JP3465451B2 - Electronic circuit device - Google Patents

Electronic circuit device

Info

Publication number
JP3465451B2
JP3465451B2 JP29712595A JP29712595A JP3465451B2 JP 3465451 B2 JP3465451 B2 JP 3465451B2 JP 29712595 A JP29712595 A JP 29712595A JP 29712595 A JP29712595 A JP 29712595A JP 3465451 B2 JP3465451 B2 JP 3465451B2
Authority
JP
Japan
Prior art keywords
fitting
lead
circuit board
connector
sandwiching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP29712595A
Other languages
Japanese (ja)
Other versions
JPH09139243A (en
Inventor
有弘 神谷
泰充 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Priority to JP29712595A priority Critical patent/JP3465451B2/en
Publication of JPH09139243A publication Critical patent/JPH09139243A/en
Application granted granted Critical
Publication of JP3465451B2 publication Critical patent/JP3465451B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405Edge mounted components, e.g. terminals

Landscapes

  • Coupling Device And Connection With Printed Circuit (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Multi-Conductor Connections (AREA)

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】この発明は、回路基板に対し
接続リードが接続された電子回路装置に関するものであ
る。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic circuit device having connection leads connected to a circuit board.

【0002】[0002]

【従来の技術】厚膜焼成基板と外部接続端子との間で電
気的接続を取るための端子引出し構造として、図9,1
0に示すように、接続リード33の一端に設けた挟持部
34を用いて基板30と接続リード33とを接続するこ
とが考えられる。つまり、電子回路が形成された回路基
板30には、縁部に接続部31が形成されている。又、
回路基板30の上方に配置されるコネクタ部32は接続
リード33を有し、接続リード33の一端には挟持部3
4が設けられている。そして、接続リード33の挟持部
34にて基板30の縁部を両面から挟み込み、この状態
で挟持部34を基板30の接続部31とはんだ付けす
る。
2. Description of the Related Art As a terminal lead-out structure for making an electrical connection between a thick film baked substrate and an external connection terminal, FIG.
As shown in FIG. 0, it is conceivable to connect the substrate 30 and the connection lead 33 by using the sandwiching portion 34 provided at one end of the connection lead 33. That is, the connection portion 31 is formed at the edge of the circuit board 30 on which the electronic circuit is formed. or,
The connector portion 32 arranged above the circuit board 30 has a connection lead 33, and the holding portion 3 is provided at one end of the connection lead 33.
4 are provided. Then, the edge portion of the substrate 30 is sandwiched from both sides by the sandwiching portion 34 of the connection lead 33, and in this state, the sandwiching portion 34 is soldered to the connection portion 31 of the substrate 30.

【0003】[0003]

【発明が解決しようとする課題】ところが、この構造を
採用することにより基板30と接続リード33との取り
付け作業を容易に行うことができるが、取付けの際には
図11に示すように、長方形状の基板30における一方
の長辺に対応するリード33aの挟持部34を基板30
に挟み込み、その後に他方の長辺に対応するリード33
bの挟持部34を基板30の幅よりも大きくなるように
広げ、基板30に挟み込む手順を踏むこととなる。この
とき、基板30にて形成される平面に対しリード33b
の先端の挟持部34は図11の回動中心点P1を中心に
して円周方向に移動することとなり、基板30に対して
無用な応力が働き、最悪の場合には基板割れを招く可能
性もある。つまり、図11において基板30の面方向L
1に対し挟持部34の挟持方向L2(U字状の挟持部3
4の中心線)とが一致しないために基板30に対して無
用な応力が働く。換言すれば、このような不具合を避け
るために嵌め込み作業を慎重に行うと、作業性の悪化を
招いてしまう。
However, by adopting this structure, the work of attaching the substrate 30 and the connection lead 33 can be easily carried out. However, at the time of attachment, as shown in FIG. The holding portion 34 of the lead 33a corresponding to one long side of the substrate 30 having a strip shape is formed on the substrate 30.
The lead 33 corresponding to the other long side after that.
The procedure of inserting the holding portion 34b of b into the board 30 so as to be wider than the width of the board 30 is performed. At this time, the leads 33b are formed on the plane formed by the substrate 30.
The pinching portion 34 at the tip of is moved in the circumferential direction about the rotation center point P1 in FIG. 11, and unnecessary stress acts on the substrate 30, possibly causing substrate cracking. There is also. That is, the plane direction L of the substrate 30 in FIG.
1, the clamping direction L2 of the clamping section 34 (U-shaped clamping section 3
Therefore, unnecessary stress is exerted on the substrate 30 because the center line 4 of FIG. In other words, if the fitting work is carefully performed to avoid such a problem, workability will be deteriorated.

【0004】そこで、この発明の目的は、リードの先端
の挟持部により基板に無用な応力が加わることがなく容
易にリードを基板側に接続することができる電子回路装
置を提供することにある。
SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic circuit device which can easily connect the lead to the substrate side without applying unnecessary stress to the substrate by the holding portion at the tip of the lead.

