JPH1083733A - Membrane switch - Google Patents

Membrane switch

Info

Publication number
JPH1083733A
JPH1083733A JP8236343A JP23634396A JPH1083733A JP H1083733 A JPH1083733 A JP H1083733A JP 8236343 A JP8236343 A JP 8236343A JP 23634396 A JP23634396 A JP 23634396A JP H1083733 A JPH1083733 A JP H1083733A
Authority
JP
Japan
Prior art keywords
conductive layer
membrane switch
wiring board
base board
insulating film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8236343A
Other languages
Japanese (ja)
Inventor
Kenji Inoue
謙二 井上
Yoshiharu Abe
芳晴 阿部
Shinji Okuma
信二 大隈
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP8236343A priority Critical patent/JPH1083733A/en
Publication of JPH1083733A publication Critical patent/JPH1083733A/en
Pending legal-status Critical Current

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Abstract

PROBLEM TO BE SOLVED: To simplify a shape of an operation body, and obtain stable electric connection in a contact point part even if a membrane switch and the operation body are positionally dislocated at assembling time by arranging contact point pressing projection parts. SOLUTION: An upper wiring base board 1 is formed by printing a conductive layer 1B on an under surface of an insulating film 1A. A lower flexible wiring base board 2 is formed by printing a conductive layer 2B on an upper surface of an insulating substrate 2A. The upper wiring base board 1 and the lower flexible wiring base board 2 are adhered together by pressure sensitive adhesives 3B and 3C of upper and lower both surfaces of a spacer 3, and plural contact point parts 4 where the conductive layers 1B and 2B are opposed to each other, are formed in plural opening holes 3D of the spacer 3. Pressing projection parts 6 to press the plural contact point parts 4 are arranged on an upper surface of the upper wiring base board 1 above the contact point parts 4 formed in the opening holes 3D. Therefore, when an upper surface of an operation body 5 is pressed, the pressing projection parts 6 are pressed, and the upper wiring base board 1 deflects, and the conductive layers 1B and 2B are electrically connected to each other.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、各種電子機器に使
用されるメンブレンスイッチに関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a membrane switch used for various electronic devices.

【0002】[0002]

【従来の技術】従来のメンブレンスイッチについて、図
6および図7を用いて説明する。
2. Description of the Related Art A conventional membrane switch will be described with reference to FIGS.

【0003】図6は従来のメンブレンスイッチの断面
図、図7は同分解斜視図であり、同図において、1は絶
縁フィルム1Aの下面に導電層1Bを印刷によって形成
した上配線基板で、2は絶縁フィルムまたは絶縁基板2
Aの上面に導電層2Bを印刷によって形成した下配線基
板である。
FIG. 6 is a cross-sectional view of a conventional membrane switch, and FIG. 7 is an exploded perspective view of the same. In FIG. 6, reference numeral 1 denotes an upper wiring board formed by printing a conductive layer 1B on the lower surface of an insulating film 1A. Is the insulating film or insulating substrate 2
A lower wiring board in which a conductive layer 2B is formed on the upper surface of A by printing.

【0004】3は上配線基板1と下配線基板2の間に配
置されたスペーサで、絶縁フィルム3Aの上下両面に粘
着剤3Bと3Cが塗布され、複数の開口孔3Dと空気溝
3Eが設けられており、このスペーサ3の粘着剤3Bと
3Cによって上配線基板1と下配線基板2が接着され、
開口孔3D内に導電層1Bと導電層2Bが対向する複数
の接点部4を形成したメンブレンスイッチが構成されて
いる。
[0004] Reference numeral 3 denotes a spacer disposed between the upper wiring board 1 and the lower wiring board 2. Adhesives 3 B and 3 C are applied to both upper and lower surfaces of an insulating film 3 A, and a plurality of opening holes 3 D and air grooves 3 E are provided. The upper wiring board 1 and the lower wiring board 2 are adhered by the adhesives 3B and 3C of the spacer 3,
A membrane switch is formed in which a plurality of contact portions 4 in which the conductive layer 1B and the conductive layer 2B face each other are formed in the opening 3D.

