JP3108747B2 - Mounting structure and mounting method of electronic component to flexible board - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure and a method for mounting an electronic component on a flexible substrate.

[0002]

2. Description of the Related Art Conventionally, solder or low-temperature solder has been used to connect electrode portions of chip-type electronic components to a circuit pattern formed by etching a copper foil provided on a flexible substrate. That is, solder cream is printed on a flexible substrate, and a chip-type electronic component is mounted thereon by an automatic mounting machine. Then, the flexible substrate is passed through a heating furnace to solder the electronic components.

[0003] Since the flexible substrate is easily bent, the connection strength is low only by the connection and fixing by soldering. Therefore, a UV-curable adhesive is further applied on the electronic component so as to seal the same, and this is applied. It is hardened by passing it through a UV furnace.

On the other hand, in the case of a circuit pattern formed by printing a silver paste on a flexible substrate, unlike a circuit pattern formed by etching a copper foil, there is a problem in adhesiveness to solder. Instead, a hot melt type conductive adhesive is used. Also, when a film having a low heat-resistant temperature (such as a polyethylene terephthalate (PET) film) is used as the flexible substrate, it is necessary to use a conductive adhesive.

[0005] In this case, a conductive adhesive is printed and dried on the flexible substrate, and electronic components are mounted thereon by an automatic mounting machine, and then the flexible substrate and the electronic components are heated and pressurized. Melts the conductive adhesive to make connection between them.

[0006] In this case, too, the connection strength between the flexible substrate and the electronic component is not so strong.
Seal with a V-curable adhesive.

[0007]

In any of the above connection methods, when the number of electronic components mounted on the flexible substrate is large, the flexible substrate on which the electronic components are mounted is passed through a heating furnace or a UV irradiation furnace. This is efficient because connection of a large number of electronic components is completed simultaneously.

However, when the number of electronic components mounted on the flexible substrate is small, the manufacturing efficiency is adversely affected. That is, even when the number of electronic components to be mounted is small, it is necessary to place the electronic components on a flexible substrate, connect and fix them through a heating furnace, apply a UV-curable adhesive, and pass through a UV irradiation furnace. Because.

Further, it is necessary to install a heating furnace or a UV irradiation furnace, which leads to an increase in equipment costs.

In order to solve the above problems, it is only necessary that each electronic component can be mechanically attached to a flexible substrate one by one.

Therefore, as shown in FIG. 13 in the earlier application, the applicant of the present invention forms electrode pattern forming portions 117, 117 which can be bent by cutting out the periphery of the electrode patterns 113, 113 provided on the flexible sheet 111. Flexible substrate 110 and electrode portion 13 made of metal plate
A chip-type electronic component 130 provided with 3,133;
A holding member 140 provided with holding pieces 141 and 141 for holding the electronic component 130;
The electronic component 130 is placed on the upper side, and the holding member 140 is pushed up in the direction of the arrow a from the lower surface side so that the holding pieces 141,
As shown in FIG. 14, the electronic component 130 is held between the electrode pattern forming portions 117 and 117 while being bent by the electrode pattern forming portions 117, 117.
And the electrode patterns 113, 113
A structure for attaching an electronic component to a flexible board in which the electronic components are pressed against the electrode portions 133 and 133 has been proposed.

With this configuration, the mounting is easy, and there is no need to use a heating furnace or a UV furnace for mounting the electronic components 130. Therefore, even if the number of the electronic components 130 to be mounted on the flexible substrate 110 is small, manufacturing is possible. Efficiency can be improved.

Further, the electronic component 130 can be securely fixed to the flexible substrate 110, so that it is not necessary to reinforce the electronic component 130 with an adhesive.

However, in this mounting structure, the holding member 140 is pushed up in the direction of arrow a so that the electronic component 130
When the electronic component 130 is attached to both side surfaces of the electronic component 130, the holding portions 141 and 141 of the holding member 140 are once opened with a strong force by the metal plate electrode portions 133 and 133. There is a problem in that a strong load is applied to the tip of 133, and there is a possibility that the electrode portions 133 and 133 may be deformed or broken.

When attaching the holding member 140 to the electronic component 130, it is necessary to push up the holding member 140 in the direction of arrow a and simultaneously press the head 135 of the electronic component 130 with a jig (not shown). If the power is strong, there is a possibility that the internal element itself may be damaged depending on the electronic component 130.