【0005】[0005]

【課題を解決するための手段】請求項1に記載の発明
は、接続リードを支持するコネクタ用リード支持部材
を、第1のコネクタ用リード支持部材と第2のコネクタ
用リード支持部材とに別体化し、 前記第1のコネクタ
用リード支持部材における第1の辺に直交する方向に付
設された嵌合凸部と、第2のコネクタ用リード支持部材
における第2の辺に直交する方向であって嵌合凸部を嵌
合可能に形成された嵌合部とを備えたことを特徴とし
ている。よって、組付けの際には、第1のコネクタ用リ
ード支持部材における第1の接続リードの挟持部を、四
角板状の回路基板における第1の辺での第1の接続部に
対し両面から挟み込む。又、第2のコネクタ用リード支
持部材における第2の接続リードの挟持部を、四角板状
の回路基板における前記第1の辺に対向する第2の辺で
の第2の接続部に対し両面から挟み込む。さらに、嵌合
と嵌合凹部とにより第1のコネクタ用リード支持部
材と第2のコネクタ用リード支持部材とを嵌着して一体
化する。
According to a first aspect of the present invention, a connector lead supporting member for supporting a connection lead is separated into a first connector lead supporting member and a second connector lead supporting member. And embedding it in a direction orthogonal to the first side of the first connector lead support member .
Fitting convex portion provided and second connector lead supporting member
The fitting convex portion in the direction orthogonal to the second side in
It is characterized in that a case capable formed fitting recess. Therefore, at the time of assembly, the sandwiching portion of the first connecting lead of the first connector lead supporting member is provided from both sides with respect to the first connecting portion on the first side of the square plate circuit board. Sandwich it. In addition, the sandwiching portion of the second connecting lead in the second connector lead supporting member is formed on both sides of the second connecting portion on the second side of the square plate-shaped circuit board that faces the first side. Insert it from the inside. Furthermore, mating
The first connector lead supporting member and the second connector lead supporting member are fitted and integrated by the convex portion and the fitting concave portion .

【0006】このように、第1のコネクタ用リード支持
部材と第2のコネクタ用リード支持部材とを二部品とし
て分けた状態において片側ずつ接続リードの挟持部を、
基板に対して最も応力が加わりにくい方向から回路基板
に挟み込むことができ、基板の割れを回避することがで
き、作業性もよくなる。その結果、リードの先端の挟持
部により基板に無用な応力が加わることがなく容易にリ
ードを基板側に接続することができることとなる。請求
項2に記載の発明は、嵌合凸部には抜け防止用突起が設
けられ、嵌合凹部における抜け防止用突起に対応する位
置には、抜け防止用突起を嵌合する切り欠き部が形成さ
れていることを特徴とする。よって、第1のコネクタ用
リード支持部材と第2のコネクタ用リード支持部材との
間に上下方向にズレる力が作用してもズレ難い。
As described above, in the state in which the first connector lead supporting member and the second connector lead supporting member are divided into two parts, the holding portions of the connecting leads are provided on each side.
The circuit board can be sandwiched from the direction in which the stress is least applied to the circuit board, the cracking of the circuit board can be avoided, and the workability is improved. As a result, it is possible to easily connect the lead to the substrate side without applying unnecessary stress to the substrate by the holding portion at the tip of the lead. Claim
According to the invention of Item 2, a protrusion for preventing slippage is provided on the fitting protrusion.
And the position that corresponds to the protrusion for
There is a notch formed on the mounting
It is characterized by being. Therefore, for the first connector
Of the lead support member and the second connector lead support member
Even if a force that vertically shifts is applied, it is difficult to shift.

【0007】[0007]

【発明の実施の形態】以下、この発明の実施の形態を図
面に従って説明する。本実施の形態は、車載エンジン制
御用コンピュータに具体化したものであり、図1には分
解斜視図を示す。図2にはエンジン制御用コンピュータ
の縦断面図を示す。図3にはコネクタ部3における図1
のA−A部分での縦断面図を示す。
BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. The present embodiment is embodied in a vehicle-mounted engine control computer, and an exploded perspective view is shown in FIG. FIG. 2 shows a vertical sectional view of the engine control computer. FIG. 3 shows the connector portion 3 of FIG.
FIG. 5 is a vertical sectional view taken along line AA of FIG.

【0008】図1に示すように、エンジン制御用コンピ
ュータはベース材1と回路基板2とコネクタ部3とケー
ス材4とから構成されている。つまり、全体構成とし
て、図2に示すように、ベース材1上に回路基板2が固
定され、回路基板2の上方においてコネクタ用リード支
持部材5が接続リード6,7により所定間隔を隔てた位
置に配置され、回路基板2とコネクタ用リード支持部材
5を覆うようにケース材4が配置されている。接続リー
ド6,7は帯状をなし、燐青銅(銅合金)よりなる。
As shown in FIG. 1, the engine control computer comprises a base material 1, a circuit board 2, a connector portion 3 and a case material 4. That is, as a whole configuration, as shown in FIG. 2, the circuit board 2 is fixed on the base material 1, and the connector lead supporting member 5 is located above the circuit board 2 at predetermined positions by the connecting leads 6 and 7. And the case member 4 is arranged so as to cover the circuit board 2 and the connector lead supporting member 5. The connection leads 6 and 7 are strip-shaped and made of phosphor bronze (copper alloy).