【0005】また、5は上配線基板1の上方に配置され
た可撓性を有する成形樹脂製の操作体で、下面に設けた
複数の突起5Aが接点部4上方の上配線基板1の上面に
当接している。
[0005] Reference numeral 5 denotes an operating body made of a flexible molding resin disposed above the upper wiring substrate 1, and a plurality of projections 5 A provided on the lower surface are provided on the upper surface of the upper wiring substrate 1 above the contact portion 4. Is in contact with

【0006】上記の構成において、操作体5の上面に押
圧すると、操作体5の下面の突起5Aが接点部4上方の
上配線基板1の上面を押圧し、上配線基板1が撓んで導
電層1Bと下配線基板2の導電層2Bの電気的接続が行
われ、操作体5の押圧力を除去すると、上配線基板1の
弾性復帰力により導電層1Bが導電層2Bから離れ図6
のOFF状態に復帰する。
In the above configuration, when the upper surface of the operating body 5 is pressed against the upper surface of the upper wiring substrate 1 above the contact portion 4 when the upper surface of the operating body 5 is pressed, the upper wiring substrate 1 bends and the conductive layer 1B and the conductive layer 2B of the lower wiring board 2 are electrically connected, and when the pressing force of the operating body 5 is removed, the conductive layer 1B is separated from the conductive layer 2B by the elastic restoring force of the upper wiring board 1 and FIG.
To the OFF state.

【0007】[0007]

【発明が解決しようとする課題】しかしながら上記従来
の構成のメンブレンスイッチにおいては、操作体5の下
面に接点押圧用の複数の突起5Aを設ける必要があるた
め操作体5の成形金型が複雑となり、また別々に製作さ
れたメンブレンスイッチと操作体5を使用機器の組立工
程で組合わせる際に、複数の接点部4の中心と操作体5
の複数の突起5Aの中心に位置ずれが生じると、突起5
Aによる接点部4への押圧が不確実となり、導電層1B
と導電層2Bの電気的接続が不安定になるという課題が
あった。
However, in the membrane switch having the above-mentioned conventional configuration, it is necessary to provide a plurality of projections 5A for pressing the contact on the lower surface of the operating body 5, so that the molding die of the operating body 5 becomes complicated. Also, when combining the separately manufactured membrane switch and the operating body 5 in the assembly process of the equipment to be used, the center of the plurality of contact portions 4 and the operating body 5 are combined.
When a displacement occurs at the center of the plurality of projections 5A,
A makes the pressing of the contact portion 4 uncertain and the conductive layer 1B
There is a problem that the electrical connection between the conductive layer 2B and the conductive layer 2B becomes unstable.

【0008】本発明は、このような従来の課題を解決す
るものであり、操作体の形状を簡易なものにするととも
に、組立て時にメンブレンスイッチと操作体の位置ずれ
が生じても、接点部の安定した電気的接続が得られるメ
ンブレンスイッチを提供することを目的とするものであ
る。
SUMMARY OF THE INVENTION The present invention solves such a conventional problem. In addition to simplifying the shape of the operation body, even if the position of the membrane switch and the operation body is displaced during assembly, the operation of the contact portion is prevented. An object of the present invention is to provide a membrane switch capable of obtaining a stable electrical connection.

【0009】[0009]

【課題を解決するための手段】上記課題を解決するため
に本発明のメンブレンスイッチは、上配線基板上面のス
ペーサ開口孔内に形成された接点部に対応する位置に、
複数の接点押圧用の突部を設け、この押圧用突部を操作
体で押圧することによって、上下配線基板の各導電層の
電気的接続を行うように構成したものである。
In order to solve the above-mentioned problems, a membrane switch according to the present invention is provided at a position corresponding to a contact portion formed in a spacer opening on the upper surface of an upper wiring board.
A plurality of contact pressing protrusions are provided, and by pressing the pressing protrusions with an operating body, the respective conductive layers of the upper and lower wiring boards are electrically connected.