The present invention has been made in view of the above points, and has as its object the purpose of mounting an electrode on a flexible substrate, even if an electronic component using a metal plate terminal is used as the electrode portion. It is an object of the present invention to provide a mounting structure and a mounting method of an electronic component to a flexible substrate, which can easily and surely make an electrical connection without causing excessive load, deformation, or damage to a portion.

[0017]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention provides a flexible substrate having an electrode pattern formed on a flexible sheet and a metal projecting from a case.
Place the plate along the outer surface of the case
An electronic component provided with an electrode portion having a structure bent toward the electronic component, and a holding member provided with a holding piece for holding the electronic component , wherein the electronic component has a lower surface facing upward.
The electronic component of the flexible board is placed on the flexible board in a state, and the holding piece of the holding member is pushed over the flexible board by pushing up the holding member disposed on the back surface of the flexible board on which the electronic component is placed. The bendable portions on both sides of the electrode portion are bent, and the holding piece presses the electronic component from above while the bent portion is pressed against the electrode portion of the electronic component. The holding member is further provided with a pressing portion for pressing the holding piece in a direction to open the holding piece. Further, the present invention provides a flexible substrate formed by forming an electrode pattern on a flexible sheet, and a case.
Hold the metal plate projecting from
The electrode part of the structure bent toward the lower surface direction of the source is provided.
An electronic component comprising: a holding member having a holding piece for holding the electronic component; an electronic component having a lower surface facing upward on the upper surface of the flexible substrate; and a holding member disposed on the lower surface. In a state where the holding piece of the holding member is opened by the jig, the holding member is pressed against the lower surface of the flexible board so that the holding piece of the holding member can exceed the flexible board, and the electrode of the electronic component of the flexible board is provided by the holding piece. The bendable portions located on both sides of the portion are bent, and then the holding portion is released from the open state, so that the bent flexible substrate is pressed against the electrode portion of the electronic component so that the holding portion is pressed from above. To hold the electronic components. Further, an insulating layer having a thickness for preventing the electronic component from sliding in a direction not sandwiched by the sandwiching member is provided on the flexible substrate.

[0018]

Embodiments of the present invention will be described below in detail with reference to the drawings. [First Embodiment] FIG. 1 is an exploded perspective view of a main part of a mounting structure of an electronic component to a flexible substrate according to a first embodiment of the present invention. As shown in the figure, in this embodiment, the flexible board 10 and the electronic component 30 are mechanically and electrically connected and fixed by the sandwiching member 40. Hereinafter, each component will be described.

The flexible substrate 10 has three electrode patterns 13 formed on the surface of a synthetic resin film, for example, a flexible sheet 11 made of PET, and a pair of U-shaped notches are formed in portions surrounding the three electrode patterns 13. 1
5 and 15 are provided to provide tongue-shaped electrode pattern forming portions 17 and 17.

Each of the electrode patterns 13 is formed by screen-printing a silver paste together with the circuit patterns 14 drawn from each of the electrode patterns 13.

Further, the connecting portion 1 at the base of the notch 15, 15
On layers 9 and 19, insulating layers 21 and 21 are formed by screen-printing an insulating paint a plurality of times. The thickness of the insulating layers 21 and 21 is, for example, about 100 μm.

Next, the electronic component 30 is a diode in this embodiment, and FIG. That is, this electronic component 30 is a substantially rectangular parallelepiped case 31.
And one and two electrode portions 33 made of a metal plate are respectively protruded from both outer side surfaces 35, 35. More specifically, each of the electrode portions 33 is formed by bending a metal plate protruding from the outer surface 35 of the case 31 toward the lower surface 37 of the case 31 along the outer surface 35 of the case 31, and further cutting the tip thereof to the case 31. 31 is bent substantially at a right angle so as to project outward so as to be substantially flush with the lower surface 37 of the base 31.

Next, the holding member 40 forms two holding pieces 41, 41 on both sides of the base 42 by bending opposite sides of the elastic metal plate into a substantially U-shape.
Pressing portions 47 protruding in a tongue-like shape are provided at both ends of the upper sides of the first and the first 41.