【0009】回路基板2は四角板状(より詳しくは、長
方形)の厚膜セラミックス基板よりなり、回路基板2の
上に電子回路構成部品である各種の電子部品8が搭載さ
れている。ここで、図1において電子部品8として、コ
ンデンサ8a、IC回路8b、発振子8cを示す。この
電子部品8を用いて回路基板2上に電子回路が形成され
ている。又、長方形状をなす回路基板2において長辺
9,10の内の一方の辺(第1の辺)9での縁部上面に
は第1の電極接続部(接続ランド)11が多数並設され
ている。回路基板2における長辺9,10の内の他方の
辺(第2の辺)10での縁部上面には第2の電極接続部
(接続ランド)12が多数並設されている。この電極接
続部11,12と、電子部品8を用いて構成される電子
回路とが電気的に接続されている。
The circuit board 2 is made of a quadrangular plate-shaped (more specifically, rectangular) thick-film ceramics board, and various electronic components 8 which are electronic circuit components are mounted on the circuit board 2. Here, in FIG. 1, as the electronic component 8, a capacitor 8a, an IC circuit 8b, and an oscillator 8c are shown. An electronic circuit is formed on the circuit board 2 using the electronic component 8. Further, in the rectangular circuit board 2, a large number of first electrode connecting portions (connection lands) 11 are arranged in parallel on the upper surface of the edge at one side (first side) 9 of the long sides 9, 10. Has been done. A large number of second electrode connecting portions (connection lands) 12 are arranged in parallel on the upper surface of the edge portion of the other side (second side) 10 of the long sides 9 and 10 of the circuit board 2. The electrode connecting portions 11 and 12 are electrically connected to an electronic circuit configured using the electronic component 8.

【0010】回路基板2はベース材1の上に固定されて
いる。ベース材1はアルミ板(金属板)よりなり、電子
部品8の発する熱を逃がす放熱板として機能する。コネ
クタ部3においてコネクタ用リード支持部材5は、図4
に示すように、第1のコネクタ用リード支持部材(以
下、単に第1の部材という)13と第2のコネクタ用リ
ード支持部材(以下、単に第2の部材という)14とか
らなる。第1の部材13は樹脂成形品であり、第1の接
続リードとしての多数の接続リード6が一体形成された
構造をなしている。より詳しくは、第1の部材13の本
体部13aは、水平方向に延びる長方形の板状をなし、
図2に示すように、接続リード6の一端側(上端側)が
立設状態にて支持され、他端側(下端側)が下面から突
出し、水平方向に延び、さらに、下方に延びている。各
接続リード6は長方形状の本体部13aの長辺において
一定の間隔を保持した状態で並設されている。
The circuit board 2 is fixed on the base material 1. The base material 1 is made of an aluminum plate (metal plate), and functions as a heat dissipation plate that dissipates heat generated by the electronic component 8. In the connector portion 3, the connector lead supporting member 5 is provided in
As shown in FIG. 1, it comprises a first connector lead supporting member (hereinafter, simply referred to as a first member) 13 and a second connector lead supporting member (hereinafter, simply referred to as a second member) 14. The first member 13 is a resin molded product, and has a structure in which a large number of connection leads 6 as first connection leads are integrally formed. More specifically, the main body portion 13a of the first member 13 has a rectangular plate shape extending in the horizontal direction,
As shown in FIG. 2, one end side (upper end side) of the connection lead 6 is supported in an upright state, and the other end side (lower end side) projects from the lower surface, extends in the horizontal direction, and further extends downward. . The connection leads 6 are juxtaposed in the long side of the rectangular main body 13a with a constant interval.

【0011】図4の第2の部材14は樹脂成形品であ
り、第2の接続リードとしての多数の接続リード7が一
体形成された構造をなしている。より詳しくは、第2の
部材14は、水平方向に延びる長方形の板状をなし、図
2に示すように、接続リード7の一端側(上端側)が立
設状態にて支持され、他端側(下端側)が下面から突出
し、水平方向に延び、さらに、下方に延びている。各接
続リード7は長方形状の第2の部材14の長辺において
一定の間隔を保持した状態で並設されている。
The second member 14 shown in FIG. 4 is a resin molded product, and has a structure in which a large number of connection leads 7 as second connection leads are integrally formed. More specifically, the second member 14 has a rectangular plate shape extending in the horizontal direction, and as shown in FIG. 2, one end side (upper end side) of the connection lead 7 is supported in an upright state and the other end. The side (lower end side) projects from the lower surface, extends in the horizontal direction, and further extends downward. The connection leads 7 are juxtaposed along the long side of the rectangular second member 14 with a constant spacing.

