JPH0751830Y2 - High frequency oscillator - Google Patents
High frequency oscillatorInfo
- Publication number
- JPH0751830Y2 JPH0751830Y2 JP1990051824U JP5182490U JPH0751830Y2 JP H0751830 Y2 JPH0751830 Y2 JP H0751830Y2 JP 1990051824 U JP1990051824 U JP 1990051824U JP 5182490 U JP5182490 U JP 5182490U JP H0751830 Y2 JPH0751830 Y2 JP H0751830Y2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- shield case
- ground electrode
- external connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
【考案の詳細な説明】 本考案は自動車電話及びその他の無線機等に使用する高
周波発振装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a high frequency oscillating device for use in a car telephone and other wireless devices.
従来の技術 従来は面実装タイプの高周波発振装置は、第３図〜第５
図のような構造になっていた。2. Description of the Related Art Conventionally, surface mount type high frequency oscillators are shown in FIGS.
It had the structure shown in the figure.
すなわち、シールドケース７内にプリント基板８を設
け、前記プリント基板８の上面にはチップ部品11及び発
振素子等を配置していた。プリント基板８下面のＬ字型
の外部接続端子９はシールドケース７下に突出させ、ま
たシールドケース７の一部を折曲げて接地端子10として
いる。さらにプリント基板８の下面の接地電極とシール
ドケース７をハンダ付等で接続していた。That is, the printed circuit board 8 is provided in the shield case 7, and the chip component 11 and the oscillation element are arranged on the upper surface of the printed circuit board 8. The L-shaped external connection terminal 9 on the lower surface of the printed circuit board 8 is projected below the shield case 7, and a part of the shield case 7 is bent to form a ground terminal 10. Further, the ground electrode on the lower surface of the printed board 8 and the shield case 7 are connected by soldering or the like.
考案が解決しようとする課題 しかし、このような構造のものではプリント基板８とシ
ールドケース７をハンダ付固定するために、プリント基
板８の下面の接地電極とシールドケース７をハンダ付け
するには、シールドケース７の下端がプリント基板８下
にまで下がり、さらに外部接続端子９を下方に突出させ
ているので、薄形化及び端子９が必要なためコスト的に
も問題があった。However, in order to fix the printed circuit board 8 and the shield case 7 by soldering with such a structure, in order to solder the ground electrode on the lower surface of the printed circuit board 8 and the shield case 7, Since the lower end of the shield case 7 is lowered to below the printed circuit board 8 and the external connection terminals 9 are projected downward, there is a problem in terms of cost because thinning and terminals 9 are required.
本考案は以上のような従来の欠点を除去し薄形で安価な
高周波発振装置を提供することを目的とするものであ
る。An object of the present invention is to provide a thin and inexpensive high-frequency oscillating device by eliminating the above-mentioned conventional defects.
課題を解決するための手段 そしてこの目的を達成するための本考案の技術的手段
は、上面に発振回路が装着されたプリント基板と、この
プリント基板の上面を覆うシールドケースとを備え、前
記プリント基板は、その側面に側面接地電極を、側面ま
たは、底面には外部接続用電極をそれぞれ有し、前記シ
ールドケースは前記側面接地電極が一部露出するように
前記プリント基板側面に嵌合されるとともにハンダによ
り電気的及び機械的に接続され、前記シールドケースの
側面の一部を、前記プリント基板への接続部より長く突
出させ、この突出部分を外側方向に折曲げたものであ
る。Means for Solving the Problems And the technical means of the present invention for achieving this object comprises a printed circuit board having an oscillating circuit mounted on the upper surface thereof, and a shield case for covering the upper surface of the printed circuit board. The board has a side surface ground electrode on a side surface thereof and an external connection electrode on a side surface or a bottom surface thereof, and the shield case is fitted to the side surface of the printed circuit board so that the side surface ground electrode is partially exposed. In addition, the shield case is electrically and mechanically connected, a part of the side surface of the shield case is projected longer than the connection part to the printed circuit board, and the projection part is bent outward.
