JP3032946B2 - Electronic component mounting structure - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure for mounting an electronic component on a flexible printed circuit board.

[0002]

2. Description of the Related Art For example, in a vehicle or the like, a flexible printed circuit board may be used to form an FPC (flexible printed circuit). Conventionally, as shown in FIG. 30, to mount an electronic component on such an FPC, a lead wire 3 of the electronic component 1 is bent in a predetermined direction, and this is inserted into a hole 7 through which a conductor of the FPC 5 penetrates.
After bending the end of the lead wire 3 on the back surface of the FPC 5, this end is soldered to a conductor, and furthermore, the tip 3a of the protruding unnecessary portion of the lead wire 3 is cut.

[0003]

However, in the above-described conventional structure for mounting an electronic component on the FPC 5, the electronic component 1 is manually arranged, and further, the lead wire 3 is bent, soldered, and the lead wire 3a is removed. The process leading to cutting is
Since all of the work is performed manually, the ratio of the labor cost to the product unit price increases, and there is a problem that the product cost increases. Also, the mounting of the electronic component 1 by soldering involves the insertion of the lead wire 3 and the soldering on the back surface of the FPC.
Since the operation of turning over C5 is required and the skill of the soldering operation itself is also required, it is difficult to respond to automation, and defects such as pinholes, solder bridges, and solder cracks occur. There was a possibility.
Further, when the electronic component 1 is attached to the FPC 5 by soldering, in order to improve workability, an FPC assembly in which the electronic component 1 is soldered in advance is manufactured.
The procedure was to attach the C assembly to the case member. For this reason, the FPC assembly, which is a work-in-process to which the electronic component 1 is attached, must be provided in many types, and there has been a problem that management becomes complicated. SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and is not limited to soldering.
Provide an electronic component mounting structure that allows electronic components to be mounted on the system.
The aim is to reduce defective products and work in process.

[0004]

According to the present invention, there is provided an electronic component mounting structure for mounting an electronic component having lead wires on a flexible printed circuit board. A fitting hole is formed in a rigid adherend, a pair of opposing support side plate portions is vertically provided in the fitting hole, and a tongue piece portion where a conductor portion is exposed is formed on the printed wiring board. The formed connection terminal having a slit-shaped blade portion was pressed into the front fitting hole together with the tongue piece portion to connect the conductor portion and the connection terminal, and the lead wire was pressed against the blade portion of the connection terminal. It is characterized by the following.

[0005]

When the printed wiring board is placed with the tongue piece aligned with the fitting hole of the adherend and the connection terminal is pushed into the fitting hole, the connection terminal causes the tongue piece to move along the supporting side plate. It is bent and inserted into the fitting hole. When the connection terminal is inserted into the fitting hole, the conductor on the bent tongue piece is sandwiched between the support side plate portion of the fitting hole and the connection terminal, and is connected to the connection terminal. . When the lead wire of the electronic component is press-fitted into the blade of the connection terminal, the electronic component is held by the printed wiring board via the connection terminal and is electrically connected to the conductor of the printed wiring board. Will be.

[0006]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of an electronic component mounting structure according to the present invention will be described below in detail with reference to the drawings. First, a first embodiment of an electronic component mounting structure according to the present invention is shown in FIGS.
This will be described with reference to FIG. FIG. 1 is a perspective view showing an electronic component mounting structure according to the present invention, FIG. 2 is a perspective view of a fitting hole formed in a case constituting a part of the mounting structure according to the present invention, and FIG. 3 shows a tongue piece of an FPC. FIG. 4 is a perspective view of a connection terminal used in the mounting structure according to the present invention, and FIG.
FIG. 4 is a cross-sectional view of a state where the connection terminal is fitted in the fitting hole. The electronic component mounting structure includes a case 11 (see FIG. 2) as an adherend, a flexible FPC 13 (see FIG. 3), and an electronic component 15. And a connection terminal 21 (see FIG. 4) that is connected to the conductor.