【0012】一方、図4の第1の部材13における本体
部13aの両端部からは棒状アーム部15が水平方向
に、かつ、互いに平行に延びている。この棒状アーム部
15における対向面には、図3に示すように、嵌合部と
しての嵌合凸条16が形成されている。又、第2の部材
14の側面には、図3に示すように、第1の部材13の
嵌合凸条16に対応する嵌合部としての嵌合凹条17が
形成され、第1の部材13の嵌合凸条16と第2の部材
14の嵌合凹条17とが嵌合している。
On the other hand, rod-shaped arm portions 15 extend horizontally and parallel to each other from both ends of the main body portion 13a of the first member 13 shown in FIG. As shown in FIG. 3, a fitting convex strip 16 as a fitting portion is formed on the facing surface of the rod-shaped arm portion 15. Further, as shown in FIG. 3, on the side surface of the second member 14, a fitting concave line 17 as a fitting portion corresponding to the fitting convex line 16 of the first member 13 is formed. The fitting protrusion 16 of the member 13 and the fitting recess 17 of the second member 14 are fitted together.

【0013】さらに、図2に示すように、第1の部材1
3の本体部13aと第2の部材14とが当接する面にお
いて第1の部材13には嵌合部としての嵌合凸条18が
形成されている。又、第2の部材14には、第1の部材
13の嵌合凸条18に対応する嵌合部としての嵌合凹条
19が形成され、第1の部材13の嵌合凸条18と第2
の部材14の嵌合凹条19とが嵌合している。
Further, as shown in FIG. 2, the first member 1
On the surface where the main body portion 13a of 3 and the second member 14 are in contact with each other, the first member 13 is provided with a fitting ridge 18 as a fitting portion. In addition, the second member 14 is formed with a fitting concave line 19 as a fitting portion corresponding to the fitting convex line 18 of the first member 13, and the fitting convex line 18 of the first member 13 is formed. Second
The fitting concave line 19 of the member 14 is fitted.

【0014】このように、第1の部材13の嵌合凸条1
6と第2の部材14の嵌合凹条17との嵌合、および、
第1の部材13の嵌合凸条18と第2の部材14の嵌合
凹条19との嵌合により、両部材13,14が嵌着して
いる。ここで、嵌合凸条16と嵌合凹条17とは摺動で
きるとともに、嵌合凸条18と嵌合凹条19とは摺動で
きるようになっている。
As described above, the fitting projection 1 of the first member 13
6 and the fitting groove 17 of the second member 14, and
By fitting the fitting protrusion 18 of the first member 13 and the fitting recess 19 of the second member 14, both members 13, 14 are fitted. Here, the fitting protrusion 16 and the fitting recess 17 can slide, and the fitting protrusion 18 and the fitting recess 19 can slide.

【0015】図5(部材13,14の平断面図)および
図6(図4のC部の拡大図)に示すように、第1の部材
13における嵌合凸条16の先端部には、抜け止め用突
起23が設けられるとともに、第2の部材14における
嵌合凹条17の先端部には突起23に対応する切り欠き
部24が形成されている。そして、この突起23と切り
欠き部24との嵌合により第2の部材14が抜け落ちな
いようになっている。
As shown in FIG. 5 (plan sectional views of the members 13 and 14) and FIG. 6 (enlarged view of portion C in FIG. 4), the tip of the fitting projection 16 in the first member 13 is A retaining projection 23 is provided, and a notch 24 corresponding to the protrusion 23 is formed at the tip of the fitting groove 17 of the second member 14. The second member 14 is prevented from falling off by fitting the projection 23 and the cutout portion 24.

【0016】図4の各接続リード6の下端部には、回路
基板2を両面から挟持するための挟持部20がそれぞれ
形成されている。又、各接続リード7の下端部には、回
路基板2を両面から挟持するための挟持部21がそれぞ
れ形成されている。
A holding portion 20 for holding the circuit board 2 from both sides is formed at the lower end of each connection lead 6 in FIG. Further, a holding portion 21 for holding the circuit board 2 from both sides is formed at the lower end of each connection lead 7.

【0017】図7,8に示すように、接続リード6,7
の挟持部20,21は帯状の接続リード6,7をU字状
に折り曲げることにより形成したものである。挟持部2
0,21の挟持間隔Wは嵌め込むべき回路基板2の厚さ
と同一寸法となっている。又、挟持部20,21の挟持
間隔Wの設計上の公差としてはマイナス公差になるよう
にし、回路基板2を挟み込んでも容易に外れないように
なっている。
As shown in FIGS. 7 and 8, connection leads 6 and 7 are provided.
The sandwiching portions 20 and 21 are formed by bending the strip-shaped connecting leads 6 and 7 into a U-shape. Holding part 2
The sandwiching distance W of 0 and 21 is the same as the thickness of the circuit board 2 to be fitted. In addition, the design tolerance of the sandwiching distance W between the sandwiching portions 20 and 21 is a minus tolerance so that the circuit board 2 cannot be easily removed even if the circuit board 2 is sandwiched.