Here, the pressing portion 47 is formed in such a manner as to be bent in a "U" shape so that the front end thereof spreads outward. A positioning hole 49 is provided at the center of the base 42.

The electronic components 3 are mounted on the flexible substrate 10.
In order to mount the electronic component 30, the electronic component 30 is first turned over on the flexible substrate 10 as shown in FIG. 2, that is, the electronic component 30 of the flexible substrate 10 is placed on the flexible substrate 10 with its lower surface 37 facing upward. The holding member 40 placed on the push-up member 50 is disposed immediately below the portion. At this time, the circular projection 53 at the center of the push-up member 50 is inserted into the positioning hole 49 of the holding member 40.

Here, the upper surface 51 of the push-up member 50 is formed into a circular arc with a predetermined curvature.

Then, as shown in FIG. 3, the four rod-shaped pressing projections 55 (only two of the pressing projections 55 shown in FIG. 3 are shown) penetrate from the upper side of the flexible substrate 10 through the notch 15 (see FIG. 1). Then, the four pressing portions 47 (see FIG. 1) of the holding member 40 are pressed to open both holding pieces 41, 41 outward. At this time, the base 42 of the holding member 40 bends to the same shape as the upper surface 51 of the push-up member 50.

Then, as shown in FIG.
When the push-up member 50 is pushed up, and the lower surface 37 of the flipped-down electronic component 30 is pressed by a jig 60 at this time, the holding pieces 41, 41 become the electrode pattern forming portion 17,
17 is pushed up and bent to enter the outside of both electrode portions 33, 33 of the electronic component 30.

At this time, since both holding pieces 41, 41 are open, no strong force is applied to the electrode portions 33, 33, and there is no possibility of breakage. The lower surface 37 of the electronic component 30 is
Since it is not strongly pressed by 0, there is no possibility that the element in the electronic component 30 is destroyed. In particular, in the case of the present embodiment, since the electronic component 30 is mounted upside down, the protruding tips of the electrode portions 33, 33 are held by the holding pieces 4.
There is no need to climb over the holding pieces 41 and 41, and it is not necessary to push and spread the holding pieces 41 and 41 so much.

Then, when the pressing projection 55 is pulled up to remove the push-up member 50 and the jig 60, the electronic component 30 is held by the holding pieces 41, 4 of the holding member 40 as shown in FIGS.
1, the electrode parts 33, 33 of the electronic component 30 and the electrode pattern forming parts 17, 17 of the flexible substrate 10 are firmly pressed and connected.
The mounting of the electronic component 30 is completed. At this time, the three electrode patterns 13 (see FIG. 1) are in pressure contact with the outer surfaces of the electrode portions 33 by surface contact, respectively.
The electronic and electronic components 30 are securely and reliably fixed electrically and mechanically.

In this mounting structure, if an excessively strong force is applied to the electronic component 30 in the direction of arrow A (lateral direction) shown in FIG. 6, the electronic component 30 slides in that direction. I can't say that there is no fear of doing it.
However, in the case of this embodiment, the insulating layer 2 having a predetermined thickness is provided at a position where the electronic component 30 is to slide.
Since the electronic components 30 and 21 are printed, the electronic component 30 that is strongly pressed against the flexible substrate 10 by the sandwiching member 40 cannot exceed this thickness.
Zero lateral sliding is reliably prevented.

[Second Embodiment] FIGS. 7 to 9 are views showing an assembling method for attaching an electronic component 30 to a flexible substrate 10 using a holding member 40-2 according to a second embodiment of the present invention. The same parts as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.

The holding member 40-2 according to this embodiment is different from the holding member 40 according to the first embodiment in that the base 42-2 is lifted in advance at both ends thereof as shown in FIG. The only point that is curved. Therefore, both holding pieces 41-2, 41-2 are inclined more inward than each other in the first embodiment.

In order to attach the electronic component 30 to the flexible board 10 using the holding member 40-2, first, the push-up member 50-2 is placed just below the flexible board 10 on which the inverted electronic component 30 is mounted. Is disposed. The upper surface 51-2 of the push-up member 50-2 is formed in a planar shape.