As shown in FIG. 2, a rectangular fitting hole 23 is formed in, for example, an upper surface plate 11a of a case 11 made of a resin material having a predetermined rigidity. An inner wall 25 extends from the opening edge of the fitting hole 23, and the inner wall 25 is box-shaped and surrounds the internal space of the fitting hole 23. The fitting hole 2
The bottom of 3 has a bottom, and the lower part of the connection terminal 21 comes into contact. A pair of inner walls 25 opposed to the fitting hole 23 become a support side plate portion 27. After the support side plate portion 27 is bulged out of the opening edge into the fitting hole in a curved shape, the inner wall surface parallel to the hole direction is formed. Become. It can be understood that the support side plate portion 27 has a certain degree of rigidity because the case 11 is made of a rigid resin material.

The flexible FPC 13 shown in FIG. 3 is placed on the upper surface of the case 11. Case 1
An H-shaped notch 29 is formed at a position corresponding to the fitting hole 23 of the FPC 13 placed on the top 1. Therefore, two parallel slit portions 29a of the notch portion 29,
The portion sandwiched between the pair of tongues 29b forms a pair of opposing tongue pieces 31. The circuit pattern 33 of the FPC 13 is formed on the tongue piece 31. The circuit pattern 33 is
The resist is removed by the tongue piece 31, and the conductor 35 is exposed. Here, since the FPC 13 and the circuit pattern 33 have flexibility, the tip of the tongue piece 31 can be freely bent.

On the other hand, as shown in FIG.
Is formed of an integral part obtained by cutting a conductive metal plate into a predetermined shape and then bending a predetermined portion. That is, in the connection terminal 21, the parallel support plate 37 is bent with a gap therebetween, and the lower portion of the support plate 37 is integrally connected by the connection portion 39. A slit-shaped blade portion 41 cut into a U-shape from the upper end is formed on the upper portion of each support plate 37, and the lead wire 17 of the electronic component 15 is pressed against the blade portion 41. I have. Conductive plates 43 are provided on both sides of the connecting portion 39.
Is bent, and the conductive plate 43 is erected from both sides of the support plate 37 to the outside. The distance between the outer surfaces of the conductive plate 43 is the same as or slightly larger than the distance between the support side plate portions 27 of the fitting holes 23 described above.

The fitting hole 23, the notch 29, and the connection terminal 21 configured as described above are used for mounting the electronic component 15 from which the lead wires 17 are drawn out from both ends, as shown in FIG. At both ends.

Next, the mounting operation of the electronic component 15 using such a configuration will be described. On the upper surface of the case 11,
The FPC 13 is placed with the notch 29 aligned with the fitting hole 23. As shown in FIG. 5, the connection terminal 21 is pushed into the notch 29 of the FPC 13 in a direction in which the tongue piece 31 and the conductive plate 43 match. The connection terminal 21 is inserted into the fitting hole 23 in a state where the tongue piece 31 is bent along the support side plate 27 by the conductive plate 43. The lower part of the connection terminal 21 inserted into the fitting hole 23 is in contact with the bottom of the fitting hole 23 to be fitted. Therefore, the conductor part 35 on the bent tongue piece part 31 is sandwiched between the support side plate part 27 of the fitting hole 23 and the conductive plate 43 of the connection terminal 21, and is connected to the conductive plate 43.

As a result, the conductors 35 from two directions separated by the notch 29 are connected via the connection terminal 21. The connection terminal 21 fitted in the fitting hole 23
The upper portion projects from the upper surface of the FPC 13. The lead wire 17 of the electronic component 15 is press-fitted into the protruding blade portion 41 of the connection terminal 21. Therefore, as shown in FIG. 1, as shown in FIG. 1, the lead wires 17 at both ends are pressed into the blade portions 41, so that the electronic components 15 are held by the FPC 13 via the connection terminals 21 and are connected to the conductor portions 35 of the FPC 13. The electrical connection will be completed.

According to the electronic component mounting structure according to the above-described embodiment, the fitting hole 23 is formed in the case 11 and the fitting hole 23 is formed.
The tongue piece 31 is formed in the FPC 13, and the tongue piece 31 is folded into the fitting hole 23, and the connection terminal 21 is provided to press the tongue piece 31 and connect to the conductor 35 of the FPC 13. Furthermore, since the blade 41 for connecting and holding the lead wire 17 of the electronic component 15 to the connection terminal 21 is formed, no soldering is performed, and
13, the electronic component 15 is pressed twice, that is, only by pushing the connection terminal 21 into the fitting hole 23 and press-fitting the lead wire 17 into the blade 41 of the connection terminal 21, The electronic component 15 can be attached to the FPC 13.