【0018】この挟持部20,21の内の挟持部20が
回路基板2での第1の電極接続部11の設置位置におい
て回路基板2を両面から挟持するとともに、挟持部21
が第2の電極接続部12の設置位置において回路基板2
を両面から挟持している。又、挟持部20,21が回路
基板2の電極接続部11,12とはんだ付けされ、回路
基板2の電極接続部11,12と電気的に接続されてい
る。図7において、はんだを符号22で示す。
The sandwiching portion 20 of the sandwiching portions 20 and 21 sandwiches the circuit board 2 from both sides at the installation position of the first electrode connecting portion 11 on the circuit board 2, and the sandwiching portion 21.
At the installation position of the second electrode connecting portion 12
Is sandwiched from both sides. Further, the sandwiching portions 20 and 21 are soldered to the electrode connecting portions 11 and 12 of the circuit board 2, and are electrically connected to the electrode connecting portions 11 and 12 of the circuit board 2. In FIG. 7, the solder is indicated by reference numeral 22.

【0019】又、接続リード6,7の材料である燐青銅
(銅合金)は、ばね性が強い性質を有している。尚、図
2において、各接続リード6,7の上端側(入出力端
子)はコネクタを介してケーブル(車載ワイヤ)と接続
され、同ケーブルにてバッテリや各種アクチュエータと
接続される。
The phosphor bronze (copper alloy), which is the material of the connecting leads 6 and 7, has a strong spring property. In addition, in FIG. 2, the upper ends (input / output terminals) of the connection leads 6 and 7 are connected to a cable (vehicle-mounted wire) via a connector, and are connected to a battery and various actuators by the same cable.

【0020】次に、このように構成した車載エンジン制
御用コンピュータの組付け手順を説明する。電極接続部
(接続ランド)11,12を含む導電パターンが形成さ
れた回路基板2を用意し、この回路基板2にはんだ印刷
を行う。そして、回路基板2の上に電子部品8(電子回
路構成部品)を搭載し、さらに、回路基板2と電子部品
8を同時に加熱しはんだ接続を行う。その後、はんだ接
続できない電子部品8と導電パターン(基板パターン)
との接続を、Alワイヤボンディング等にて行う。
Next, the procedure for assembling the vehicle-mounted engine control computer thus configured will be described. A circuit board 2 on which a conductive pattern including electrode connection portions (connection lands) 11 and 12 is formed is prepared, and solder printing is performed on the circuit board 2. Then, the electronic component 8 (electronic circuit component) is mounted on the circuit board 2, and the circuit board 2 and the electronic component 8 are heated at the same time for solder connection. After that, electronic parts 8 and conductive patterns (board patterns) that cannot be soldered
Connection with Al is performed by Al wire bonding or the like.

【0021】引き続き、コネクタ用リード支持部材5を
構成する第1の部材13と第2の部材14とを二部品と
して分け、第1の部材13における接続リード6の挟持
部20を、回路基板2における長辺9での縁部に挟み込
む。つまり、図7に示すように、回路基板2の第1の電
極接続部11の形成部分に、接続リード6の挟持部20
を挟み込む。
Subsequently, the first member 13 and the second member 14 constituting the connector lead supporting member 5 are divided into two parts, and the sandwiching portion 20 of the connecting lead 6 in the first member 13 is connected to the circuit board 2. It is sandwiched at the edge portion at the long side 9 in. That is, as shown in FIG. 7, the sandwiching portion 20 of the connection lead 6 is formed in the portion where the first electrode connecting portion 11 of the circuit board 2 is formed.
Sandwich.

【0022】さらに、第1の部材13の嵌合凸条16に
対し第2の部材14の嵌合凹条17の先端部を嵌合さ
せ、この状態で、図4に示すように、第2の部材14を
水平方向に移動させて嵌合凸条16に嵌合凹条17を摺
動させつつ接続リード7の挟持部21を回路基板2にお
ける長辺10での縁部(第2の電極接続部12)に挟み
込む。このとき、図7に示すように、基板2の面方向L
3に対し挟持部21の挟持方向(U字状の挟持部21の
中心線)が一致する方向(図7中、B方向)に接続リー
ド7の挟持部21を移動させる。そして、第2の部材1
4の嵌合凹条19と第1の部材13の嵌合凸条18とが
嵌合するとともに、抜け止め用突起23と切り欠き部2
4とが嵌合して、第1の部材13と第2の部材14との
嵌合が終了して両者が一体化する。
Further, the tip end portion of the fitting concave line 17 of the second member 14 is fitted to the fitting convex line 16 of the first member 13, and in this state, as shown in FIG. Member 14 is moved in the horizontal direction to slide the fitting groove 17 on the fitting ridge 16 and the holding portion 21 of the connection lead 7 is formed on the long side 10 of the circuit board 2 (second electrode). It is inserted in the connection part 12). At this time, as shown in FIG.
The sandwiching portion 21 of the connecting lead 7 is moved in a direction (the B direction in FIG. 7) in which the sandwiching direction of the sandwiching portion 21 (the center line of the U-shaped sandwiching portion 21) with respect to 3 coincides. And the second member 1
The fitting concave line 19 of No. 4 and the fitting convex line 18 of the first member 13 are fitted with each other, and the retaining projection 23 and the notch 2
4 is fitted, and the fitting of the first member 13 and the second member 14 is completed and the two are integrated.

