JP3717396B2 - Electronic component mounting structure - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a structure for attaching an electronic component to a substrate.
[0002]
[Prior art]
Conventionally, in order to connect the electrode portion of a chip-type electronic component to a circuit pattern provided on a flexible substrate, solder or low-temperature solder has been used when the circuit pattern is formed by etching a copper foil. On the other hand, when the circuit pattern is formed by printing with silver paste, unlike the circuit pattern formed by etching the copper foil, there is a problem in the adhesion to the solder. Instead, a hot-melt type conductive adhesive is used. Further, when a film having a low heat-resistant temperature (for example, polyethylene terephthalate (PET) film) is used as the flexible substrate, it is necessary to use a conductive adhesive.
[0003]
In addition, since flexible substrates are easily bent, the mechanical strength is weak only by connecting and fixing with the solder and conductive adhesive. Therefore, UV curing is performed so as to cover the electronic component after the connection and fixing with solder or conductive adhesive. Sealing with a mold adhesive is also performed.
[0004]
By the way, in any of the above connection methods, when a large number of electronic components are attached to the flexible substrate, it is efficient because it is possible to connect and fix a large number of electronic components at the same time, but conversely when a small number of electronic components are attached. Inefficient. For this reason, as a mechanical connection structure, an electrode part of an electronic component is connected to a circuit pattern of a flexible substrate with an attachment member made of an elastic metal plate, and the connection structure of the electronic component to the substrate with high connection reliability is provided. Was desired.
[0005]
[Problems to be solved by the invention]
The present invention has been made in view of the above points, and an object of the present invention is to provide an electronic component mounting structure on a substrate that can easily and firmly attach the electronic component to the substrate with high connection reliability. is there.
[0006]
[Means for Solving the Problems]
Structure for mounting a substrate of an electronic component according to the present invention for solving the above problems, an electronic component comprising projecting a substrate made by forming a pair of electrode patterns, the electrode portion on both left and right side portions, the electronic A mounting member for mounting the component on the board, and the mounting member is provided on both sides of the positioning portion, with a positioning portion having a shape for covering the upper surface of the electronic component at the center of the elastic plate and positioning the electronic component. A fixed portion that is fixed to the substrate, and a resilient portion that is provided on the fixed portion and is bent so that the tip thereof faces downward , from above the electronic component placed on the substrate. The electronic component is positioned by covering the positioning portion of the mounting member, and the mounting member is urged from above the electrode portion of the electronic component and pressed against the electrode pattern of the substrate. Before Characterized in that fixed to the substrate.
[0007]
According to the present invention, an auxiliary substrate having an auxiliary electrode pattern connected to the electrode portion on the lower surface is placed on the electrode portion of the electronic component placed on the electrode pattern of the substrate. The bullet portion is characterized by bulleting the surface of the auxiliary substrate opposite to the surface on which the auxiliary electrode pattern is provided.
[0008]
Further, the invention is characterized in that the engaging portion protruding from the lower surface of the electronic component is inserted into an alignment portion provided on the substrate to align the electronic component with the substrate.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
FIG. 1 is an exploded perspective view of a structure for mounting an electronic component to a substrate according to an embodiment of the present invention, and FIG. 2 is a schematic sectional view. As shown in FIG. 1, in this embodiment, a board 30, an electronic component 50, an auxiliary board 70, and a mounting member 90 are mounted on a mounting base 10. Each component will be described below.
[0010]
The mounting base 10 is made of a hard plate made of metal, and is provided with mounting holes 11 each having through holes at predetermined four locations (only three locations are shown in the figure), and through the center of the four mounting holes 11. Two alignment portions 13 made of holes are provided.
[0011]
A substrate (in this embodiment, a flexible substrate) 30 is similar in position to the mounting hole 11 on the surface of the flexible sheet 31 made of a synthetic resin film (for example, PET film) and to the position facing the alignment portion 13. A mounting hole 33 formed of a through hole having a shape and an alignment portion 35 are provided, and electrode patterns 37a and 37b formed by printing a silver paste on both outer sides of the two alignment portions 35 are provided. .
[0012]
Next, circuit patterns 39 and 39 are drawn out from the electrode patterns 37a and 37b, respectively, and are connected to other electric circuits (not shown) of the substrate 30. On the other hand, circuit patterns 41 and 41 for connecting to auxiliary electrode patterns 73a and 73b provided on the auxiliary substrate 70 described below are drawn out from the electrode patterns 37a and 37b. That is, in FIG. 1, the substrate 30 and the auxiliary substrate 70 are illustrated separately, but actually, the substrate 30 and the auxiliary substrate 70 are connected by a connecting portion 47 provided so as to protrude from the outer periphery of the both. By arranging the circuit patterns 41 and 41 on the top, the electrode patterns 37a and 37b and the auxiliary electrode patterns 73a and 73b are electrically connected.
[0013]
Next, the electronic component 50 is a chip-type on / off switch in this embodiment, and protrudes two metal plate electrode portions 53, 53, 55, 55 from the left and right side surfaces of the case 51. The switch pressing portion 57 is configured to protrude from one side surface where 53, 55 and 55 are not provided. The two electrode portions 53 and 53 are electrically connected, and the two electrode portions 55 and 55 are also electrically connected. When the switch pressing portion 57 is pressed and pushed into the case 51, the electrode portions 53 and 55 that are normally in an off state are turned on. Further, on the lower surface of the case 51 facing the two alignment portions 35, 35 provided on the substrate 30, projection-like engaging portions 59, 59 inserted into the alignment portions 35, 35, respectively (see FIG. 2).
[0014]
As described above, the auxiliary substrate 70 is formed in a film integral with the substrate 30, and is overlapped on the substrate 30 by being folded back by the connecting portion 47. Here, mounting holes 71 are provided at positions (four locations) facing the mounting holes 33 of the auxiliary substrate 70, respectively, and the case 51 of the electronic component 50 is inserted into the center of the four mounting holes 71. The electronic component insertion hole 73 is provided. Further, auxiliary electrode patterns 73a and 73b are provided at positions on the lower surface of the auxiliary substrate 70 facing the electrode patterns 37a and 37b, and are connected to the electrode patterns 37a and 37b by the circuit patterns 41 and 41, respectively, as described above. ing.
[0015]
Here, FIG. 3 is a cross-sectional view of the attachment member 90 (A-A cross-sectional view of FIG. 1). As shown in FIG. 1, FIG. 1 and FIG. 2, the mounting member 90 is made of elastic plate material (elastic metal plate), and is configured by providing fixing portions 93, 93 on both sides of a positioning portion 91 provided at the center. Yes. The fixed portions 93 and 93 are portions that are in contact with and placed on the auxiliary substrate 70, and the positioning portion 91 is a portion that is bent in a U shape so as to be positioned above the surfaces of the fixed portions 93 and 93. It is. The width L of the concave portion 91a formed on the lower surface of the positioning portion 91 is slightly larger than the width between both surfaces of the electronic component 50 on the side where the electrode portions 53 and 55 protrude.
[0016]
On the other hand, openings 95 and 95 are provided in the base side portion of the positioning portion 91 of the fixing portion 93, and in the openings 95 and 95, the elastic portions 97 and 97 are formed in a tongue shape from one side of the openings 95 and 95, respectively. Is protruding. Each of the projecting portions 97 and 97 is bent at the base portion so that the tip thereof protrudes downward. Reinforcing restricting portions 99 and 99 are provided outside the elastic portions 97 and 97 of both the fixing portions 93 and 93 so as to be squeezed so as to protrude upward in a straight line in the width direction. Further, tongue-like locking portions 101, 101 protrude from both sides of the fixing portion 93 and are bent downward. The locking portion 101 is provided at a position facing each of the four mounting holes 71.
[0017]
Next, in order to assemble the above components, first, the substrate 30 is placed on the base 10. Next, the electronic component 50 inserted into the electronic component insertion hole 73 of the auxiliary substrate 70 from the lower side and protruded upward is placed on the substrate 10 to be in the state shown in FIG. At this time, the electrode patterns 37 a and 37 b of the substrate 10 and the auxiliary electrode patterns 73 a and 73 b of the auxiliary substrate 70 are in contact with the upper and lower surfaces of the electrode parts 53 and 55 of the electronic component 50.
[0018]
Then, the mounting member 90 is placed on the auxiliary board 70, and at this time, the four locking portions 101 of the mounting member 90 are attached to the mounting holes 71 of the auxiliary board 70, the mounting holes 33 of the board 30, and the mounting holes 11 of the mounting base 10. And the front end is bent and fixed to the back surface of the mounting base 10.
[0019]
As a result, the both elastic portions 97, 97 of the mounting member 90 project the opposite surfaces of the auxiliary electrode patterns 73a, 73b of the auxiliary substrate 70, and the mounting member 90 is fixed to the mounting base 10, so that The electrode parts 53 and 55 of the electronic component 50 are strongly sandwiched between the upper and lower auxiliary electrode patterns 73a and 73b and the electrode patterns 37a and 37b, and the electrical connection is ensured.
[0020]
At this time, since the case 51 of the electronic component 50 is housed in the recess 91a of the positioning portion 91 of the mounting member 90, the entire electronic component 50 can be securely fixed. Therefore, even if an external force is applied to the electronic component 50, for example. The electronic component 50 is not displaced, and the connection between the electrode portions 53 and 55 and the electrode patterns 37a and 37b is ensured.
[0021]
Particularly in this embodiment, since the engaging portions 59, 59 provided in the electronic component 50 are inserted into the alignment portions 35, 35 of the substrate 30 and the alignment portions 13, 13 of the mounting base 10, The electronic component 50 can be reliably fixed together with the positioning and fixing by the positioning portion 91, and thereby the electrode portions 53 and 55 can be more securely fixed to the electrode patterns 37a and 37b.
[0022]
FIG. 5 is a view showing an assembling method of a structure for attaching an electronic component to a substrate according to a reference example . This reference example is different from the above embodiment only in that the positioning members 91 of the mounting member 90 shown in FIG. 4 are omitted, and the mounting members 90-2 and 90-2 are configured only by the left and right fixing portions 93. is there. Even with this configuration, the resilient portions 97, 97 of the attachment members 90-2, 90-2 repel the surfaces of the auxiliary substrate 70 opposite to the auxiliary electrode patterns 73a, 73b. Since 90-2 is fixed to the mounting base 10, the electrode portions 53 and 55 of the electronic component 50 are strongly held between the upper and lower auxiliary electrode patterns 73a and 73b and the electrode patterns 37a and 37b, and the electrical connection is established. Be sure.
[0023]
Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the technical idea described in the claims and the specification and drawings. Is possible. Note that any shape, structure, or material not directly described in the specification and drawings is within the scope of the technical idea of the present invention as long as the effects and advantages of the present invention are exhibited.
[0024]
For example, the auxiliary electrode patterns 73a and 73b of the auxiliary substrate 70 are not necessarily required and may be omitted. Further, instead of the auxiliary substrate 70, an insulating member may be interposed between the resilient portions 97, 97 and the electrode portions 53, 55. Further, in the above embodiment, the resilient portions 97 are provided on both sides of the positioning portion 91 of the mounting member 90. However, when there is only one electrode portion 53 (or 55) of the electronic component 50 to be connected, one resilient portion is provided. You may comprise only the part 97. FIG. Further, when a hard substrate is used as the substrate 30, the mounting base 10 is not necessarily required. Needless to say, the electronic component 50 is not limited to a switch, and may be various other chip-type electronic components such as a diode.
[0025]
【The invention's effect】
As described in detail above, the present invention has the following excellent effects.
(1) A positioning part having a shape that covers the upper surface of the electronic component on the mounting member and positioning it, a fixing part that is provided on both sides of the positioning part and fixed to the substrate, and a tip provided on the fixing part with its tip downward since there is provided a resilient portion occupying Sesse bullet between folded electronic component electrode and the substrate electrode patterns so as to face the electrode portion of the electronic part on which attained positioning and fixation of electronic parts entire substrate And the electrode pattern of the substrate can be elastically connected, and the connection can be made reliably.
[0026]
{Circle around (2)} Electronic components can be fixed to the board easily, simply, firmly and with high connection reliability, and there is no need to separately reinforce with solder or adhesive.
[Brief description of the drawings]
FIG. 1 is an exploded perspective view of a structure for attaching an electronic component to a substrate according to an embodiment of the present invention.
FIG. 2 is a schematic cross-sectional view of a structure for attaching an electronic component to a substrate according to an embodiment of the present invention.
3 is a cross-sectional view of the attachment member 90 (AA cross-sectional view of FIG. 1).
FIG. 4 is a view showing an assembling method of a structure for attaching an electronic component to a substrate according to an embodiment of the present invention.
FIG. 5 is a view showing an assembling method of a structure for attaching an electronic component to a substrate according to another embodiment of the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 Mounting base 11 Mounting hole 13 Positioning part 30 Board | substrate 31 Flexible sheet 33 Mounting hole 35 Positioning part 37a, 37b Electrode pattern 39, 41 Circuit pattern 47 Connection part 50 Electronic component 51 Case 53, 55 Electrode part 57 Switch pressing part 59 Engaging portion 70 Auxiliary substrate 71 Mounting hole 73 Electronic component insertion holes 73a, 73b Auxiliary electrode pattern 90 Mounting member 91 Positioning portion 93 Fixing portion 95 Opening 97 Rejection portion 99 Reinforcing restricting portion 101 Locking portion 90-2 Mounting member

Claims (3)

A substrate formed with a pair of electrode patterns;
An electronic component formed by protruding the electrode portions in both right and left side portions,
A mounting member for mounting the electronic component on the substrate;
The mounting member includes: a positioning part having a shape for covering the upper surface of the electronic component at the center of an elastic plate member and positioning the electronic part; a fixing part provided on both sides of the positioning part and fixed to the substrate; and a fixing part Provided with a projecting portion that is bent so that its tip faces downward ,
The electronic component placed on the electronic component placed on the substrate is covered with the positioning portion of the mounting member to position the electronic component, and the elastic portion is elastically ejected from above the electrode portion of the electronic component. An attachment structure for mounting an electronic component on a substrate, wherein the attachment member is fixed to the substrate in a state of being pressed against an electrode pattern of the substrate. On the electrode part of the electronic component placed on the electrode pattern of the board, an auxiliary board provided with an auxiliary electrode pattern connected to the electrode part on the lower surface is placed, and the elastic part of the mounting member is an auxiliary 2. The mounting structure for mounting an electronic component on a substrate according to claim 1, wherein a surface opposite to the surface on which the auxiliary electrode pattern is provided on the substrate is repelled. 3. The electronic component according to claim 1, wherein the engaging portion protruding from the lower surface of the electronic component is inserted into an alignment portion provided on the substrate to align the electronic component with the substrate. 4. Mounting structure on the board.

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