JP3367233B2 - Connection structure between board and connection lead - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a connecting structure for connecting a substrate and a connecting lead.

[0002]

2. Description of the Related Art Conventionally, various methods have been used for drawing out terminals for establishing an electrical connection between a thick film baked substrate and external connection terminals. For example, as shown in FIG. 10, a through hole 32 is formed in the substrate 31, and an electrode land for soldering is provided around the through hole 32. Then, after mounting the component 33 to be mounted on the board 31 and soldering, the lead pin 34 for connection to the outside is passed through the through hole 32, and the tip end of the lead pin 34 is crushed by a jig or the like to be crushed and the lead pin 34 comes off. Try not to. After that, the lead pins 34 and the electrode lands on the substrate 31 are soldered.

In the case of this method, when the lead pin 34 is caulked, a substrate breakage or a substrate breakage occurs, and the yield of products cannot be improved. In contrast to the method of FIG. 10, the method of FIG. 11 eliminates caulking and improves the yield and workability. In this method, a clip portion 36 is provided at the tip of the connection lead 35, the clip portion 36 is inserted into the end surface portion of the substrate 31, and the clip portion 36 and the electrode land are soldered. By doing so, the substrate 31
In the case of a product configuration in which the upper part of the is open, the solder paste (paste mixture of granular solder material, flux and solvent) can be easily supplied and also for soldering. Can also be easily heated (laser irradiation).

[0004]

However, in order to adopt the connection structure shown in FIG. 11, when the structure (connector portion) is above the circuit board 31, it cannot be applied as it is. That is, when the solder paste is supplied to the soldering portion, the connector portion obstructs the soldering operation, which makes the soldering work difficult.

Therefore, an object of the present invention is to provide a connection structure between a substrate and a connection lead, which can easily supply a bonding material such as a solder paste and can easily perform a bonding operation such as soldering. .

[0006]

The invention according to claim 1 extends from a connector portion arranged above a surface of a circuit board on which electronic components are mounted, and an upper end portion thereof is connected to an in-vehicle wire.
A large number of connection leads forming input / output terminals, and a large number of electrode connection portions provided on the surface on which the electronic component is mounted along the edge of the circuit board. a structure, the multi
The number of connecting leads has a sandwiching portion that sandwiches the circuit board from both sides, and the sandwiching portion is connected to the electrode connecting portion of the circuit board and the front portion.
So that is joined with the serial circuit soldered supplied from outside of the substrate or a conductive adhesive, connecting the board to extend the connection leads toward the connector from the inside of the circuit board from the junction leads The connection structure with and is the gist.

A second aspect of the present invention has as its gist a connection structure between a substrate and a connection lead, which is formed by bending the connection lead in the sandwiching portion in the first aspect of the invention.

[0008]

[0009]

SUMMARY OF] According to the invention described in claim 1, the circuit board is sandwiched from both sides by the holding portions of the connecting leads, clamping portion is round
The connection portion of the road board and the circuit board are joined by soldering or a conductive adhesive supplied from outside . A connection lead extends from the inside of the board toward the connector from the joint. As a result, the bonding material can be easily supplied from the outside of the substrate toward the bonding portion.

According to the invention of claim 2, claim 1
In addition to the effect of the invention described in (1), the holding portion can be easily formed by bending the connection lead. According to the invention described in claim 3, in addition to the effect of the invention described in claim 1, a plurality of connection leads extending from the connector portion are connected to the substrate. At this time, the connection leads can be connected at once, which is excellent in terms of working time and workability.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. This embodiment is embodied in a vehicle-mounted engine control computer, and an exploded perspective view is shown in FIG.

The engine control computer is the base material 1
And a circuit board 2, a connector portion 3 and a case member 4. That is, as a whole configuration, as shown in FIG. 2, the circuit board 2 is fixed on the base material 1, and the circuit board 2 is fixed.
The connector part 3 is arranged at a position spaced apart by a connection lead 9 from above, and the case member 4 is arranged so as to cover the circuit board 2 and the connector part 3. The connection lead 9 has a strip shape and is made of phosphor bronze (copper alloy).

In FIG. 3, the base material 1 and the case material 4 are removed (fixed structure of the circuit board 2 and the connector portion 3).
FIG. 4 shows a plan view and FIG. 4 also shows a front view.

As shown in FIGS. 1 and 2, the circuit board 2 has a rectangular shape, and various electronic components 6 which are circuit components are mounted on the circuit board 2. Here, in FIG. 1, as the electronic component 6, a capacitor 6a, an IC circuit 6b, and an oscillator 6c are shown. Further, a large number of electrode connecting portions (connection lands) 7 are arranged in parallel on the upper surface of the edge portion on the long side of the circuit board 2. The electrode connecting portion 7 and the circuit formed by using the electronic component 6 are electrically connected.

