JP3220841B2 - PCB mounting structure for electronic components with lead wires - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting structure for mounting an electronic component with lead wires on a flexible substrate by press-contact means.

[0002]

2. Description of the Related Art Soldering cannot be performed on a flexible substrate in which a circuit pattern made of a conductive paste is printed on a synthetic resin sheet.

For this reason, as one of the powerful connecting means for mounting a light emitting element with a lead wire on a flexible substrate, a lead wire of the light emitting element is placed on a land portion provided in a circuit pattern of the flexible substrate. There has been one in which a lead wire and a flexible substrate are press-connected by a predetermined press-contact means.

FIG. 5 is a side sectional view showing a conventional example. As shown in FIG. 1, this conventional example includes a flexible substrate 80, a light emitting element 90 with leads, a transparent case 95, and a support plate 100.

Here, the flexible substrate 80 has a through hole 81 at the center thereof, land portions 85, 85 formed on both lower surfaces of the through hole 81, and circuit patterns 83, 83 formed in the land portions 85, 85. Connected and configured. Further, the light emitting device 90 with leads is configured by drawing out leads 93, 93 from both sides of a molded light emitting device main body 91. The support plate 100 has rubber elastic members 103, 103 in two concave portions 101, 101 provided on the upper surface thereof.
And through holes 105, 105 are provided on both sides thereof.

Then, the lead wires 93, 93 of the light emitting element 90 with lead wires are previously inserted into the through holes 105, 10 of the support plate 100.
5 and bends the front end thereof on the back surface of the support plate 100.
00 is disposed on the lower side of the flexible substrate 80, and a transparent case 95 is placed on the lower surface of the flexible substrate 80. Each member is integrated by heat caulking the tip under the support plate 100.

As a result, the lead wires 93 of the light emitting element 90 with leads are resiliently provided by the elastic members 103, 103, and the land portions 85, 8 of the flexible substrate 80 are provided.
5 and a reliable electrical connection between them is achieved.

[0008]

However, in the above-mentioned conventional example, the number of parts is large and the assembling work is complicated, so that the cost cannot be reduced, and the support plate 100 and the elastic Members 103 and 10
However, there is a problem that the thickness is increased because 3 is attached.

SUMMARY OF THE INVENTION The present invention has been made in view of the above points, and has as its object to reduce the number of parts, facilitate assembly work, reduce costs, and further reduce the thickness of the electronic device with lead wires. An object of the present invention is to provide a board mounting structure for components.

[0010]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention comprises an electronic component with lead wires extending from both sides of a functional portion main body, and a flexible substrate provided with a circuit pattern on the surface. And a lead wire having a structure in which the electronic component with the lead wire is mounted on the flexible substrate, and both lead wires of the electronic component with the lead wire are pressed into contact with a land portion provided in a circuit pattern on the surface of the flexible substrate. In a substrate mounting structure for an electronic component with a chip, a predetermined portion near a land portion of the flexible substrate is cut out to form a resilient piece, and a case is placed on the electronic component with a lead wire placed on the flexible substrate. , in a state where the folding said bullet Hatsuhen on the back side of the land portion, before
Hold the lead wire between the case and the flexible board
Thus, the lead wire and the land portion were elastically connected.

[0011]

Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1 is an exploded perspective view showing one embodiment of the present invention. As shown in the figure, the present embodiment has a light emitting device 10 with a lead wire, a case 20,
A flexible substrate 40 is provided. Hereinafter, each component will be described.

The light emitting device 10 with leads is constructed by drawing out lead wires 13 from both sides of a light emitting device body 11 in which a light emitting diode is molded. Both ends of the lead wires 13 made of a metal wire are bent upward.

The case 20 is formed by molding a transparent synthetic resin. A rectangular projection 23 is provided at the center of a flat plate 21 and a concave portion 2 is formed on the back surface of the projection 23.
5 are formed, projections 27 are provided near four corners on the lower surface of the plate 21, and a concave groove 29 is provided at the center of both sides of the plate 21 facing each other in the longitudinal direction.

Next, a flexible substrate 40 made of a synthetic resin sheet is provided with a rectangular through hole 41 at a predetermined position for inserting the light emitting element body 11 of the light emitting element 10 with a lead wire. Each land part 4
3, 43 are formed. The lands 43, 43 and the circuit patterns 45, 45 are formed by screen printing silver paste.

Further, on both outer sides of the land portions 43, resilient pieces 47, 47 whose periphery is cut out in a substantially tongue shape are provided. Each of the resilient pieces 47, 47 has a bent portion 49,
It is connected to the flexible substrate 40 by 49.

Further, both sides of both land portions 43, 43,
Two holes 51, 53 are provided inside each of the projectile pieces 47, 47, respectively. These holes 51 and 53 are
When the resilient piece 47 is bent toward the back side of the flexible substrate 40 with the bent portion 49 as a boundary, the holes 51 and 53 are provided so that the positions of the holes 51 and 53 coincide with each other.

To assemble these components, first, the light emitting element 10 with the lead wire is mounted on the flexible substrate 40.
And the case 20 is put on it at the same time.