As a result, since the soldering operation is eliminated, the operation of mounting the electronic parts is facilitated, the operation cost is greatly reduced, and the mounting operation can be performed by two press-in operations without turning over the FPC 13. Also, it becomes easy to respond to automation. Further, since there is no need for a skillful soldering operation, there is no possibility that a defect such as a pinhole, a solder bridge, or a solder crack occurs, and the reliability of the mounting portion can be improved. Further, since the electronic component 15 can be easily attached to the FPC 13, the electronic component 15 is not pre-assembled into the FPC 13 as in the case of the conventional soldering, so that it is not necessary to prepare various types of work-in-progress, which is complicated. Parts management can be eliminated.

Next, a second embodiment of the electronic component mounting structure according to the present invention will be described with reference to FIGS. FIG. 6 is a perspective view of a connection terminal used in the second embodiment, FIG. 7 is a sectional view of a connection terminal fitting state according to the second embodiment, and FIG. 8 is a connection terminal fitting state according to the second embodiment. 9 is a plan view of the mounting structure according to the second embodiment, and FIG. 10 is a bottom view of the mounting structure according to the second embodiment as viewed from below.
In the electronic component mounting structure according to this embodiment, a connection terminal 45 formed of a single plate having a thickness made of a conductive metal is used. Conducting surfaces 47 which are side end surfaces are formed on both side surfaces of the connection terminal 45, and the conduction surface 47 faces the support side plate portion 51 of the fitting hole 49 when the connecting terminal 45 is inserted into the fitting hole 49. It has become.

On a pair of parallel inner wall surfaces sandwiching the support side plate portion 51 of the fitting hole 49, ridges 53 formed in the insertion direction of the connection terminal 45 are formed, respectively. The connection terminal 45 is provided so as to sandwich the connection terminal 45 from the thickness direction. On the upper part of the connection terminal 45, a blade part 41 cut in a U-shape from the upper end is formed similarly to the connection terminal 21 described above. Also, a projection 55 for preventing falling off is provided on the front and rear surfaces of the connection terminal 45, and the projection 55 for preventing falling off is provided with a projection 5.
3 is engaged with a recess 57 formed in the recess 3. The drop-off prevention protrusions 55 projecting from the front surface and the back surface of the connection terminal 45 are arranged to be shifted left and right from the center of the connection terminal 45 as shown in FIG.

A case 59 in which a fitting hole 49 is formed.
The notch 29 shown in FIG.
Thus, the FPC 13 on which the pair of tongue pieces 31 are formed is placed.

The mounting operation of the electronic component 15 using such a configuration is performed by aligning the notch 29 with the fitting hole 49 so that F
The PC 13 is placed. The connection terminal 45 is pushed into the notch 29 of the FPC 13, and the connection terminal 45 is inserted into the fitting hole 49 in a state where the tongue piece 31 of the FPC 13 is bent along the support side plate 51 by the conduction surface 47. Fitting hole 49
When the connection terminal 45 is pushed in, the projection 55 for preventing falling provided on the front and rear surfaces is engaged with the concave portion 57 of the ridge 53, thereby preventing the connection terminal 45 from falling out of the fitting hole 49. At the same time, the conductor portion 35 on the bent tongue piece 31 is sandwiched between the support side plate portion 51 of the fitting hole 49 and the conductive surface 47 of the connection terminal 45 and is connected to the conductive surface 47. Become.

Thus, the conductor portions 35 from two directions separated by the notch 29 are connected via the connection terminal 45. Further, the blade 4 protruding from the upper surface of the FPC 13
When the lead wire 17 of the electronic component 15 is pressed into the electronic component 1, the electronic component 15 is held by the FPC 13 via the connection terminal 45 and is electrically connected to the conductor 35.

According to the electronic component mounting structure of this embodiment, since the connection terminal 45 is formed of a single plate having a large thickness, the fitting hole 49 can be formed narrow, and the space occupied on the printed wiring board can be reduced. At the same time, the holding strength between the connection terminal 45 and the fitting hole 49 can be increased. Also,
Since the connection terminal 45 is provided with the projection 55 for preventing falling, and the projection 55 for preventing falling is engaged with the concave portion 57 of the ridge 53,
The connection terminal 45 can be securely fixed to the fitting hole 49.