【0023】その後、図7に示すように、接続リード
6,7が並設されている箇所にディスペンサにてはんだ
ペースト(粒状のはんだ材とフラックスと溶剤を混合し
ペースト状にしたもの)を供給する。さらに、レーザビ
ーム等による局所的加熱可能な手段を利用してはんだを
溶融させて挟持部20,21と電極接続部11,12と
を接合する。このようにして、挟持部20,21と電極
接続部11,12のはんだ付けが行われ、電極接続部1
1,12と挟持部20,21とがはんだにて電気的・機
械的に接続される。
Thereafter, as shown in FIG. 7, a solder paste (a paste made by mixing a granular solder material, flux and a solvent) is supplied to a place where the connection leads 6 and 7 are arranged in parallel by a dispenser. To do. Further, the solder is melted by using a means capable of locally heating with a laser beam or the like, and the sandwiching portions 20 and 21 and the electrode connecting portions 11 and 12 are joined. In this way, the sandwiching portions 20 and 21 and the electrode connecting portions 11 and 12 are soldered, and the electrode connecting portion 1
1, 12 and the sandwiching parts 20, 21 are electrically and mechanically connected by soldering.

【0024】このように回路基板2とコネクタ部3を一
体の構造物とした上で、ベース材1の上に回路基板2を
接着固定する。その後、ベース材1上にケース材4を上
方から被せて組付ける。より具体的には、ベース材1と
ケース材4の接触面(接触部)の一方に耐熱性の接着剤
を塗布し、両者を接着する。その結果、製品として完成
する。
In this way, the circuit board 2 and the connector portion 3 are formed into an integral structure, and then the circuit board 2 is adhesively fixed onto the base material 1. Then, the case member 4 is put on the base member 1 from above and assembled. More specifically, a heat resistant adhesive is applied to one of the contact surfaces (contact portions) of the base material 1 and the case material 4 to bond them. As a result, it is completed as a product.

【0025】このように本実施の形態では、接続リード
6,7を支持するコネクタ用リード支持部材5を、第1
の部材13と第2の部材14とに別体化し、第1の部材
13と第2の部材14とに両部材を嵌着させるための嵌
合部(16,17,18,19)を付設し、組付けの際
には、第1の部材13における第1の接続リード6の挟
持部20を、四角板状の回路基板2における長辺9での
第1の接続部11に対し両面から挟み込み、第2の部材
14における第2の接続リード7の挟持部21を、四角
板状の回路基板2における長辺9に対向する長辺10で
の第2の接続部12に対し両面から挟み込み、さらに、
嵌合部(16,17,18,19)により第1の部材1
3と第2の部材14とを嵌着して一体化する。このよう
に、第1の部材13と第2の部材14とを二部品として
分けた状態において接続リードの挟持部20,21を、
基板2に対して最も応力が加わりにくい方向から回路基
板2に挟み込むことができ、基板2の割れを回避するこ
とができ、作業性もよくなる。その結果、リードの先端
の挟持部20,21により基板2に無用な応力が加わる
ことがなく容易にリードを基板側に接続することができ
る。よって、生産性を上げることができ、製品のコスト
ダウンを図ることができる。
As described above, in the present embodiment, the connector lead supporting member 5 for supporting the connection leads 6 and 7 is provided with the first
And a fitting portion (16, 17, 18, 19) for fitting both members to the first member 13 and the second member 14 At the time of assembling, the sandwiching portion 20 of the first connecting lead 6 in the first member 13 is attached to the first connecting portion 11 on the long side 9 of the rectangular plate-shaped circuit board 2 from both sides. The sandwiching portion 21 of the second connecting lead 7 in the second member 14 is sandwiched from both sides with respect to the second connecting portion 12 in the long side 10 opposite to the long side 9 in the rectangular plate-shaped circuit board 2. ,further,
The first member 1 by the fitting portion (16, 17, 18, 19)
3 and the second member 14 are fitted and integrated. In this way, in the state where the first member 13 and the second member 14 are divided into two parts, the holding portions 20 and 21 of the connection lead are
The circuit board 2 can be sandwiched from the direction in which the stress is least applied to the circuit board 2, cracks in the circuit board 2 can be avoided, and workability is improved. As a result, it is possible to easily connect the leads to the substrate side without applying unnecessary stress to the substrate 2 by the sandwiching portions 20 and 21 at the tips of the leads. Therefore, the productivity can be increased and the cost of the product can be reduced.

【0026】又、図11に示した構造においては、リー
ドの挟持部34の幅を基板30の幅よりも大きく広げる
必要があったが本構成ではそのような作業も必要なく、
作業が容易なものとなるとともに、接続部との位置合わ
せも確実に行うことができ組付け精度を上げることがで
きる。
Further, in the structure shown in FIG. 11, it was necessary to widen the width of the lead pinching portion 34 to be larger than the width of the substrate 30, but this construction does not require such work.
The work is facilitated, and the alignment with the connecting portion can be surely performed, so that the assembling accuracy can be improved.