As a result, the lower portion of the light emitting element body 11 of the light emitting element 10 with leads is inserted into the through hole 41, and both the leads 13 are mounted on the lands 43.

The upper portion of the light emitting element body 11 is inserted into the concave portion 25 of the case 20, and the four projections 27 are inserted into the holes 51 of the flexible substrate 40 respectively.

The portions of the lead wires 13, 13 bent upward from both ends are inserted into the concave grooves 29 of the case 20 and positioned.

Next, the two projecting pieces 47, 47 of the flexible substrate 40 are bent to the back side with the bent portions 49, 49 as fulcrums, and are positioned below the land portions 43, 43. The four protrusions 27 of 20 are respectively inserted, and the tips thereof are heat caulked.

FIG. 2 is a side sectional view of the substrate mounting structure of the electronic component with lead wires thus configured.

As shown in FIG. 2, in this embodiment, both ends of the projections 27 of the case 20 are thermally caulked, so that both the leads 13 and
13 is sandwiched between the case 20 and the flexible substrate 40, and the lead wires 13 are pressed into contact with the lands 43 of the flexible substrate 40.

At this time, each projection 27 is connected to the land portions 43, 43.
The elastic pieces 47, 47 folded back on the back side of the flexible board 40 are also fixed, so that the elastic returning force of the elastic pieces 47, 47 to return to the original state is reduced.
The elastic force is such that the portion provided with 43 is pushed upward.

That is, unlike the conventional example shown in FIG.
3, 43 can be elastically contacted with both lead wires 13, 13 with an appropriate elasticity.

FIG. 3 is a side sectional view showing another embodiment of the present invention. This embodiment is different from the embodiment shown in FIGS. 1 and 2 in that the resilient pieces 47-2, 47-2 which are folded back on the back side of the lands 43, are further provided.
It is a point folded twice.

FIG. 4 is a perspective view showing the main part of the resilient piece 47-2. As shown in FIG.
Is formed by connecting a first elastic piece 47-2a and a second elastic piece 47-2b having the same shape as the elastic piece 47 shown in FIG.

First, the portion of the first projecting piece 47-2a is turned back to the back side of the land portion 43, and then the second projecting piece 47-2a is
-2b is folded back to the back side of the first projecting piece 47-2a. At this time, if the projections 27 of the case 20 are inserted into two holes 53a and 53b and heat caulked, as shown in FIG. On the back surface side of the portion 43, the resilient pieces 47-2, 47-2 have a structure in which they are double-folded.

With such a configuration, the force for repelling the land portion 43 to the lead wire 13 becomes stronger than in the embodiment shown in FIGS. 1 and 2, which is suitable for elastic contact between the two.

The present invention is not limited to the above embodiment, and for example, the following modifications are possible. In the above embodiment, the light emitting element with the lead wire is used as the electronic component with the lead wire, but an electronic component other than the light emitting element may be used. In short, the present invention can be applied to any electronic component with a lead wire in which a lead wire is drawn out from both sides of a molded functional portion main body (a portion corresponding to the light emitting element main body of the above embodiment).

The resilient pieces are not limited to being folded twice or three times, and may be configured to be folded multiple times.

[0032]

As described above in detail, according to the present invention, the land portion of the flexible substrate is provided with the lead wire by the action of the resilient piece provided on the flexible substrate itself without separately attaching an elastic member. It can be elastically contacted with the lead wire of the electronic component with an appropriate elasticity. Therefore, the number of parts can be reduced, and the structure is simple, so that the assembling work becomes easy, and the cost can be reduced. Since the number of parts is small, the thickness can be reduced.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing an example of an embodiment of the present invention.

FIG. 2 is a side sectional view showing an example of an embodiment of the present invention.

FIG. 3 is a side sectional view showing another embodiment of the present invention.

FIG. 4 is a perspective view of a main part showing a resilient piece 47-2.

FIG. 5 is a side sectional view showing a conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Light emitting element with a lead wire (electronic component with a lead wire) 11 Light emitting element main body (functional part main body) 13, 13 Lead wire 20 Case 27 Projection 40 Flexible board 43 Land part 45 Circuit pattern 47 Elastic piece 47-2 Elastic piece

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H05K 1/18 H01L 33/00 G09F 9/30-9/46 H05K 1/02

Claims (2)

(57) [Claims] An electronic component having lead wires extending from both sides of a functional unit main body, and a flexible substrate having a circuit pattern provided on a surface thereof, wherein the electronic component with lead wires is mounted on the flexible substrate. And mounting both lead wires of the electronic component with the lead wire to a land portion provided in a circuit pattern on the surface of the flexible substrate by press-fitting. A predetermined portion in the vicinity was cut out to form a resilient piece, while a case was placed over an electronic component with lead wires mounted on the flexible substrate, and the resilient piece was folded back to the back side of the land portion. In the state,
Hold the lead wire between the case and the flexible board
In Rukoto, the substrate attachment structure of leaded electronic components, characterized in that between the lead and the land part was allowed elastic contact connection. (2) The case and the flexible substrate
To hold the wire, press the protrusion protruding from the case under the elastic piece.
2. The method according to claim 1, wherein the fixing is performed on the side.
PCB mounting structure for electronic components with lead wires.