Next, a third embodiment of the electronic component mounting structure according to the present invention will be described with reference to FIGS. FIG.
1 is a perspective view of a connection terminal used in the third embodiment, FIG.
2 is a sectional view of the connection terminal fitting state according to the third embodiment, FIG. 13 is a side view of the connection terminal fitting state according to the third embodiment,
FIG. 14 is a plan view of the mounting structure according to the third embodiment, and FIG.
5 is a bottom view of the mounting structure according to the third embodiment as viewed from below. In the electronic component mounting structure according to this embodiment,
This connection terminal 6 is connected to the connection terminal 61 made of a conductive metal plate.
Bend both sides of one to one surface (eg, surface)
Thus, a pair of conductive plates 63 is formed, and the conductive plate 63 has a lower end continuously connected thereto, and an upper end is a free end, and stands up so as to be elastically displaceable. The upper end of the conductive plate 63 is bent so as to be disposed outside from both sides of the connection terminal 61. A contact portion 65 protruding in a hemispherical shape is formed on the outer surface of the leading end of the bent conductive plate 63.

A pair of press-fitting pieces 67 are vertically provided from the lower part of the connection terminal 61, and the press-fitting pieces 67 are press-fitted into drop-out prevention grooves 71 formed on the bottom surface of the fitting hole 69. A fixing plate 73 protrudes from one of a pair of parallel inner wall surfaces sandwiching the support side plate portion 72 of the fitting hole 69, and the fixing plate 73 connects the connection terminal 61 inserted into the fitting hole 69 to another inner wall surface. And sandwiched between them. In addition, the blade part 41 is formed in the upper part also in the connection terminal 61 similarly to the above-mentioned connection terminal.

The mounting operation of the electronic component 15 using such a configuration is performed by aligning the notch 29 with the fitting hole 69 so that the F
The PC 13 is placed. The connection terminal 61 is pushed into the notch 29 of the FPC 13, and the connection terminal 61 is inserted into the fitting hole 69 in a state where the tongue piece 31 of the FPC 13 is bent along the support side plate 72 by the conductive plate 63. Fitting hole 69
The connection terminal 61 pushed into the fitting hole 67
The press-fitting groove 71 on the bottom surface 9 is press-fitted to prevent the fitting hole 69 from falling off. At the same time, the conductor portion 35 on the bent tongue piece 31 is attached to the support side plate portion 7 of the fitting hole 69.
2 and the conductive plate 63 of the connection terminal 61 and are connected to the conductive plate 63.

Thus, the conductors 35 from two directions separated by the notch 29 are connected via the connection terminal 61. Further, the blade 4 protruding from the upper surface of the FPC 13
When the lead wire 17 of the electronic component 15 is press-fitted into the electronic component 1, the electronic component 15 is held by the FPC 13 via the connection terminal 61 and is electrically connected to the conductor 35.

According to the electronic component mounting structure of this embodiment, since the conductive plate 63 having elasticity is provided, the conductor 3
The electrical connection of the connection terminal 61 to the terminal 5 can be improved. The holding force of the connection terminal 61 in the fitting hole 69 is increased by the press-fitting piece 67 at the lower end being press-fitted into the drop-off preventing groove 71.

Next, a fourth embodiment of the electronic component mounting structure according to the present invention will be described with reference to FIGS. FIG.
6 is a perspective view of a connection terminal used in the fourth embodiment, FIG.
7 is a sectional view of the connection terminal fitting state according to the fourth embodiment, FIG. 18 is a side view of the connection terminal fitting state according to the fourth embodiment,
FIG. 19 is a plan view of the mounting structure according to the fourth embodiment, and FIG.
0 is a bottom view of the mounting structure according to the fourth embodiment as viewed from below. In the connection terminal 81 used in the electronic component mounting structure according to this embodiment, a conductive metal plate is cut into a predetermined shape, and the two support plates 85 are raised through a lower connecting portion 83 (see FIG. 17). Are bent in parallel with a gap therebetween. A blade portion 41 cut in a U-shape is formed on the upper portion of each support plate 85, similarly to the connection terminal described above.