【0010】この本発明により、操作体下面の複数の突
起が不要となるため操作体の形状が簡易なものとなり、
また組立て時にメンブレンスイッチと操作体の位置ずれ
が生じても接点部の安定した電気的接続を得ることがで
きる。
According to the present invention, since the plurality of projections on the lower surface of the operating body are not required, the shape of the operating body can be simplified.
Further, even when the position of the membrane switch and the operation body is displaced during the assembly, a stable electrical connection of the contact portion can be obtained.

【0011】[0011]

【発明の実施の形態】本発明の請求項1に記載の発明
は、絶縁フィルムの下面に導電層を形成するとともに上
面に複数の押圧用突部を有する上配線基板と、絶縁フィ
ルムまたは絶縁基板の上面に導電層を形成した下配線基
板と、上記上下配線基板の間に配置され、上配線基板の
押圧用突部に対応した位置に複数の開口部を有し、絶縁
フィルム両面に塗布した粘着剤によって上記開口部を除
く上下面を上下配線基板にそれぞれ接着されたスペーサ
と、上記上配線基板の上方に配置された平板状の操作体
からなる構成としたもので、メンブレンスイッチと一体
になった押圧用突部によって上下配線基板の各導電層の
電気的接続を行うように構成されているため、スイッチ
を押圧する操作体が簡易な形状となるうえ、組立て時に
スイッチと操作体の位置ずれが生じても安定した電気的
接続を得ることができるという作用を有する。
DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention according to claim 1 of the present invention relates to an upper wiring board having a conductive layer formed on the lower surface of an insulating film and having a plurality of pressing projections on the upper surface; A lower wiring board having a conductive layer formed on the upper surface thereof, and disposed between the upper and lower wiring boards, having a plurality of openings at positions corresponding to the pressing projections of the upper wiring board, and coated on both surfaces of the insulating film. The upper and lower surfaces except for the opening are adhered to the upper and lower wiring boards by an adhesive, and a flat operation body is disposed above the upper wiring board, and is integrally formed with the membrane switch. It is configured to electrically connect each conductive layer of the upper and lower wiring boards by the pressing projections that have become, so that the operating body that presses the switch has a simple shape and the switch and the operating body are assembled during assembly. An effect that can even occur location deviated obtain stable electrical connection.

【0012】請求項2に記載の発明は、請求項1記載の
発明において、上配線基板と下配線基板を一体の絶縁フ
ィルムで形成し、この配線基板を導電層面を内側として
折り重ねた間にスペーサを配置した構成のもので、上下
の配線基板が一枚の配線基板で構成されているため、絶
縁フィルムへの導電層の印刷工数や使用部品点数が削減
できるという作用を有する。
According to a second aspect of the present invention, in the first aspect, the upper wiring board and the lower wiring board are formed of an integral insulating film, and the wiring board is folded with the conductive layer surface inside. Since it has a configuration in which spacers are arranged and the upper and lower wiring boards are formed of a single wiring board, it has the effect of reducing the number of steps for printing the conductive layer on the insulating film and the number of parts used.

【0013】請求項3に記載の発明は、請求項1または
2記載の発明において、上下の配線基板各々の導電層の
所定箇所を露出させて加熱接着タイプの絶縁層をオーバ
ーコート形成し、この上下配線基板の各絶縁層を加熱加
圧により接着してスペーサに代えた構成のもので、スペ
ーサが不要となり、使用部品点数とスイッチ組立て工数
を削減できるという作用を有する。
According to a third aspect of the present invention, in the first or second aspect of the present invention, a predetermined portion of each of the conductive layers of the upper and lower wiring boards is exposed to form an overcoat with a heat-bonding type insulating layer. This is a configuration in which the insulating layers of the upper and lower wiring boards are bonded by heating and pressurization instead of the spacers, and the spacers are not required, which has the effect of reducing the number of parts used and the number of switch assembly steps.