The circuit board 2 is fixed on the base material 1. The base material 1 is made of an aluminum plate (metal plate) and functions as a heat radiating plate that releases the heat generated by the electronic component 6. The connector portion 3 has a structure in which a large number of connecting leads 9 are integrally formed on a connector body 8 which is a resin molded product, and the connector body 8 holds each of the connecting leads 9. More specifically, the connector body 8 has a rectangular horizontal portion 8a extending in the horizontal direction and a vertical portion 8b extending upward from the horizontal portion 8a, and one end side (upper end side) of the connection lead 9 is the vertical portion 8b. Is held in a horizontal state, and the other end side (lower end side) projects from the end face on the long side of the horizontal portion 8a, extends in the horizontal direction, and further extends downward. Here, half of all the connection leads 9 are horizontal portions 8a of the connector body 8.
Of the connector main body 8 and the remaining connecting leads 9 project from the end surface of the horizontal portion 8a of the connector body 8 on the other long side. A sandwiching portion 10 sandwiching the circuit board 2 from both sides is formed at the lower end portion of each connection lead 9.

As shown in FIGS. 5 and 6, the sandwiching portion 10 of the connection lead 9 is formed by bending the strip-shaped connection lead 9 into a U-shape. Clamping interval W of the clamping unit 10
Has the same size as the thickness of the circuit board 2 to be fitted. In addition, the design tolerance of the sandwiching distance W of the sandwiching portion 10 is a negative tolerance so that the circuit board 2 is not easily removed even when sandwiched.

The sandwiching portion 10 is sandwiched from both sides of the circuit board 2 at the installation position of the electrode connecting portion 7 on the circuit board 2. Further, the sandwiching portion 10 is the electrode connecting portion 7 of the circuit board 2.
And is electrically connected to the electrode connecting portion 7 of the circuit board 2. In FIG. 5, the solder is designated by reference numeral 12.

Thus, the circuit board 2 is
A connection lead 9 extends from the inside of the connector toward the connector portion 3. The phosphor bronze (copper alloy), which is the material of the connection lead 9, has a strong spring property.

In FIG. 2, the upper end side (input / output terminal) of each connection lead 9 is connected to a cable (vehicle wire) via a connector, and the cable is connected to a battery and various actuators.

Next, the procedure for assembling the vehicle-mounted engine control computer thus configured will be described. A circuit board 2 on which a conductive pattern including an electrode connecting portion (connection land) 7 is formed is prepared, and solder printing is performed on the circuit board 2.
Then, the electronic component 6 (circuit component) is provided on the circuit board 2.
Then, the circuit board 2 and the electronic component 6 are heated at the same time to perform solder connection. After that, the connection between the electronic component 6 that cannot be soldered and the conductive pattern (board pattern)
It is performed by Al wire bonding or the like.

Subsequently, as shown in FIG. 5, the circuit board 2
In the formation portion of the electrode connection portion 7 of the
0 is fitted and temporary assembly is performed. At this time, the plurality of connection leads 9 are collectively connected to the circuit board 2.

Then, a solder paste (a granular solder material, a flux and a solvent are mixed to form a paste) is continuously supplied to a place where the connection leads 9 are arranged in parallel, and in FIG. The solder paste is linearly arranged as indicated by L1 and L2. At this time, as shown in FIG. 5, a solder paste as a bonding material can be supplied from the outside of the circuit board 2 toward the soldering portion.

There is no metal conductive pattern between the electrode connecting portions 7, and the solder paste does not get wet and the electrode connecting portion 7 is formed on the conductive pattern by its own surface tension.
Separately set to the part of.

After that, the solder is melted using a means capable of locally heating with a laser beam or the like to bond the sandwiching portion 10 and the electrode connecting portion 7. At this time, as shown in FIG. 5, local heating (laser irradiation) for soldering can be easily performed from the outside of the circuit board 2 toward the soldering portion.

In this way, the sandwiching portion 10 and the electrode connecting portion 7 are soldered, and the electrode connecting portion 7 and the sandwiching portion 10 are electrically and mechanically connected by soldering. In this way, after the circuit board 2 and the connector portion 3 are integrated into a structure,
The circuit board 2 is adhesively fixed onto the base material 1. afterwards,
The case member 4 is mounted on the base member 1 from above and assembled.
More specifically, a heat resistant adhesive is applied to one of the contact surfaces (contact portions) of the base material 1 and the case material 4 to bond them. As a result, it is completed as a product.

As described above, in this embodiment, the connection lead 9 has the sandwiching portion 10 sandwiching the circuit board 2 from both sides, and the sandwiching portion 10 is soldered to the electrode connecting portion 7 of the circuit board 2,
Since the connection lead 9 is extended from the inside of the circuit board 2 toward the connector portion 3 from the soldering portion, the connector portion 3
The solder paste can be easily supplied from the outside of the circuit board 2 to the soldering portion without being disturbed by the wiring board, and the local area for soldering from the outside of the circuit board 2 to the soldering portion. Heating (laser irradiation) can be easily performed, and soldering work can be easily performed.

Further, since the holding portion 10 is formed by bending the connecting lead 9 into a U-shape, the holding portion 10
Can be easily formed. Furthermore, the connector part 3
A plurality of connection leads 9 extending from are connected to the circuit board 2. At this time, the connection leads 9 (multi-poles) can be collectively connected, which is excellent in working time and workability.