On both sides of the connecting portion 83, conductive plates 87 are bent, and the conductive plates 87 are erected from both sides of the support plate 85 in a state of being disposed outside. The conductive plate 87 has a lower end connected to the connecting portion 83 and an upper end formed as a free end, and is capable of elastic displacement. Further, on the outer surfaces of the pair of support plates 85, projections 89 for preventing falling off are provided. On the other hand, ridges 94 formed in the insertion direction of the connection terminal 81 project from a pair of parallel inner wall surfaces sandwiching the support side plate portion 93 of the fitting hole 91, and the pair of opposing ridges 94 are formed as a pair. Support plate 8
5 is arranged so as to sandwich the same from the outside. A concave portion 95 is formed in the ridge 94, and the concave portion 95 is adapted to engage with a drop-off prevention projection 89 protruding from the support plate 85.

The mounting operation of the electronic component 15 using such a configuration is performed by aligning the notch 29 with the fitting hole 91 to make the F.
When the connection terminal 81 is pushed into the notch 29 after the PC 13 is placed, the tongue piece 31 is inserted into the fitting hole 91 by the conduction plate 87. As for the connection terminal 81 pushed into the fitting hole 91, the falling-off prevention projection 89 protruding from the outer surface of the support plate 85 is engaged with the concave portion 95 of the ridge 94, and is prevented from falling out of the fitting hole 91. At the same time, the conducting plate 87 elastically contacts the conductor 35 on the tongue 31 while being elastically displaced. The conductor portion 35 is sandwiched between the support side plate portion 93 of the fitting hole 91 and the conductive plate 87 of the connection terminal 81, and the conductive plate 87
Will be connected.

According to the electronic component mounting structure of this embodiment, since the conductive plate 87 that can be elastically displaced is provided, the electrical connection of the connection terminal 81 to the conductor 35 can be improved. Further, the connection terminal 81 can reliably hold the fitting terminal 91 in the fitting hole 91 by engaging the falling-off prevention projection 89 with the concave portion 95 of the convex ridge 94. Further, since one lead wire 17 is pressed against the pair of support plates 85, the holding force and the reliability of the electrical connection can be improved.

Next, a fifth embodiment of the electronic component mounting structure according to the present invention will be described with reference to FIGS. FIG.
1 is a perspective view of a connection terminal used in the fifth embodiment, FIG.
2 is a sectional view of the connection terminal fitting state according to the fifth embodiment, FIG. 23 is a side view of the connection terminal fitting state according to the fifth embodiment,
FIG. 24 is a plan view of the mounting structure according to the fifth embodiment, and FIG.
5 is a bottom view of the mounting structure according to the fifth embodiment as viewed from below. The electronic component mounting structure according to this embodiment is a modification of the third embodiment described above.

That is, the connection terminal 10 made of a conductive metal plate
1, one surface of both side portions of the connection terminals 101 (e.g., the surface to be) while the folding Gaité pair of conductive plates 103 are formed, conductive plate 103 at the lower end is continuously provided, the upper end It becomes a free end and stands up so as to be elastically displaceable. Conductive plate 1
The upper end of 03 is bent from both sides of the connection terminal 101 to the outside. Bent conductive plate 10
A contact portion 1055 protruding in a hemispherical shape is formed on the outer surface of the distal end of No. 3. From the lower part of the conductive plate 103, press-fit pieces 10
The press-in piece 107 is press-fitted into a drop-off preventing groove 111 formed in the bottom surface of the fitting hole 109.

A single press-in piece 113 is vertically provided from the lower portion of the support plate 112, and the press-in piece 113 is press-fitted into a fall-off preventing groove 115 formed in the bottom surface of the fitting hole 109. That is, the connection terminal 101 is configured such that a total of three press-fit pieces 107 and 113 are held on the bottom surface of the fitting hole 109. A fixing plate 119 protrudes from one of a pair of parallel inner wall surfaces sandwiching the supporting side plate portion 117 of the fitting hole 109, and the fixing plate 119 connects the connection terminal 101 inserted into the fitting hole 109 to another inner wall surface. It is designed to be pinched and pinched (see FIG. 23). In addition, also in the connection terminal 101, the blade part 41 is formed in the upper part similarly to the above-mentioned connection terminal.