【0027】又、組付け後において第1の部材13の嵌
合凸条16と第2の部材14の嵌合凹条17との嵌合に
加え、第1の部材13の本体部13aと第2の部材14
とが当接する面においては第2の部材14の嵌合凹条1
9と第1の部材13の嵌合凸条18とが嵌合しており、
第1の部材13の本体部13aと第2の部材14との間
に上下方向にズレる力が作用してもズレ難い。
After the assembly, in addition to the fitting between the fitting protrusions 16 of the first member 13 and the fitting recesses 17 of the second member 14, the main body portion 13a of the first member 13 and the first 2 member 14
On the surface where and come into contact with each other, the fitting concave line 1 of the second member 14
9 and the fitting ridge 18 of the first member 13 are fitted together,
Even if a vertical displacement force acts between the main body portion 13a of the first member 13 and the second member 14, the displacement is unlikely to occur.

【0028】この発明の他の態様を以下に説明する。上
述した例においては、第1の部材13の嵌合凸条16と
第2の部材14の嵌合凹条17との嵌合、および、第1
の部材13の嵌合凸条18と第2の部材14の嵌合凹条
19との嵌合により、両部材13,14を嵌着したが、
第1の部材13の嵌合凸条16と第2の部材14の嵌合
凹条17との嵌合のみにより両部材13,14を嵌着す
るようにしてもよい。又、第1の部材13の嵌合凸条1
8と第2の部材14の嵌合凹条19との嵌合のみにより
両部材13,14を嵌着するようにしてもよい。この
際、嵌合凸条18と嵌合凹条19とを嵌合した後に、高
温熱処理を施して両部材13,14の嵌着の強度を増す
ようにしてもよい。
Another aspect of the present invention will be described below. In the example described above, the fitting protrusion 16 of the first member 13 and the fitting recess 17 of the second member 14 are fitted together, and the first
The members 13 and 14 are fitted by fitting the fitting ridge 18 of the member 13 and the fitting recess 19 of the second member 14,
Both members 13 and 14 may be fitted only by fitting the fitting ridge 16 of the first member 13 and the fitting ridge 17 of the second member 14. In addition, the fitting ridge 1 of the first member 13
Both members 13 and 14 may be fitted only by fitting the fitting recessed portion 19 of the second member 14 to the fitting member 8. At this time, after the fitting convex strip 18 and the fitting concave strip 19 are fitted to each other, high-temperature heat treatment may be performed to increase the strength of the fitting between the members 13 and 14.

【0029】又、挟持部20,21と回路基板2の電極
接続部11,12とをはんだの代わりに導電性接着剤に
て接合してもよい。さらに、接続リード6,7の材料と
しては真鍮等でもよい。
Further, the sandwiching portions 20 and 21 and the electrode connecting portions 11 and 12 of the circuit board 2 may be joined with a conductive adhesive instead of solder. Further, the material of the connecting leads 6 and 7 may be brass or the like.

【0030】さらには、基板として導電パターンが印刷
されただけのプリント基板であってもよい。即ち、L成
分よりなる回路基板を用いてもよい。
Furthermore, a printed circuit board on which a conductive pattern is simply printed may be used as the circuit board. That is, you may use the circuit board which consists of L components.

【図面の簡単な説明】[Brief description of drawings]

【図1】エンジン制御用コンピュータの分解斜視図。FIG. 1 is an exploded perspective view of an engine control computer.

【図2】エンジン制御用コンピュータの縦断面図。FIG. 2 is a vertical sectional view of an engine control computer.

【図3】図1のA−A部分での縦断面図。3 is a vertical cross-sectional view taken along the line AA of FIG.

【図4】コネクタ用リード支持部材の分解斜視図。FIG. 4 is an exploded perspective view of a connector lead support member.

【図5】コネクタ用リード支持部材における第1部材と
第2部材の嵌合状態を示す平断面図。
FIG. 5 is a plan cross-sectional view showing a fitted state of a first member and a second member of a connector lead supporting member.

【図6】図4のC部の拡大図。6 is an enlarged view of a C portion of FIG.

【図7】リードと基板との接続部の拡大図。FIG. 7 is an enlarged view of a connecting portion between a lead and a substrate.

【図8】リードと基板との接続部の拡大図。FIG. 8 is an enlarged view of a connecting portion between a lead and a substrate.

【図9】従来技術を説明するための分解斜視図。FIG. 9 is an exploded perspective view for explaining a conventional technique.

【図10】従来技術を説明するための縦断面図。FIG. 10 is a vertical cross-sectional view for explaining a conventional technique.

【図11】従来技術を説明するための縦断面図。FIG. 11 is a vertical sectional view for explaining a conventional technique.