As in the case of the first embodiment, FIG.
As shown in the figure, four pressing projections 55 (only two of the pressing projections 55 are shown on the rear side in the figure) make the four pressing portions 47 of the holding member 40-2.
-2 to open the holding pieces 41-2, 41-2 outward to push up the base 42-2 of the holding member 40-2.
0-2 is pressed against the upper surface 51-2 to make the jig 6 flat.
0 and push-up member 5 with electronic component 30 positioned.
Both holding pieces 41- in an open state by pushing up 0-2.
2, 41-2 are placed outside the two electrode portions 33, 33 of the electronic component 30, and then the push-up member 50-2 and the pressing protrusion 5
When the jig 60 and the jig 60 are removed, the electronic component 30 is firmly and securely fixed to the flexible board 10 by the holding pieces 41-2, 41-2 as shown in FIG.

[Third Embodiment] FIGS. 10 and 11 are views showing a third embodiment of the present invention. FIG. 10 is an exploded perspective view of a main part, and FIG. 11 is a side sectional view showing an assembled state. .

In this embodiment, the electronic component 30-
3 is mounted on the flexible substrate 10-3 in a normal posture without turning over. Therefore, the shape of both holding pieces 41-3, 41-3 of the holding member 40-3 is
Electrode pattern forming portion 17- of flexible substrate 10-3
It is configured to have a dimension capable of holding the tips of three metal plate electrode portions 33-3 (only two are shown in the figure) of the electronic component 30-3 together with 3, 17-3.

Also in this embodiment, both holding pieces 41
Pressing portions 47-3, 47-3 projecting in a tongue shape are provided at both ends of the upper side of -3, 41-3.

In order to attach the electronic component 30-3 to the flexible substrate 10-3 by using the holding member 40-3, first, the electronic component 30-3 is not shown directly below the flexible substrate 10-3 on which the electronic component 30-3 is mounted. The holding member 40-3 placed on the push-up member is arranged, and the pressing portion 47-3 is pressed by four pressing protrusions (not shown) to press both holding pieces 41-.
3 and 41-3, with both holding pieces 4 open outward.
1-3, 41-3, the electrode pattern forming portion 17-
Electrodes 33-3, 33-3 while flexing 3, 17-3
And then remove the push-up member and the like, as shown in FIG.
The electronic component 30-3 is changed to a flexible substrate 10-3.
To the electrode pattern 13-
3 and the electrode portion 33-3 are electrically connected.

[Other Embodiments] The position of the pressing portion provided on the holding member is not limited to the position in each of the above-described embodiments, but may be in another place. In short, pressing in the direction in which the holding piece is opened. Any location is possible as long as it is possible.
That is, instead of providing a pressing portion on both holding pieces 41-4, 41-4, for example, as in a holding member 40-4 shown in FIG.
Pressing portions 47-4 may be provided at four corners of the base portion 42-4, and the holding portions 41-4, 41-4 may be opened by pressing the pressing portions 47-4.

Further, for example, the electronic component may be an electronic component having a function other than the functions described in the above embodiment, and the shape of the electronic component, the number and shape of the electrode portions, the shape of the holding member, and the It goes without saying that the electrode pattern and the shape of the electrode pattern forming portion can be variously modified.

In the above embodiment, the electrode pattern is formed by printing a silver paste. However, the present invention is not limited to this. The electrode pattern may be formed by etching a copper foil or formed by other methods. It may be what you did.

For further reinforcement, a solder or an adhesive may be used in combination.

[0044]

As described above in detail, according to the present invention, since it is not necessary to use a heating furnace or a UV furnace for mounting electronic components, even if the number of electronic components to be mounted on a flexible substrate is small, manufacturing is possible. Efficiency can be improved. In addition, the electronic component can be securely fixed to the flexible substrate, and it is not necessary to reinforce the electronic component with an adhesive.

Further, since the pressing portion is provided, there is an excellent effect that, when the electronic component is mounted on the flexible substrate, there is no possibility that the electronic component may be overburdened or damaged.

Since the electronic parts were mounted upside down,
There is no need for the holding piece to climb over the protruding tip of the electrode portion, and the electronic component can be easily and reliably attached to the flexible substrate without having to push the holding piece so much.