On the opposite surface of the connection terminal 101 to which the fixing plate 119 comes into contact, a falling-off prevention protrusion 121 is provided in a protruding manner. A convex ridge 123 formed in the insertion direction of the connection terminal 101 protrudes from the inner wall surface of the fitting hole 109 on the opposite side from which the fixing plate 119 protrudes, and the convex ridge 123 engages with the falling-off preventing protrusion 121. 125 is formed. That is, the connection terminal 101
In this configuration, one surface comes into contact with the fixing plate 119, and the falling-off prevention protrusion 121 projecting from the other surface is engaged with the concave portion 125.

According to the electronic component mounting structure of this embodiment, the three press-in pieces 107 and 113 are held on the bottom surface of the fitting hole 109, and the connection terminals 101 are fixed to the fixing plate 119.
Since the connection terminal 101 is held in the fitting hole 109 by the and the fall prevention protrusion 121, the holding force of the connection terminal 101 can be increased.
Further, in this embodiment, the lower end of the conductive plate 103 is
07, the conductive plate 103 is held by the tongue piece 3
1 and the conductive plate 103 and the conductor 35
Connection reliability can be improved.

Next, a sixth embodiment of the electronic component mounting structure according to the present invention will be described with reference to FIGS. FIG.
6 is an exploded perspective view showing an electronic component mounting structure according to the sixth embodiment, FIG. 27 is a sectional view taken along line AA of FIG. 26, and FIG. 28 is a cross-sectional view of the electronic component mounting structure according to the sixth embodiment in the lead wire direction. FIG. 29 is a sectional view of the electronic component mounting structure according to the sixth embodiment in a direction perpendicular to the lead wire direction. In the electronic component mounting structure according to this embodiment, a rectangular fitting hole 133 is formed in, for example, an upper surface plate of the case 131. A pair of support side plate portions 1 facing from the opening edge of the fitting hole 133
The support side plate portions 135 are connected to each other by a bottom plate portion 137.
Are connected by

A pair of support portions 139 are provided in the bottom plate portion 137 in the longitudinal direction of the fitting hole 133, and a groove portion 14 on which the lead wire 17 of the electronic component 15 is placed is provided on the upper surface of the support portion 139.
1 is recessed. That is, the electronic component 15 is
In a state where the lead wires 17 at both ends are placed in the 39 groove portions 141, they are positioned and held in the fitting holes 133. The FPC 1 in which the tongue piece 31 is formed by the notch 29 on the upper surface of the case 131, as in the above-described embodiment.
3 is placed.

On the other hand, the connection terminal 147 is formed of an integral part obtained by cutting a conductive metal plate into a predetermined shape and then bending a predetermined portion. That is, the connection terminal 147 has a shape in which a hanging piece is bent from each side of the rectangular upper plate 149. A pair of parallel hanging pieces have a downwardly opening U
It has a blade portion 41 in the shape of a letter. The other pair of parallel hanging pieces is a U-shaped conductive plate 151 whose lower end is bent outward and upward. A contact portion 153 protruding in a hemispherical shape protrudes from an upper outer surface of the conductive plate 151.

The mounting operation of the electronic component 15 using such a configuration will be described. The lead wire 17 is inserted into the fitting hole 133.
Is cut into a suitable length, and the electronic component 15 is inserted. Further, the electronic component 15 is arranged such that the lead wire 17 is placed on the groove 141 of the support portion 139. The FPC 13 is placed in the fitting hole 133 with the notches 29 aligned. At this time, the FPC 13 is configured such that the pair of tongue pieces 31
5 are arranged in the same direction.

On the other hand, the connection terminal 147 is pushed into the fitting hole 133 in the direction corresponding to the lead wire 17 from above the notch 29. Then, the tongue piece 3 of the FPC 13
1 is bent along the supporting side plate portion 135 by the conductive plate 151 and inserted into the fitting hole 133. Accordingly, the conductors 35 from two directions separated by the notch 29 are connected via the connection terminal 147. At this time, the fitting hole 1
The blade 41 is pressed into the lead wire 17 of the connection terminal 147 pushed into 33.

The electronic component 15 has the connection terminals 147 and the support 1 by pressing the lead wires 17 at both ends into the blade 41.
39 and the FP
The electrical connection of the C13 to the conductor 35 is completed.

