JPS598290Y2 - Terminal mounting structure - Google Patents

Description

[Detailed description of the invention] This invention provides a method for attaching external connection terminals to the insulating substrate of a printed wiring board with metal foil pasted on the surface.
The present invention relates to a terminal mounting structure that prevents electrical continuity between the connecting terminal and the metal foil from becoming unstable due to the influence of heat or the like during soldering to the connecting terminal.

The conventional mounting structure of this type of terminal is shown in FIG. A round hole 3 for attaching a terminal and a notch 4 for positioning the terminal are provided, each of which reaches its periphery.

The external connection terminal 5 is provided with a caulking stud portion 6 and a positioning protrusion 7, and FIG. 2A shows a state in which the terminal 5 is attached to the substrate 1.

That is, the caulking rivet part 6 of the terminal 5 is inserted into the round hole 3 of the substrate 1 from the metal foil 2 side, and the tip of the rivet protruding from the back side of the substrate 1 is caulked to fix the terminal 5 to the substrate 1. The structure was such that the protrusion 7 of the terminal 5 was fitted into the notch 4 of the terminal 5 to determine its position.

In this case, the protrusion 7 of the terminal 5 is for determining the orientation of the terminal 5 with respect to the board 1, and the electrical continuity between the metal foil 2 on the board 1 and the terminal 5 is established by the surface of the riveting rivet part 6 by the riveting mechanism. It was only crimped.

Therefore, it is necessary to pay special attention to the crimp shape and crimp mechanism of the terminal 5, and when the lead wire 9 is soldered to the lead wire attachment hole 8 of the terminal 5 as shown in FIG. 5 and the metal foil 2 to reach the insulating substrate 1, there was a problem that the insulating substrate 1 (generally made of resin) would thermally shrink due to the heat.

Generally, this thermal shrinkage is small and does not pose a problem in many cases, but when soldering takes a long time or when electronic components that use this terminal mounting structure are used in high temperature conditions, it is necessary to 1, especially in the thickness direction, the crimp force due to caulking weakens, and in extreme cases, the terminal 5
The electrical continuity between the metal foil 2 and the metal foil 2 sometimes became unstable.

The present invention proposes a structure to solve such conventional problems, and the structure will be explained below.

Figures 4 and 5 A, C, and C show an embodiment of the present invention.

Parts with the same functions as above are given the same symbols, and the different points are explained below.The extension part 2' of the metal foil 2 extends to the position of the notch 4 for terminal positioning provided in the insulating substrate 1.
In addition to extending the insulating substrate 1 and the metal foil 2, a cut is made with the same dimension.

Furthermore, the width l1 of this notch is set to be slightly smaller than the width l2 of the base of the positioning protrusion 7' of the terminal 5, and the riveting stud part 6 of the terminal 5 is passed through the round hole 3 of the board 1 and crimped. At this time, the positioning protrusion 7' of the terminal 5 is press-fitted into the metal foil 2 and the notch 4 of the insulating substrate 1.

The shape of the positioning protrusion 7' of the terminal 5 is such that its tip end is slightly smaller than the width l1 of the notch 4 of the board 1 so that it can be easily press-fitted into the notch 4 of the board 1.

Further, the notch 4 may be replaced with a hole.

Since the present invention is constructed as described above, as shown in FIG. 3, the insulating substrate 1 is thermally contracted in the board thickness direction due to the heat generated during soldering to the terminal 5, and the force-sealing rivet of the terminal 5 is Even if the crimping force of the portion 6 weakens, the base of the positioning protrusion 7' is firmly press-fitted into the notch 4 (or hole) of the insulating substrate 1 where the metal foil 2 reaches its edge, and the metal foil 2 Since there is almost no dimensional change due to heat, the contact will not become unstable.

In addition, when adopting this structure, the number of parts used does not change at all, and the assembly equipment requires almost no changes, so it is easy to implement and has extremely large practical effects.

[Brief explanation of the drawing]

Fig. 1 is an enlarged exploded perspective view showing a conventional terminal mounting structure;
Figure 3 is a front sectional view of the main part showing the soldered state of the lead wire,
Fig. 4 is an enlarged exploded perspective view showing one embodiment of the terminal mounting structure according to the present invention, and Fig. 5 A, C, and C are a front sectional view, a side view of the main part, and an exploded side view of the main part. be. 1...Insulating substrate, 2...Metal foil, 4...
...notch (hole), 5 ... connection terminal,
6... Caulking stud part, 7'... Positioning protrusion.

Claims (1)

[Scope of utility model registration request] In a terminal mounting structure in which a connecting terminal is attached to an insulating substrate having a metal foil pasted on its surface, the connecting terminal is crimped to the surface of the metal foil using a riveting rivet, and the connecting terminal is integrally formed with the connecting terminal. The terminal mounting structure has a structure in which the positioning protrusion is fixed by being press-fitted into a notch or hole formed in the insulating substrate with the metal foil reaching its edge.