Further, according to the present invention, since the insulating layer having a thickness for preventing the electronic components from sliding is provided on the flexible substrate, there is a possibility that the electronic components slide in a direction not to be pinched by the pinching member to cause positional displacement. It has an excellent effect of being prevented.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view of a main part of a structure for attaching an electronic component to a flexible substrate according to a first embodiment of the present invention.

FIG. 2 is a side sectional view showing a method of assembling the electronic component 30 to the flexible substrate 10.

FIG. 3 is a side sectional view showing a method of assembling the electronic component 30 to the flexible substrate 10.

FIG. 4 is a side sectional view showing a method of assembling the electronic component 30 to the flexible substrate 10.

FIG. 5 is a side sectional view showing a method of assembling the electronic component 30 to the flexible substrate 10.

FIG. 6 is a perspective view showing a state in which the electronic component 30 is attached to the flexible substrate 10.

FIG. 7 shows a holding member 40- according to a second embodiment of the present invention.
FIG. 4 is a side sectional view showing an assembling method of attaching an electronic component 30 to a flexible substrate 10 by using the electronic component 2.

FIG. 8 is a side sectional view showing a method of assembling the electronic component 30 to the flexible substrate 10.

FIG. 9 is a side sectional view showing a method of assembling the electronic component 30 to the flexible substrate 10.

FIG. 10 is an exploded perspective view of a main part showing a third embodiment of the present invention.

FIG. 11 is a side sectional view showing a third embodiment of the present invention.

FIG. 12 is a perspective view showing a holding member 40-4 according to another embodiment.

FIG. 13 is an exploded perspective view showing a mounting structure of an electronic component to a flexible substrate according to an earlier application of the present applicant.

FIG. 14 is a side sectional view showing a mounting structure of an electronic component to a flexible substrate according to an earlier application of the present applicant.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Flexible board 11 Sheet 13 Electrode pattern 17 Electrode pattern formation part 21 Insulating layer 30 Electronic component 31 Case 33 Electrode part 35 Outer side surface 40 Nipping member 41 Nipping piece 47 Pressing part

────────────────────────────────────────────────── ─── Continuation of front page (56) References JP-A-11-40917 (JP, A) JP-A-11-154800 (JP, A) JP-A-4-65073 (JP, A) JP-A-2- 134890 (JP, A) (58) Field surveyed (Int. Cl. ⁷ , DB name) H05K 1/18

Claims (4)

(57) [Claims] 1. A flexible substrate having an electrode pattern formed on a flexible sheet and a metal plate protruding from the case are not arranged along the outer surface of the case.
Electrodes with a structure bent toward the bottom of the case
An electronic component comprising: a holding member provided with a holding piece for holding the electronic component , wherein the electronic component is flexible with its lower surface facing upward.
An electrode of the electronic component of the flexible substrate is placed on the flexible substrate by pushing up a holding member of the flexible member on the back surface of the flexible substrate on which the electronic component is mounted. A bendable portion on both sides of the portion is bent, and the bent portion presses the electrode portion of the electronic component, and the holding piece clamps the electronic component from above the flexible portion. Mounting structure to the board. 2. The structure for mounting an electronic component on a flexible substrate according to claim 1, wherein the holding member is further provided with a pressing portion for pressing the holding piece in a direction to open the holding piece. 3. A flexible substrate having an electrode pattern formed on a flexible sheet and a metal plate protruding from the case are not arranged along the outer surface of the case.
Electrodes with a structure bent toward the bottom of the case
An electronic component provided with: and a holding member having a holding piece for holding the electronic component are prepared, and the lower surface of the upper surface of the flexible substrate is directed upward.
In a state where the holding member is disposed on the lower surface side of the electronic component in the held state, and the holding member of the holding member is opened by a jig, the holding member of the holding member is pressed against the lower surface of the flexible board to thereby make the holding member of the holding member flexible board. To bend the bendable portions located on both sides of the electrode portion of the electronic component of the flexible board by this holding piece, and then release the state in which the holding piece is opened, thereby bending the flexible board. A method of attaching an electronic component to a flexible substrate, wherein the electronic component is clamped by a clamping piece from above so as to press against an electrode portion of the electronic component. 4. The flexible substrate according to claim 1 , wherein an insulating layer having a thickness for preventing the electronic component from sliding in a direction not sandwiched by the sandwiching member is provided on the flexible substrate. Mounting structure for electronic components on flexible boards.