【0014】請求項4に記載の発明は、請求項1〜3の
いずれか一つに記載の発明において、上下の配線基板の
導電層として銅や半田等の金属層を形成した構成のもの
で、導電層を金属層とすることによってメンブレンスイ
ッチの使用電気容量を向上させることができるという作
用を有する。
According to a fourth aspect of the present invention, in the first aspect of the present invention, a metal layer such as copper or solder is formed as a conductive layer on the upper and lower wiring boards. In addition, the use of a metal layer as the conductive layer has the effect of improving the electric capacity of the membrane switch.

【0015】以下、本発明の実施の形態について、図1
〜図5を用いて説明する。なお、従来の技術の項で説明
した構成と同一構成の部分には同一番号を付して、詳細
な説明を省略する。
FIG. 1 shows an embodiment of the present invention.
This will be described with reference to FIG. The same components as those described in the section of the related art are denoted by the same reference numerals, and detailed description will be omitted.

【0016】(実施の形態1)図1は本発明の第一の実
施の形態によるメンブレンスイッチの断面図、図2は同
分解斜視図であり、同図において、絶縁フィルム1Aの
下面に導電層1Bを印刷によって形成した上配線基板1
と、絶縁フィルムまたは絶縁基板2Aの上面に導電層2
Bを印刷によって形成した下フレキシブル配線基板2
が、スペーサ3の上下両面の粘着剤3Bと3Cによって
接着され、スペーサ3の複数の開口孔3D内に導電層1
Bと導電層2Bが対向する複数の接点部4を形成してい
ることは従来の技術と同様である。
(Embodiment 1) FIG. 1 is a sectional view of a membrane switch according to a first embodiment of the present invention, and FIG. 2 is an exploded perspective view of the membrane switch. In FIG. 1, a conductive layer is provided on the lower surface of an insulating film 1A. Upper wiring substrate 1 formed by printing 1B
And a conductive layer 2 on the upper surface of the insulating film or the insulating substrate 2A.
Lower flexible wiring board 2 formed by printing B
Are adhered by adhesives 3B and 3C on both upper and lower surfaces of the spacer 3, and the conductive layer 1 is inserted into the plurality of opening holes 3D of the spacer 3.
B and the conductive layer 2B form a plurality of contact portions 4 facing each other, as in the prior art.

【0017】しかし、スペーサ3の開口孔3D内に形成
された接点部4上方の上配線基板1の上面には、複数の
接点部4を押圧する押圧用突部6が設けられ、上配線基
板1の上方に配置された操作体5の上面を押圧すると、
操作体5の下面がこの押圧用突部6を押圧し、上配線基
板1が撓んで導電層1Bと導電層2Bの電気的接続が行
われる構成となっている。
However, on the upper surface of the upper wiring substrate 1 above the contact portion 4 formed in the opening 3D of the spacer 3, a pressing projection 6 for pressing the plurality of contact portions 4 is provided. When pressing the upper surface of the operating body 5 disposed above the
The lower surface of the operating body 5 presses the pressing projections 6 so that the upper wiring board 1 bends to electrically connect the conductive layers 1B and 2B.

【0018】このように、複数の接点部4上方の上配線
基板1上面に複数の押圧用突部6を設け、このメンブレ
ンスイッチと一体になった押圧用突部6を操作体5の下
面全面で押圧することによって、導電層1Bと導電層2
Bの電気的接続を行っているため、操作体5には接点押
圧用の突起等が不要となり、簡易な形状で金型加工も容
易となるとともに、使用機器の組立て時にスイッチと操
作体5の位置ずれが生じても安定した電気的接続を得る
ことができる。
As described above, the plurality of pressing projections 6 are provided on the upper surface of the upper wiring board 1 above the plurality of contact portions 4, and the pressing projections 6 integrated with the membrane switch are formed on the entire lower surface of the operating body 5. The conductive layer 1B and the conductive layer 2
Since the electrical connection of B is performed, the operation body 5 does not need a projection for pressing a contact and the like, so that the mold can be easily formed with a simple shape, and the switch and the operation body 5 are assembled at the time of assembling the used equipment. Even if displacement occurs, stable electrical connection can be obtained.