Another aspect of the present invention will be described below. There are various methods for soldering the sandwiching portion 10 and the electrode connecting portion 7, and as a solder paste supplying method, it is also possible to locally supply the solder paste with a dispenser. Then, after locally supplying the solder paste in this way,
It is also possible to take the same steps as described above.

Also in the heating step, in addition to the local heating by the laser, if the resin material of the connector body 8 has heat resistance, it is possible to heat the entire body and perform the soldering. Further, as a method of simultaneously supplying the solder paste and soldering, it is possible to preheat the product and immerse the connection lead 9 in the solder bath. In this case,
As shown in, the circuit board 2 is dipped in the solder material 13 in the solder bath in a standing state, and the solder material 13 is attached thereto. Also in this case, since the connection lead 9 extends from the inside of the soldered portion of the circuit board 2, the solder material 13 as a joining material can be easily supplied without being hindered by the connector portion 3.

Furthermore, the upper surface of the circuit board 2 (electronic component 6
Soldering is performed on the surface on which the electrodes are mounted, and the lower surface (back surface) is also pressure-bonded by the sandwiching portion 10 to the electrode connecting portion 7.
(Land) may be electrically connected. That is, the electrode connecting portion 7a may be provided on the lower surface of the circuit board 2 in FIG. 5, and the sandwiching portion 10 may be pressed against the electrode connecting portion 7a.

Further, in the above configuration, the connection lead 9 to the outside is connected.
Is shown on both long sides of the rectangular circuit board 2, but the connection lead 9 may be provided on only one long side of the rectangular circuit board 2. In that case, if the number of leads is small and the connector portion 3 arranged above cannot be supported, as shown in the plan view of FIG. 8 and the front view of FIG. ) May be provided with a support portion 14, and the support portion 14 may be connected to the base material 1. In this case, the projection 15 at the lower end of the support portion 14 and the fitting concave portion 16 provided in the base material 1 are fitted, and the connector portion 3 is positioned by the fitting due to the concavo-convex relationship.

Further, the sandwiching portion 10 and the electrode connecting portion 7 of the circuit board 2 may be joined with a conductive adhesive instead of solder. Even in this case, the connection lead 9 and the circuit board 2
Can be electrically connected, and at this time, a conductive adhesive as a joining material can be easily supplied.

Further, the substrate may be a printed circuit board on which a conductive pattern is simply printed. The material of the connecting lead 9 may be brass or the like.

[0034]

As described above in detail, according to the invention described in claim 1, there is an excellent effect that the bonding work can be easily performed and the bonding work can be easily performed.

According to the invention of claim 2, claim 1
In addition to the effect of the invention described in (1), the sandwiching portion can be easily formed. According to the invention of claim 3, claim 1
In addition to the effect of the invention described in (1), the work time and workability are excellent.

[Brief description of drawings]

FIG. 1 is an exploded perspective view of an engine control computer.

FIG. 2 is a longitudinal section of an engine control computer.

FIG. 3 is a plan view of a board and a connector portion.

FIG. 4 is a front view of a board and a connector portion.

FIG. 5 is an enlarged view of a soldering portion.

FIG. 6 is an enlarged perspective view of a soldering portion.

FIG. 7 is an enlarged view of a soldering portion of another example.

FIG. 8 is a plan view of another example.

FIG. 9 is a front view of another example.

FIG. 10 is an enlarged view of a soldering portion for explaining a conventional structure.

FIG. 11 is an enlarged view of a soldering portion for explaining a conventional structure.

[Explanation of symbols]

2 ... Circuit board, 3 ... Connector part, 7 ... Electrode connection part, 9 ...
Connection lead, 10 ... Holding part

─────────────────────────────────────────────────── ─── Continuation of the front page (56) Reference JP-A-4-360595 (JP, A) JP-A-48-2061 (JP, A) JP-A-3-30266 (JP, A) JP-A-4-34 118872 (JP, A) JP-A-5-266936 (JP, A) Actual development Sho 63-147863 (JP, U) Actual development Sho 56-4173 (JP, U) (58) Fields investigated (Int.Cl. ⁷ , DB name) H01R 12/04 H05K 1/18

Claims (2)

(57) [Claims] 1. A vehicle-mounted wire that extends from a connector portion disposed above a surface of a circuit board on which electronic components are mounted, and has an upper end portion.
A large number of connection leads that form input / output terminals connected to the ear and a surface on which the electronic component is mounted along the edge of the circuit board.
A structure for connecting a large number of electrode connecting parts to each other, wherein the plurality of connecting leads have a sandwiching part for sandwiching the circuit board from both sides, and the sandwiching part includes the electrode connecting part of the circuit board and the circuit. substrate
So that is joined by soldering supplied from outside or a conductive adhesive, and the substrate, wherein the inside of the circuit board from the junction that is extended connecting leads toward the connector portion Connection structure with connection lead. 2. The connection structure between a substrate and a connection lead according to claim 1, wherein the holding portion is formed by bending the connection lead.