According to the electronic component mounting structure of this embodiment, the support 139 of the electronic component 15 is provided in the fitting hole 133, and after the electronic component 15 is mounted on the support 139 of the fitting hole 133, the FPC 13 By pushing in the connection terminal 147 from the notch 29, the electronic component 15 can be held in the case without performing soldering.
It can be connected to the conductor 35 of the FPC 13.

As a result, the soldering operation can be eliminated, the electronic component mounting operation becomes easy, and the operation cost can be greatly reduced. In addition, since the FPC 13 does not need to be turned over and can be mounted only by the press-fitting operation, it is easy to respond to automation. Further, since the soldering operation is eliminated, defects such as pinholes, solder bridges, and solder cracks do not occur. Further, unlike the conventional soldering, it is not necessary to prepare a pre-assembled work-in-progress of the electronic component 15, and it is possible to eliminate complicated component management due to having various types of work-in-progress. In this embodiment, the electronic component 15 is the case 1
The electronic component 15 is embedded in the fitting hole 133 of the electronic component 15.
Can be prevented from coming into contact with foreign matter.

[0043]

As described above in detail, according to the electronic component mounting structure of the present invention, the fitting hole is formed in the adherend, the tongue is formed on the printed wiring board, and the tongue is formed. Is provided in the fitting hole, and a blade portion for connecting and holding a lead wire is formed in the connection terminal, so that the electronic component can be mounted on the printed wiring board without soldering. As a result, the work of mounting the electronic parts is facilitated, the work cost is reduced, and the automation can be easily handled. In addition, defects such as pinholes, solder bridges, and solder cracks are eliminated, and the reliability of the mounting portion can be improved. Further, since the electronic components can be easily mounted, it is not necessary to prepare various types of work-in-progress with the electronic components pre-assembled, and it is possible to eliminate complicated component management.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an electronic component mounting structure according to the present invention.

FIG. 2 is a perspective view of a fitting hole formed in a case constituting a part of the mounting structure according to the present invention.

FIG. 3 is a perspective view showing a tongue piece of the FPC.

FIG. 4 is a perspective view of a connection terminal used in the mounting structure according to the present invention.

FIG. 5 is a cross-sectional view of a state in which a connection terminal is fitted in a fitting hole.

FIG. 6 is a perspective view of a connection terminal used in the second embodiment.

FIG. 7 is a sectional view of a connection terminal fitting state according to a second embodiment.

FIG. 8 is a side view of a connection terminal fitting state according to the second embodiment.

FIG. 9 is a plan view of a mounting structure according to a second embodiment.

FIG. 10 is a bottom view of the mounting structure according to the second embodiment as viewed from below.

FIG. 11 is a perspective view of a connection terminal used in the third embodiment.

FIG. 12 is a sectional view of a connection terminal fitting state according to a third embodiment.

FIG. 13 is a side view of a connection terminal fitting state according to the third embodiment.

FIG. 14 is a plan view of a mounting structure according to a third embodiment.

FIG. 15 is a bottom view of the mounting structure according to the third embodiment as viewed from below.

FIG. 16 is a perspective view of a connection terminal used in the fourth embodiment.

FIG. 17 is a sectional view of a connection terminal fitting state according to a fourth embodiment.

FIG. 18 is a side view of a connection terminal fitting state according to the fourth embodiment.

FIG. 19 is a plan view of a mounting structure according to a fourth embodiment.

FIG. 20 is a bottom view of the mounting structure according to the fourth embodiment as viewed from below.

FIG. 21 is a perspective view of a connection terminal used in the fifth embodiment.

FIG. 22 is a sectional view of a connection terminal fitting state according to the fifth embodiment.

FIG. 23 is a side view of the connection terminal fitting state according to the fifth embodiment.

FIG. 24 is a plan view of a mounting structure according to a fifth embodiment.

FIG. 25 is a bottom view of the mounting structure according to the fifth embodiment as viewed from below.

FIG. 26 is an exploded perspective view showing an electronic component mounting structure according to a sixth embodiment.

27 is a sectional view taken along line AA of FIG. 26.

FIG. 28 is a sectional view in the lead wire direction of an electronic component mounting structure according to a sixth embodiment.