【0019】(実施の形態2)図3は本発明の第二の実
施の形態によるメンブレンスイッチの断面図であり、同
図において、7は絶縁フィルム7Aに導電層7Bと導電
層7Cを印刷によって形成した配線基板で、導電層7B
と7Cを内側にして折曲部7Dから折り重ねられ、その
間に配置されたスペーサ3の上下両面の粘着剤3Bと3
Cによって接着され、スペーサ3の複数の開口孔3D内
に導電層7Bと導電層7Cが対向した複数の接点部4を
形成するとともに、この接点部4上方の配線基板7上面
には、複数の接点部4を押圧する押圧用突部6が設けら
れている。
(Embodiment 2) FIG. 3 is a sectional view of a membrane switch according to a second embodiment of the present invention. In FIG. 3, reference numeral 7 denotes a conductive layer 7B and a conductive layer 7C formed on an insulating film 7A by printing. With the formed wiring board, the conductive layer 7B
The adhesives 3B and 3B on the upper and lower surfaces of the spacer 3 which is folded from the bent portion 7D with the and
C, a plurality of contact portions 4 in which the conductive layer 7B and the conductive layer 7C face each other are formed in the plurality of opening holes 3D of the spacer 3, and a plurality of contact portions 4 are formed on the upper surface of the wiring board 7 above the contact portions 4. A pressing protrusion 6 for pressing the contact portion 4 is provided.

【0020】このように、一枚の配線基板7を折り重ね
ることによってメンブレンスイッチを形成しているた
め、上下二枚の配線基板によって構成されたものに比
べ、絶縁フィルムへの導電層の印刷工数や使用部品点数
を削減できるとともに、組立て時の使用部品の取扱いも
容易となる。
As described above, since the membrane switch is formed by folding one wiring board 7, the number of steps for printing the conductive layer on the insulating film is smaller than that of the structure constituted by the two upper and lower wiring boards. And the number of used parts can be reduced, and the handling of the used parts at the time of assembly becomes easy.

【0021】また、複数の押圧用突部を下配線基板下面
の接点部に対応する位置に設け、この下方に平滑な保持
台を配置し、上配線基板を操作体で押圧する構成として
も同等の効果が得られることは言うまでもない。
Further, a plurality of pressing projections are provided at positions corresponding to the contact portions on the lower surface of the lower wiring board, and a smooth holding table is disposed below the pressing projections, and the upper wiring board is pressed by the operating body. Needless to say, the effect is obtained.

【0022】(実施の形態3)図4は本発明の第三の実
施の形態によるメンブレンスイッチの断面図であり、同
図において、上配線基板1と下配線基板2の導電層1B
と2B上には、複数の所定箇所の導電層を露出させて加
熱接着タイプの絶縁層1Cと2Cが印刷によって形成さ
れ、この絶縁層1Cと2Cが加熱加圧によって溶融して
接着され、導電層1Bと2Bの露出部が対向する複数の
接点部4を形成している。
(Embodiment 3) FIG. 4 is a sectional view of a membrane switch according to a third embodiment of the present invention. In FIG. 4, conductive layers 1B of an upper wiring board 1 and a lower wiring board 2 are shown.
A plurality of predetermined conductive layers are exposed on and 2B to form heat-bonding type insulating layers 1C and 2C by printing. The insulating layers 1C and 2C are melted and bonded by heating and pressurizing. The exposed portions of the layers 1B and 2B form a plurality of contact portions 4 facing each other.

【0023】また、接点部4上方の上配線基板1上面に
は、複数の接点部4を押圧する押圧用突部6が印刷によ
って形成されている。
On the upper surface of the upper wiring substrate 1 above the contact portions 4, a pressing projection 6 for pressing the plurality of contact portions 4 is formed by printing.