【符号の説明】[Explanation of symbols]

2…回路基板、6…接続リード(第1の接続リード)、
7…接続リード(第2の接続リード)、9…長辺(第1
の辺)、10…長辺(第2の辺)、11…第1の電極接
続部、12…第2の電極接続部、13…第1の部材(第
1のコネクタ用リード支持部材)、14…第2の部材
(第2のコネクタ用リード支持部材)、16…嵌合部と
しての嵌合凸条、17…嵌合部としての嵌合凹条、18
…嵌合部としての嵌合凸条、19…嵌合部としての嵌合
凹条、20…挟持部、21…挟持部
2 ... Circuit board, 6 ... Connection lead (first connection lead),
7 ... Connection lead (second connection lead), 9 ... Long side (first
Side), 10 ... long side (second side), 11 ... first electrode connecting portion, 12 ... second electrode connecting portion, 13 ... first member (first connector lead supporting member), Reference numeral 14 ... Second member (second connector lead support member), 16 ... Fitting convex strip as a fitting portion, 17 ... Fitting concave strip as a fitting portion, 18
... fitting ridges as a fitting portion, 19 ... fitting recesses as a fitting portion, 20 ... sandwiching portion, 21 ... sandwiching portion

───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7,DB名) H01R 9/09 H01R 23/68 302 H05K 1/18 ─────────────────────────────────────────────────── ─── Continuation of the front page (58) Fields surveyed (Int.Cl. 7 , DB name) H01R 9/09 H01R 23/68 302 H05K 1/18

Claims (2)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 四角板状をなし、第1の辺での縁部に第
1の接続部が形成されるとともに、前記第1の辺に対向
する第2の辺での縁部に第2の接続部が形成された回路
基板と、 一端に、前記回路基板における前記第1の接続部を両面
から挟持する挟持部を有する第1の接続リードと、 一端に、前記回路基板における前記第2の接続部を両面
から挟持する挟持部を有する第2の接続リードと、 前記回路基板の上方において前記第1の接続リードの他
端側を支持する第1のコネクタ用リード支持部材と、 前記回路基板の上方において前記第2の接続リードの他
端側を支持する第2のコネクタ用リード支持部材と、 前記第1のコネクタ用リード支持部材における前記第1
の辺に直交する方向に付設された嵌合凸部と、 前記 第2のコネクタ用リード支持部材における前記第2
の辺に直交する方向であって前記嵌合凸部を嵌合可能に
形成された嵌合部とを備えたことを特徴とする電子回
路装置。
1. A rectangular plate shape, a first connecting portion is formed on an edge portion of a first side, and a second connecting portion is formed on an edge portion of a second side opposite to the first side. A first connecting lead having a holding portion for holding the first connecting portion of the circuit board from both sides, and a second connecting board of the second connecting portion of the circuit board at one end thereof. A second connecting lead having a sandwiching portion for sandwiching the connecting portion from both sides; a first connector lead supporting member supporting the other end side of the first connecting lead above the circuit board; A second connector lead support member that supports the other end side of the second connection lead above the board; and the first connector lead support member in the first connector lead support member .
A fitting protrusion which is attached in a direction perpendicular to the sides, the second in the second connector lead supporting member
The fitting convex part can be fitted in the direction orthogonal to the side of
Electronic circuit device is characterized in that a fitting recessed portion which is formed.
【請求項2】 前記嵌合凸部には抜け防止用突起が設け
られ、前記嵌合凹部における前記抜け防止用突起に対応
する位置には、前記抜け防止用突起を嵌合する切り欠き
部が形成されていることを特徴とする請求項1に記載の
電子回路装置。
2. A protrusion for preventing disengagement is provided on the fitting protrusion.
Corresponds to the protrusion for preventing the removal in the fitting recess
At the position where the
The portion according to claim 1, wherein the portion is formed.
Electronic circuit device.
JP29712595A 1995-11-15 1995-11-15 Electronic circuit device Expired - Fee Related JP3465451B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP29712595A JP3465451B2 (en) 1995-11-15 1995-11-15 Electronic circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29712595A JP3465451B2 (en) 1995-11-15 1995-11-15 Electronic circuit device

Publications (2)

Publication Number Publication Date
JPH09139243A JPH09139243A (en) 1997-05-27
JP3465451B2 true JP3465451B2 (en) 2003-11-10

Family

ID=17842543

Family Applications (1)

Application Number Title Priority Date Filing Date
JP29712595A Expired - Fee Related JP3465451B2 (en) 1995-11-15 1995-11-15 Electronic circuit device

Country Status (1)

Country Link
JP (1) JP3465451B2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100302363B1 (en) * 1999-06-30 2001-11-01 이계철 Terminal block
JP3975958B2 (en) * 2003-04-22 2007-09-12 松下電工株式会社 connector
JP2007533518A (en) 2003-08-01 2007-11-22 シーメンス アクチエンゲゼルシヤフト Electronic device unit and method for manufacturing the electronic device unit
JP2020123698A (en) * 2019-01-31 2020-08-13 株式会社デンソーテン Electronic device

Also Published As

Publication number Publication date
JPH09139243A (en) 1997-05-27

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