JPH0557811U - High frequency coil - Google Patents

Abstract

(57) [Abstract] [Purpose] The present invention eliminates temporary fixing of the chip element, simplifies the assembly work, and secures the degree of freedom of the configuration of the chip element, thereby improving the production efficiency and soldering. An object of the present invention is to provide a high frequency coil with improved reliability of attachment. [Structure] A base 11, a plurality of terminals 12 and 13 penetrating vertically through the base and having a lower end protruding in a pin shape, a coil element mounted on the base, and a base on the base. , A chip element 16 electrically connected to the terminal, in the high-frequency coil 10, on the upper surface of the base,
Metal terminal portions 14 and 15 are provided in the areas of the electrode portions and the terminals of each chip element, and the metal terminal portions are electrically connected to the terminals on one side by soldering or the like. The high-frequency coil 10 is configured such that the electrode portion of the chip element is placed on the upper surface of the other side and soldered.

Description

[Detailed description of the device]

[0001]

[Industrial application]

 The present invention relates to a high-frequency coil, such as a filter, RF, IF, or OSC circuit, which is miniaturized by mounting a chip element together with a coil element on a base.

[0002]

[Prior Art]

 Conventionally, such a high-frequency coil is configured, for example, as shown in FIG. That is, in FIG. 3, the high-frequency coil 1 has, for example, a drum core around which a coil (not shown) is wound, a cap core, and the like are arranged on a resin-molded substantially rectangular parallelepiped base 2, and the whole is shown by a chain line. It is constructed by being covered by the shield case 3 shown.

Two terminals 4 and 5 are respectively planted on the edges of the base 2 that face each other so as to project upward from the upper surface of the base 2. Each of the lower ends projects downward from the lower surface of the base 2 and is formed into a pin shape. When the lower end is mounted on a printed circuit board (not shown), it is inserted into a hole provided in the printed circuit board. It is fixed and soldered so that it can be electrically connected.

Of the pair of terminals 4 and 5 protruding from the upper surface of the base 2, one terminal, in the case of the terminal 4 in the figure, is a chip element, for example, a chip capacitor, as shown in the figure. 6 are provided. The chip capacitor 6 is temporarily fixed by, for example, applying an adhesive 8 to the upper surface of the base 2 between the terminals 4, and then the electrode portion of the chip capacitor 6 and the upper end of each terminal 4 Soldered together and can be fixed and electrically connected (see FIG. 5). Further, the winding lead terminals of the coil element are wound around the terminals 4 and 5 and connected by soldering or the like.

The high-frequency coil 1 thus configured has the above-described printed board by inserting the lower ends of the terminals 4 and 5 into the holes provided in the printed board and soldering the terminals 4 and 5. Can be implemented on.

[0006]

[Problems to be solved by the device]

 However, in the conventional high-frequency coil 1 configured as described above, it is necessary to temporarily fix the chip capacitor 6 with an adhesive, which complicates the assembly work, is troublesome, and increases the cost. Moreover, it is necessary to accurately match the distance between the terminals 4 and the size of the chip capacitors 6 arranged between the terminals 4, which limits the degree of freedom in the configuration, and different chip capacitors are different. Since the base 2 having the above structure must be prepared, the production efficiency is reduced, and the terminal 4 is usually formed in a circular cross section. Therefore, the terminal 4 and the electrode portion of the chip capacitor 6 are formed. There is a problem that the contact area with the solder is relatively small and therefore the reliability of soldering is not very high.

In view of the above points, the present invention eliminates temporary fixing of chip elements such as chip capacitors, simplifies the assembly work, and secures the degree of freedom in the configuration of the chip elements to be soldered. Therefore, it is an object of the present invention to provide a high frequency coil which improves the production efficiency and further improves the reliability of soldering.

[0008]

[Means for Solving the Problems]

 According to the present invention, the above object is to mount a coil base on which a coil element is mounted, a plurality of terminals vertically penetrating the base and projecting in a pin shape at a lower end, and a plurality of terminals mounted on the base. In a high-frequency coil comprising a coil element to be attached and a chip element electrically connected to the terminal on the base, an electrode part of each chip element and an electrode part of each chip element are provided on the upper surface of the base. A metal terminal portion is provided in the area of the terminal, the metal terminal portion is electrically connected to the terminal on one side by soldering or the like, and the chip element is provided on the upper surface of the other side. This is achieved by a high-frequency coil, characterized in that the electrode part of is placed and electrically connected.

[0009]

[Action]

 According to the above configuration, the metal terminal portions are provided in the regions that connect the respective terminals projecting on the upper surface of the base to the electrode portions of the chip element. The electrode portion of the chip element is mounted on the upper surface of the other side of the metal terminal portion while being electrically connected to one side of the portion by soldering or the like. , Will be placed on the flat surface of the metal terminal portion.

Therefore, since the contact area of the electrode portion with the metal terminal portion is relatively large, the stability of the electrode portion of the chip element is relatively high, and the temporary fixing of the chip element is unnecessary. Also can be securely fixed by soldering and can be electrically connected, so that the reliability of soldering is improved.

Furthermore, since the electrode portion of the chip element is mounted and soldered on the horizontal surface of the metal terminal portion electrically connected to the terminal by soldering, There is a degree of freedom regarding the size of the electrode portion of the chip element, and since chip elements of various sizes can be mounted, the production efficiency can be improved.

[0012]

【Example】

 Hereinafter, the present invention will be described in detail with reference to the embodiments shown in the drawings. FIG. 1 shows an embodiment of a high frequency coil according to the present invention.

The high-frequency coil 10 includes, for example, a drum core, a cap core, and the like, around which a coil (not shown) is wound, arranged on a resin-molded base 11 having a substantially rectangular parallelepiped shape. It is constructed by being covered by a shield case.

The base 11 is arranged along one side (on the front side in the drawing) along the longitudinal direction, and two terminal insertion holes 11a are formed on the other side (on the other side in the drawing) in the longitudinal direction. Two terminal insertion holes 11b are formed so as to extend vertically through the base 11, and the terminal insertion holes 11a and 11b are formed on the upper surface of the base 11. The groove portions 11c and 11d provided in the longitudinal direction are provided with openings on the bottom surfaces thereof.

A chip element accommodating portion 11e is formed in the vicinity of the center of the upper surface of the base 11, and is connected to the respective groove portions 11c and 11d via cutout portions.

The terminals 12 and 13 are respectively inserted into the terminal insertion holes 11a and 11b by press fitting or the like, and the upper ends of the terminals 12 and 13 are, as shown in the drawing, the groove portions 11c and 11d, respectively. Project inside.

Here, substantially H-shaped metal terminal portions 14 and 15 are inserted in the regions extending from the groove portions 11c and 11d to the vicinity of the end portion of the chip element accommodating portion 11e through the cutout portions, and Since it is fixed to one of the terminals 12 and 13, in the case of the drawing, the terminals 12 and 13 on the right side, respectively, of the one side located in the groove portions 11c and 11d of the metal terminal portions 14 and 15 are located. It is designed to be electrically connected to the part by soldering or the like.

Here, the metal terminal portion 14 can be electrically connected by flipping the front and back to form the shape shown by the alternate long and short dash line in FIG. 2 and soldering it to the terminal 12 on the left side. The same applies to the case of the metal terminal portion 15 and the terminal 13.

Cream solder S is applied to the other side portions of the metal terminal portions 14 and 15 located near the ends in the chip element accommodating portion 11e, and then in the chip element accommodating portion 11e, The chip capacitor 16 is inserted. As a result, the electrode portions 16a and 16b at both ends of the chip capacitor 16 are placed on the surfaces of the other side portions of the metal terminal portions 14 and 15 located near the end portions inside the chip element housing portion 11e, respectively. Then, by melting the cream solder applied to that portion, automatic soldering can be performed (see FIG. 2).

At that time, the chip capacitor 16 is placed on the flat surface of the other side portion of the metal terminal portions 14 and 15, and is sandwiched by the side wall of the chip element accommodating portion 11e. It will be held stably. Therefore, temporary fixing of the chip capacitor 16 at the time of soldering is unnecessary.

The high-frequency coil 10 according to the present invention is constructed as described above. The coil 10 is electrically connected to the upper portion of each terminal 12, 13 by soldering or the like to one side of the metal terminal portion 14, 15. The electrode parts 16a and 16b of the chip capacitor 16 are placed on the other side of the metal terminal parts 14 and 15, respectively.

Therefore, since the electrode portions 16a and 16b of the chip capacitor 16 are placed on the flat surfaces of the metal terminal portions 14 and 15, the metal terminal portions 14 and 15 of the electrode portions 16a and 16b are mounted. The contact area with respect to is relatively large.

As a result, the stability of the chip capacitor 16 with respect to the metal terminal portions 14 and 15 becomes relatively high, so that the chip capacitor 16 does not need to be temporarily fixed, and soldering ensures that the chip capacitor 16 is securely fixed and It can be electrically connected.

The high-frequency coil 11 configured as described above is configured such that the lower ends of the terminals 12 and 13 are inserted into the mounting holes provided on the printed circuit board and the terminals 12 and 13 are soldered to each other. It can be mounted on a printed circuit board.

In the above-described embodiment, the metal terminal portions 14 and 15 are manufactured separately from the base 11 by pressing a metal plate, but the invention is not limited to this. It can be formed by applying a conductive adhesive or printing an electrode portion on a predetermined portion of the upper surface, and also by forming a metal plate integrally with the base 11. Can be done.

[0025]

[Effect of the device]

 As described above, according to the present invention, the temporary fixing of the chip element such as the chip capacitor is eliminated, the assembling work is simplified, and the flexibility of the configuration of the chip element to be soldered is secured. As a result, it is possible to provide an extremely high-frequency coil that improves production efficiency and has high reliability in soldering.

[Brief description of drawings]

FIG. 1 is an exploded perspective view showing an embodiment of a high frequency coil according to the present invention.

FIG. 2 is a schematic perspective view showing a positional relationship among terminals, metal terminal portions and chip capacitors in the high frequency coil shown in FIG.

FIG. 3 is an exploded perspective view showing an example of a conventional high frequency coil.

FIG. 4 is a perspective view showing a base on which a chip element of a conventional high frequency coil is mounted.

5 is a schematic cross-sectional view of the base of FIG.

[Explanation of symbols]

 10 high frequency coil 11 base 11a, 11b terminal insertion hole 11c, 11d groove 11e chip element housing 12, 13 terminal 14, 15 metal terminal 16 chip capacitor (chip element)

Claims (1)

[Scope of utility model registration request] 1. A base on which a coil element is to be mounted, a plurality of terminals penetrating vertically through the base and having a lower end protruding in a pin shape, and a coil element mounted on the base. A high-frequency coil, comprising: a chip element electrically connected to the terminal on the base, wherein a metal is provided on an upper surface of the base in an electrode portion of each chip element and a region of the terminal. A terminal part is provided, the metal terminal part is electrically connected to the terminal on one side by soldering or the like, and the electrode part of the chip element is placed on the upper surface of the other side. A high-frequency coil, which is electrically connected.