【0024】このように、上配線基板1と下配線基板2
に印刷形成した絶縁層1Cと2Cを加熱加圧によって接
着してメンブレンスイッチを構成しているため、上下配
線基板1と2を接着する粘着剤を塗布したスペーサが不
要となり、使用部品点数とスイッチ組立て工数を削減で
きる。
As described above, the upper wiring board 1 and the lower wiring board 2
Since the insulating layer 1C and 2C printed on the substrate are bonded by heating and pressing to form a membrane switch, a spacer coated with an adhesive for bonding the upper and lower wiring substrates 1 and 2 is not required, and the number of parts used and the switch Assembly man-hours can be reduced.

【0025】また、上配線基板1と下配線基板2の導電
層1Bと2Bを銅や半田等の金属層で形成することによ
り、この金属層によってメンブレンスイッチの使用電気
容量を向上させることができる。
Further, by forming the conductive layers 1B and 2B of the upper wiring board 1 and the lower wiring board 2 with a metal layer such as copper or solder, the use capacity of the membrane switch can be improved by this metal layer. .

【0026】なお、配線基板の導電層の形状は、図5
(a)のように上下配線基板1と2の全面を導電層1B
と2Bとした構成でも、図5(b)のように上下配線基
板1と2に各々独立した固定接点1Dと2Dおよび導電
パターン1Eと2Eを設けた構成でも、スイッチの用途
に応じて選択が可能であり、特に図5(a)の構成にお
いては操作部が限定されずにどこを押しても作動するた
め、例えば車のホーンスイッチなどのように前面にカバ
ーを装着した場合などに特に有用なものである。
The shape of the conductive layer of the wiring board is shown in FIG.
As shown in (a), the entire surface of the upper and lower wiring substrates 1 and 2 is covered with a conductive layer 1B.
5B or the configuration in which the fixed contacts 1D and 2D and the conductive patterns 1E and 2E are provided independently on the upper and lower wiring boards 1 and 2 as shown in FIG. It is possible, and particularly in the configuration of FIG. 5A, the operation section is not limited and can be operated wherever it is pressed. Therefore, it is particularly useful when a cover is attached to the front surface such as a horn switch of a car. Things.

【0027】[0027]

【発明の効果】以上のように本発明によれば、上配線基
板の上面に複数の接点押圧用の突部を設け、この押圧用
突部を操作体で押圧することによって、上下配線基板の
導電層の電気的接続を行っているため、操作体の形状が
簡易なものになるうえ、組立て時にメンブレンスイッチ
と操作体の位置ずれが生じても接点部の安定した電気的
接続を得ることができる。
As described above, according to the present invention, a plurality of contact pressing protrusions are provided on the upper surface of the upper wiring board, and the pressing protrusions are pressed by the operating body, thereby making the upper and lower wiring boards lower. Since the electrical connection of the conductive layer is performed, the shape of the operating body is simplified, and a stable electrical connection of the contacts can be obtained even if the membrane switch and the operating body are misaligned during assembly. it can.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の第一の実施の形態によるメンブレンス
イッチの構成を示す断面図
FIG. 1 is a sectional view showing a configuration of a membrane switch according to a first embodiment of the present invention.

【図2】同分解斜視図FIG. 2 is an exploded perspective view of the same.

【図3】本発明の第二の実施の形態によるメンブレンス
イッチの構成を示す断面図
FIG. 3 is a cross-sectional view illustrating a configuration of a membrane switch according to a second embodiment of the present invention.

【図4】本発明の第三の実施の形態によるメンブレンス
イッチの構成を示す断面図
FIG. 4 is a sectional view showing a configuration of a membrane switch according to a third embodiment of the present invention.

【図5】同上下配線基板の斜視図FIG. 5 is a perspective view of the upper and lower wiring boards.

【図6】従来のメンブレンスイッチの構成を示す断面図FIG. 6 is a sectional view showing the configuration of a conventional membrane switch.

【図7】同分解斜視図FIG. 7 is an exploded perspective view of the same.