FIG. 29 is a sectional view of the electronic component mounting structure according to the sixth embodiment in a direction perpendicular to the lead wire direction.

FIG. 30 is a sectional view showing a conventional electronic component mounting structure.

[Explanation of symbols]

 11, 131 Case (adherend) 13 Printed wiring board 15 Electronic component 17 Lead wire 21, 45, 61, 81, 101, 147 Connection terminal 23, 49, 69, 91, 109, 133 Fitting hole 27, 51, 72, 93, 117, 135 Supporting side plate 31 Tongue piece 35 Conductor 37, 85, 112 Supporting plate 41 Blade 47 Conducting surface (side end surface) 55, 89, 121 Protrusion for preventing falling off 57, 95, 125 Concave 63 , 87, 103, 151 Conducting plate 67, 107, 113 Press-fit piece 71, 111, 115 Drop-off prevention groove 83 Connecting part 137 Bottom plate part 139 Support part

──────────────────────────────────────────────────続 き Continuation of front page (56) References JP-A-2-232988 (JP, A) JP-A 48-43948 (JP, U) JP-A-3-22930 (JP, Y2) (58) Field (Int.Cl. ⁷ , DB name) H05K 1/18

Claims (6)

(57) [Claims] An electronic component mounting structure for mounting an electronic component having a lead wire to a flexible printed circuit board, wherein a fitting hole is formed in a rigid adherend, and a pair of opposed components is formed. A supporting side plate portion is vertically provided in the fitting hole, a tongue portion exposing a conductor portion is formed on the printed wiring board, and a connection terminal having a slit-shaped blade portion is inserted into the fitting hole together with the tongue portion. An electronic component mounting structure, wherein the connection part is connected to the conductor part by press-fitting, and the lead wire is pressed against a blade part of the connection terminal. 2. The connecting terminal is formed of a conductive thick plate, and the connecting terminal is press-fitted into a fitting hole to sandwich the tongue piece between a side end surface of the connecting terminal and a supporting side plate portion and fall off. 2. The electronic component mounting structure according to claim 1, wherein a protrusion for preventing the protrusion is provided on the front and back surfaces of the connection terminal, and a concave portion for engaging with the protrusion for preventing the connection terminal is provided on an inner wall surface of the fitting hole. 3. A pair of conductive plates opposed to the support side plate portion by bending both side portions of the plate-like connection terminal to one surface side, forming a fitting hole with a bottom, and forming a lower portion of the connection terminal. The press-fitting piece is vertically provided from above, and the connection terminal is press-fitted into the fitting hole to sandwich the tongue piece between the conductive plate and the supporting side plate, and the press-fitting piece is formed on the bottom surface of the fitting hole. 2. The electronic component mounting structure according to claim 1, wherein said electronic component mounting structure is press-fitted into said fall prevention groove. 4. A lower part of two parallel support plates is connected via a connection part, and a pair of conductive plates arranged on both sides of the support plate are raised from the connection part, and the support plate is provided. A connection terminal is formed by projecting a projection for preventing falling off on the outer surface of the tongue piece by the conductive plate and the supporting side plate portion of the connection terminal by press-fitting the connection terminal into the fitting hole, The electronic component mounting structure according to claim 1, wherein a concave portion that engages with the drop-off preventing projection is provided on an inner wall surface of the fitting hole. 5. A connection terminal is formed by vertically attaching a press-fit piece to a lower portion of a pair of conductive plates, and the press-fit piece is press-fitted into a fall-off preventing groove formed on a bottom surface of the fitting hole. The electronic component mounting structure according to claim 3. 6. An electronic component mounting structure for mounting an electronic component having a lead wire on a flexible printed wiring board, wherein a bottomed fitting hole is formed in a rigid adherend and opposed to each other. A set of supporting side plate portions is vertically provided in the fitting hole, a supporting portion for mounting the lead wire is protruded from a bottom plate portion of the fitting hole, and a tongue piece portion where a conductor portion is exposed is printed wiring. Formed on the substrate,
A connection terminal having a slit-shaped blade portion was pressed into the fitting hole together with the tongue piece portion to connect the conductor portion to the connection terminal, and the blade portion of the connection terminal was placed on the support portion. An electronic component mounting structure characterized by being pressed into a lead wire from above.