6120093U - electronic equipment chassis - Google Patents

electronic equipment chassis

Info

Publication number
JPS6120093U
JPS6120093U JP10347284U JP10347284U JPS6120093U JP S6120093 U JPS6120093 U JP S6120093U JP 10347284 U JP10347284 U JP 10347284U JP 10347284 U JP10347284 U JP 10347284U JP S6120093 U JPS6120093 U JP S6120093U
Authority
JP
Japan
Prior art keywords
electronic equipment
equipment chassis
chassis
insulating film
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10347284U
Other languages
Japanese (ja)
Inventor
茂 柴崎
Original Assignee
パイオニア株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by パイオニア株式会社 filed Critical パイオニア株式会社
Priority to JP10347284U priority Critical patent/JPS6120093U/en
Publication of JPS6120093U publication Critical patent/JPS6120093U/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の一実施例を示す図、第2図は第1図の
シャーシの作成手順を示す図である。 1・・・・・・シャーシ、2・・・・・・絶縁被膜、3
・・・・・・回路パターン、4・・・・・・絶縁被膜。
FIG. 1 is a diagram showing an embodiment of the present invention, and FIG. 2 is a diagram showing a procedure for creating the chassis of FIG. 1. 1... Chassis, 2... Insulating coating, 3
...Circuit pattern, 4...Insulating coating.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 電子機器の筐体等を構成するシャーシの表面に絶縁被膜
を形成し、前記絶縁被膜の表面に銅箔よりなるプリント
パターンを形成し、前記プリントパターンの所望の位置
に電子部品を配置することによって回路基板となすこと
を特徴とする電子機器のシャーシ。
By forming an insulating film on the surface of a chassis that constitutes the housing of an electronic device, forming a printed pattern made of copper foil on the surface of the insulating film, and arranging electronic components at desired positions on the printed pattern. An electronic device chassis characterized by being made of a circuit board.
JP10347284U 1984-07-09 1984-07-09 electronic equipment chassis Pending JPS6120093U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10347284U JPS6120093U (en) 1984-07-09 1984-07-09 electronic equipment chassis

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10347284U JPS6120093U (en) 1984-07-09 1984-07-09 electronic equipment chassis

Publications (1)

Publication Number Publication Date
JPS6120093U true JPS6120093U (en) 1986-02-05

Family

ID=30662865

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10347284U Pending JPS6120093U (en) 1984-07-09 1984-07-09 electronic equipment chassis

Country Status (1)

Country Link
JP (1) JPS6120093U (en)

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