【符号の説明】[Explanation of symbols]

1 上配線基板 2 下配線基板 1A,2A,3A,7A 絶縁フィルム 1B,2B,7B,7C 導電層 1C,2C 絶縁層 1D,2D 固定接点 1E,2E 導電パターン 3 スペーサ 3B,3C 粘着剤 3D 開口孔 4 接点部 5 操作体 6 押圧用突部 7 配線基板 7D 折曲部 Reference Signs List 1 upper wiring board 2 lower wiring board 1A, 2A, 3A, 7A insulating film 1B, 2B, 7B, 7C conductive layer 1C, 2C insulating layer 1D, 2D fixed contact 1E, 2E conductive pattern 3 spacer 3B, 3C adhesive 3D opening Hole 4 Contact part 5 Operating body 6 Pressing projection 7 Wiring board 7D Bend

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 絶縁フィルムの下面に導電層を形成する
とともに上面に複数の押圧用突部を有する上配線基板
と、絶縁フィルムまたは絶縁基板の上面に導電層を形成
した下配線基板と、上記上下配線基板の間に配置され、
上配線基板の押圧用突部に対応した位置に複数の開口部
を有し、絶縁フィルム両面に塗布した粘着剤によって上
記開口部を除く上下面を上下配線基板にそれぞれ接着さ
れたスペースと、上記上配線基板の上方に配置された平
板状の操作体からなるメンブレンスイッチ。
An upper wiring substrate having a conductive layer formed on a lower surface of an insulating film and having a plurality of pressing projections on an upper surface; a lower wiring substrate having a conductive layer formed on an upper surface of the insulating film or the insulating substrate; Placed between the upper and lower wiring boards,
The upper wiring substrate has a plurality of openings at positions corresponding to the pressing projections, and the upper and lower surfaces except for the openings are adhered to the upper and lower wiring substrates by an adhesive applied to both surfaces of the insulating film, and Membrane switch consisting of a flat operating body disposed above the upper wiring board.
【請求項2】 上配線基板と下配線基板を一体の絶縁フ
ィルムで形成し、この配線基板を導電層面を内側として
折り重ねた間にスペーサを配置した請求項1記載のメン
ブレンスイッチ。
2. The membrane switch according to claim 1, wherein the upper wiring board and the lower wiring board are formed of an integral insulating film, and a spacer is arranged while the wiring board is folded with the conductive layer surface inside.
【請求項3】 上下の配線基板各々の導電層の所定箇所
を露出させて加熱接着タイプの絶縁層をオーバーコート
形成し、この上下配線基板の各絶縁層を加熱加圧により
接着してスペーサに代えた請求項1または2記載のメン
ブレンスイッチ。
3. A predetermined portion of the conductive layer of each of the upper and lower wiring boards is exposed to form an overcoat with a heat-bonding type insulating layer, and the respective insulating layers of the upper and lower wiring boards are bonded by heating and pressing to the spacer. 3. The membrane switch according to claim 1, wherein the membrane switch is replaced.
【請求項4】 上下の配線基板の導電層として銅や半田
等の金属層を形成した請求項1〜3のいずれか一つに記
載のメンブレンスイッチ。
4. The membrane switch according to claim 1, wherein metal layers such as copper and solder are formed as conductive layers of the upper and lower wiring boards.
JP8236343A 1996-09-06 1996-09-06 Membrane switch Pending JPH1083733A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8236343A JPH1083733A (en) 1996-09-06 1996-09-06 Membrane switch

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8236343A JPH1083733A (en) 1996-09-06 1996-09-06 Membrane switch

Publications (1)

Publication Number Publication Date
JPH1083733A true JPH1083733A (en) 1998-03-31

Family

ID=16999413

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8236343A Pending JPH1083733A (en) 1996-09-06 1996-09-06 Membrane switch

Country Status (1)

Country Link
JP (1) JPH1083733A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005093128A (en) * 2003-09-12 2005-04-07 Alps Electric Co Ltd Operation device
KR100991749B1 (en) 2008-05-20 2010-11-03 (주)미내사시스템 Switch sheet of membrane

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005093128A (en) * 2003-09-12 2005-04-07 Alps Electric Co Ltd Operation device
KR100991749B1 (en) 2008-05-20 2010-11-03 (주)미내사시스템 Switch sheet of membrane

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