作用 以上の構成によれば、シールドケースはプリント基板に
嵌合するとともに、このプリント基板の側面接地電極が
一部露出するようにハンダにより電気的及び機械的に接
続されるので、前記プリント基板の下面側に前記シール
ドケースが突出することはなく、したがって薄形化が可
能となるとともに、直接親プリント基板等に面実装する
ことができ、しかもこの場合前記プリント基板の側面ま
たは底面に外部接続用電極を設けているので、直接親基
板等に接続することができ、従来のように別異の外部接
続端子が不要となり低価格な高周波発振装置が提供でき
ることになる。またシールドケースの側面の一部を、プ
リント基板への接続部より長く突出させ、この突出部分
を外側方向に折曲げたものであるので、シールドケース
をプリント基板に嵌合させる時にこの突出部分がガイド
となって嵌合がスムーズに行える。With the above configuration, the shield case is fitted to the printed circuit board, and is electrically and mechanically connected by solder so that the side surface ground electrode of the printed circuit board is partially exposed. Since the shield case does not protrude to the lower surface side, it can be made thinner and can be directly surface-mounted on the parent printed circuit board or the like, and in this case, it is used for external connection on the side surface or the bottom surface of the printed circuit board. Since the electrodes are provided, the electrodes can be directly connected to the parent board and the like, and different external connection terminals as in the conventional case are not required, and a low-cost high-frequency oscillator can be provided. Also, a part of the side surface of the shield case is projected longer than the connecting portion to the printed circuit board, and this projecting portion is bent outward, so that when the shield case is fitted to the printed circuit board, this projecting portion is Can be used as a guide for smooth fitting.
実施例 以下、本考案の一実施例を添付図面第１図、第２図ａ〜
ｃに基づいて説明する。第１図においてプリント基板５
の上面に発振回路及びアンプ回路等を構成し、側面には
外部接続用端子電極２−1,2及び接地電極4,4−１を設け
る。このプリント基板５とシールドケース１を嵌合して
その上面を覆うとともに、側面の接地電極4,4−１が一
部露出するようにシールドケース１を配置し、この部分
でハンダ付により接続固定する。また、シールドケース
１のプリント基板５の側面接地電極4,4−１とのハンダ
付部の両側両部を下方に突出させた突出部３−1,3−2,3
−3,3−４を外側に少し曲げかつ、接地電極４の外部接
続用接地電極6,6−1,6−2,6−３に位置を合わせる。上
記とすることにより、プリント基板５とシールドケース
１を嵌合する時にシールドケース１の突出部３−1,3−
2,3−3,3−４の外部に折曲げた部分がガイドとなり嵌合
が容易である。なお、突出部３−1,3−2,3−3,3−４は
両側でなく中央のみでもよい。Embodiment Hereinafter, one embodiment of the present invention will be described with reference to FIGS.
A description will be given based on c. The printed circuit board 5 in FIG.
An oscillation circuit, an amplifier circuit, etc. are formed on the upper surface of the above, and external connection terminal electrodes 2-1 and 2 and ground electrodes 4 and 4-1 are provided on the side surfaces. The printed circuit board 5 and the shield case 1 are fitted to each other to cover the upper surface thereof, and the shield case 1 is arranged so that the ground electrodes 4 and 4-1 on the side surfaces are partially exposed. At this portion, the connection is fixed by soldering. To do. Further, both side portions of the soldered portion with the side surface ground electrodes 4, 4-1 of the printed circuit board 5 of the shield case 1 are protruded downward so as to project downwardly 3-1, 3-2, 3
Bend -3 and 3-4 to the outside and align them with the external connection ground electrodes 6, 6-1 6-2 and 6-3 of the ground electrode 4. By the above, when the printed circuit board 5 and the shield case 1 are fitted together, the protrusions 3-1 and 3− of the shield case 1 are formed.
The part of 2,3-3,3-4 bent to the outside serves as a guide for easy fitting. The protrusions 3-1, 3-2, 3-3, 3-4 may be provided only in the center instead of on both sides.
考案の効果 以上のように本考案は、上面に発振回路が装着されたプ
リント基板と、このプリント基板の上面を覆うシールド
ケースとを備え、前記プリント基板は、その側面に側面
接地電極を、側面または、底面には外部接続用電極をそ
れぞれ有し、前記シールドケースは前記側面接地電極が
一部露出するように前記プリント基板側面に嵌合される
とともにハンダにより電気的及び機械的に接続され、前
記シールドケースの側面の一部を、前記プリント基板へ
の接続部より長く突出させ、この突出部分を外側方向に
折曲げたものである。As described above, the present invention includes the printed circuit board having the oscillation circuit mounted on the upper surface and the shield case that covers the upper surface of the printed circuit board, and the printed circuit board has the side surface ground electrode on the side surface and the side surface. Alternatively, each of the bottom surfaces has an external connection electrode, and the shield case is electrically and mechanically connected by solder while being fitted to the side surface of the printed circuit board so that the side surface ground electrode is partially exposed. A part of the side surface of the shield case is projected longer than the connecting portion to the printed circuit board, and the projecting portion is bent outward.
そして以上の構成とすれば、シールドケースはプリント
基板に嵌合するとともに、このプリント基板の側面接地
電極が一部露出するようにハンダにより電気的及び機械
的に接続されるので、前記プリント基板の下面側に前記
シールドケースが突出することはなく、したがって薄形
化が可能となるとともに、直接親プリント基板等に面実
装することができ、しかもこの場合前記プリント基板の
側面または底面に外部接続用電極を設けているので、直
接親基板等に接続することができ、従来のように別異の
外部接続端子が不要となり低価格な高周波発振装置が提
供できることになる。またシールドケースの側面の一部
を、プリント基板への接続部より長く突出させ、この突
出部分を外側方向に折曲げたものであるので、シールド
ケースをプリント基板に嵌合させる時にこの突出部分が
ガイドとなって嵌合がスムーズに行える。With the above configuration, the shield case is fitted to the printed board and is electrically and mechanically connected by solder so that the side surface ground electrode of the printed board is partially exposed. Since the shield case does not protrude to the lower surface side, it can be made thinner and can be directly surface-mounted on the parent printed circuit board or the like, and in this case, it is used for external connection on the side surface or the bottom surface of the printed circuit board. Since the electrodes are provided, the electrodes can be directly connected to the parent board and the like, and different external connection terminals as in the conventional case are not required, and a low-cost high-frequency oscillator can be provided. Also, a part of the side surface of the shield case is projected longer than the connecting portion to the printed circuit board, and this projecting portion is bent outward, so that when the shield case is fitted to the printed circuit board, this projecting portion is Can be used as a guide for smooth fitting.
第１図は本考案の高周波発振装置の一実施例のプリント
基板部の斜視図、第２図a,b,cは全体の正面図、底面
図、側面図、第３図は従来の高周波発振装置の上方向の
斜視図、第４図は下方向の斜視図、第５図は断面図であ
る。 １……シールドケース、2,2−１……外部接続用電極、
３−1,3−2,3−3,3−４……突出部、4,4−１……側面接
地電極、５……プリント基板、6,6−1,6−2,6−３……
底面外部接続用接地電極。FIG. 1 is a perspective view of a printed circuit board part of an embodiment of a high-frequency oscillator according to the present invention, FIGS. 2a, 2b, 2c are front views, bottom views, side views, and FIG. FIG. 4 is a downward perspective view of the apparatus, FIG. 4 is a downward perspective view thereof, and FIG. 1 ... Shield case, 2,2-1 ... External connection electrode,
3-1,3-2,3-3,3-4 ... Projection, 4,4-1 ... Side grounding electrode, 5 ... Printed circuit board, 6,6-1,6-2,6-3 ......
Ground electrode for external connection on the bottom.
Claims (1)
と、このプリント基板の上面を覆うシールドケースとを
備え、前記プリント基板は、その側面に側面接地電極
を、側面または、底面には外部接続用電極をそれぞれ有
し、前記シールドケースは前記側面接地電極が一部露出
するように前記プリント基板側面に嵌合されるとともに
ハンダにより電気的及び機械的に接続され、前記シール
ドケースの側面の一部を、前記プリント基板への接続部
より長く突出させ、この突出部分を外側方向に折曲げた
高周波発振装置。1. A printed circuit board having an oscillation circuit mounted on an upper surface thereof, and a shield case covering the upper surface of the printed circuit board, wherein the printed circuit board has a side surface ground electrode on its side surface and an external surface on a side surface or a bottom surface. The shield case is fitted to the side surface of the printed circuit board so that the side surface ground electrode is partially exposed, and is electrically and mechanically connected by soldering. A high-frequency oscillator in which a part is projected longer than a connecting portion to the printed circuit board, and the protruding part is bent outward.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990051824U JPH0751830Y2 (en) | 1990-05-17 | 1990-05-17 | High frequency oscillator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990051824U JPH0751830Y2 (en) | 1990-05-17 | 1990-05-17 | High frequency oscillator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0410392U JPH0410392U (en) | 1992-01-29 |
| JPH0751830Y2 true JPH0751830Y2 (en) | 1995-11-22 |
Family
ID=31571598
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990051824U Expired - Fee Related JPH0751830Y2 (en) | 1990-05-17 | 1990-05-17 | High frequency oscillator |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0751830Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2822984B2 (en) * | 1996-06-27 | 1998-11-11 | 日本電気株式会社 | Shield structure of hybrid integrated circuit |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6315094U (en) * | 1986-07-15 | 1988-02-01 |
-
1990
- 1990-05-17 JP JP1990051824U patent/JPH0751830Y2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0410392U (en) | 1992-01-29 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |