JPH11233927A - Manufacture of board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a board, in which a terminal board will not shift during manufacture and which has a short work time. SOLUTION: This method includes a step of mounting a solder 18 on a conductive portion 2 formed on a board 1, a step of mounting an adhesive 19 on a portion of the board 1 away from the conductive portion 2, a step of mounting a terminal board 20 on the solder 18 and on the adhesive 19, and a step of heating the board 1 to fix the adhesive 19 and to melt the solder 18. Thus, since the terminal board is fixed onto the board 1 by the adhesive, the terminal board can be prevented from being shifted at melting of the solder.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to a method for manufacturing a substrate.

[0002]

2. Description of the Related Art Conventionally, this kind of manufacturing method is disclosed in, for example, Japanese Patent Application Laid-Open No. Hei 6-268098. According to this publication, a conductive part is formed on a substrate, solder is placed on the conductive part, and a terminal board is placed so that one part is located on the solder and the other part is located on the substrate. I have. Then, the substrate is placed in a heating furnace and heated to melt the solder.

[0003]

However, the above-described manufacturing method has a first disadvantage that when the solder is melted in the heating furnace, the terminal plate is shifted due to the surface tension of the solder. Therefore, the present inventor has manually soldered the terminal plate onto the conductive portion, but there is a second disadvantage that the working time is long. Therefore, the present invention provides a method for manufacturing a substrate, in which the terminal plate is not shifted during manufacturing and the working time is short, in consideration of such a conventional disadvantage.

[0004]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention comprises a step of placing solder on a conductive portion formed on a substrate, and a step of applying an adhesive on a substrate separated from the conductive portion. The method includes a step of placing, a step of placing a terminal plate on the solder and the adhesive, and a step of heating the substrate, fixing the adhesive, and melting the solder.

[0005] The present invention desirably controls the heating so that the solder is melted after the adhesive is fixed.

The present invention desirably provides a hole in a substrate located near the conductive portion.

The present invention desirably provides a groove in the substrate between the conductive portion and the adhesive, and divides the substrate along the groove.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A substrate manufacturing method according to an embodiment of the present invention will be described below with reference to FIGS. First, in the perspective view of FIG. 1, a substrate 1 is made of, for example, an insulating resin, and a plurality of conductive portions 2 made of copper foil or the like are formed in alignment. On the back surface of the substrate 1, a wiring pattern is formed,
An insulating agent is formed on the wiring pattern.

In the lateral direction of the substrate 1, elongated holes 3 extending parallel to each other at a predetermined interval are formed. A V-groove 4 is formed on the surface of the substrate 1 and a V-groove 5 is formed on the back surface of the substrate 1 so as to be located near the conductive portion 2 and perpendicular to the elongated hole 3. Similarly, a groove 6 is formed on the surface of the substrate 1 and a groove 7 is formed on the back surface of the substrate 1 so as to be located on the opposite side of the conductive portion 2 and perpendicular to the elongated hole 3.

As described above, the small substrates 8, 9, 10, 11, 1
2, 13 and 14 are respectively surrounded by the grooves 4, 5 and the grooves 6, 7 and the elongated hole 3. The holes 15 are formed in the substrate 1 in an elongated shape so as to be located in the vicinity of each conductive portion 2 and alternately. Then, the discarded substrate 16 has the groove 4,
5 and the discarded substrate 17 is located closer to the end than the grooves 6 and 7.

Next, the substrate 1 is set on a product holding machine (not shown). Solder (cream solder, etc.) 18 is placed (applied) on each conductive part 2. Then, an adhesive 19 is placed (applied) on the substrate 1 at a predetermined interval on each conductive portion 2.
The adhesive 19 is, for example, a thermosetting adhesive made of a liquid epoxy resin.

As shown in the perspective view of FIG.
The terminal plate 20 is placed on the substrate 1 by a chip mounter (not shown) so that the terminal plate 20 is positioned on the substrate 1 and the adhesive 19. That is, the terminal plate 20 has the solder 1 near the left end of the terminal plate 20.
8 and is placed such that the approximate center is located on the adhesive 19. The electric component 21 including a chip component and an integrated circuit element is mounted on the conductive layer of the substrate 1 by a chip mounter via solder (both not shown).
Although a plurality of electrical components 21 are mounted on each of the small boards 8 to 14, one is shown in FIG. 2 for simplicity.

Next, although not shown, the substrate 1 is housed in a heating furnace. Turn on the heating furnace and raise the temperature of the heating furnace. Then, the heating furnace is preheated.
C., maintained for 120 seconds. During this time, the adhesive 19 is thermoset and fixed (the fixing condition of the adhesive 19 is, for example, 120 to
130 ° C., 30 to 40 seconds). Thus, adhesive 1
Due to the fixation of 9, the terminal plate 20 is fixed on the discarded substrate 16 and does not shift from a predetermined position.

The temperature of the heating furnace is increased, and when the temperature in the heating furnace reaches about 180 ° C., the solder 18 is melted. After that, the temperature of the heating furnace is lowered to solidify the solder 18. Thus, the heating control of the heating furnace is performed. As a result, the terminal plate 20 is fixed on the conductive portion 2 at a regular position (without displacement). Similarly, the electric component 21 is fixed on the conductive layer.

Next, as shown in the side view of FIG. 3, the substrate 1 is taken out of the heating furnace and placed on the support jig 22. The support jig 22 includes, for example, a horizontal table 23, a right table 24, and a left table 25. The right side of the right base 24 is aligned with the grooves 4 and 5 of the substrate 1, and the left side of the left base 25 is the grooves 6 and 7 of the substrate 1.
The right table 24 and the left table 25 are adjusted in position so as to be on the same line as.

Then, a holding member 26 is placed on the substrate 1. The holding member 26 includes, for example, a left base 27 and a right base 28 and is configured to press the substrate 1 with a predetermined pressure.
Also, the right base 28 and the left base are aligned so that the right side of the right base 28 is aligned with the grooves 4 and 5 of the substrate 1 and the left side of the left base 27 is aligned with the grooves 6 and 7 of the substrate 1. 27 is adjusted in position.

Next, when pressure is applied to the left end A and the right end B of the substrate 1, the substrate 1 is divided. Thus, the conductive part 2 and the adhesive 1
9, grooves 4 and 5 are provided in the substrate 1, and the substrate 1 is divided along the grooves 4 and 5. As a result, the substrate 1 becomes small substrates 8, 9,
It is divided into 10, 11, 12, 13, and 14. At this time, the adhesion of the adhesive 19 is released, and the discarded substrate 16 is separated from the terminal plate 20. Further, a terminal plate 20 is fixed to each of the small substrates 8 to 14.

As shown in the perspective view of FIG.
0 is bent at right angles downward. Although omitted in the above description, the conductive layers 29, 3
0, 31, and 32 are formed. Battery 33 is small substrate 1
4 and is fixed by spot welding to the vicinity 34 of the front end of the terminal plate 20.

The cathode surface of the battery 35 is spot-welded to one side surface of the terminal 36, and the other side surface of the terminal 36 is connected to the conductive layer 29 via the solder 37. Similarly, the anode surface of the battery 35 is spot-welded to one side surface of the terminal 38, and the other side surface of the terminal 38 is connected to the conductive layer 30 via the solder 39. With these components, the battery assembly 40 is completed.

As described above, the terminal plate 20 is placed on the solder 18 and the adhesive 19, the substrate 1 is heated, the adhesive 19 is fixed, and the solder 18 is melted. The fact that the method of manufacturing the small substrates 8 to 14 by dividing 1 is implemented
It can be seen from the presence of the remaining adhesive 41 on the back side of the terminal plate 20 fixed to the small substrates 8 to 14 after the manufacture (see FIG. 4).

[0021]

As described above, according to the first aspect of the present invention, there are provided a step of placing an adhesive on a substrate separated from a conductive portion, and a step of placing a terminal board on solder and on the adhesive. And a step of heating the substrate, fixing the adhesive, and melting the solder. As described above, since the terminal plate is fixed on the substrate with the adhesive, it is possible to prevent the terminal plate from shifting when the solder is melted.

Further, according to the present invention, after the adhesive is fixed, the heating is controlled to melt the solder. By performing such control, the fixing of the adhesive and the melting of the solder can be automatically performed in the heating furnace, so that the manual work of soldering is not required as in the related art, and the working time is shortened.

According to a third aspect of the present invention, a hole is provided in the substrate located near the conductive portion. As a result, in the step of melting the solder, even if the flux of the solder spreads, the flux stays in the hole, so that the flux does not proceed near the tip of the terminal plate.
Therefore, it becomes easy to fix (for example, spot welding or the like) the tip of the terminal plate and the other component (for example, the cathode surface of the battery).

According to a fourth aspect of the present invention, a groove is provided in the substrate between the conductive portion and the adhesive, and the substrate is divided along the groove to obtain a plurality of small substrates. As a result, one end of the terminal plate is fixed to the conductive portion, and the other end is a free end (there is no supporting member). Therefore, the vicinity of the other end of the terminal plate can be formed into an arbitrary shape according to the shape of the mating component by secondary processing (for example, bending at a right angle), and the convenience is improved.

[Brief description of the drawings]

FIG. 1 is a drawing showing steps of a substrate manufacturing method according to an embodiment of the present invention.

FIG. 2 is a view showing a step that follows the step of FIG. 1;

FIG. 3 is a view showing a step that follows the step of FIG. 2;

FIG. 4 is a view showing a step that follows the step of FIG. 3;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate 2 Conductive part 18 Solder 19 Adhesive 20 Terminal board

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor: Nobunari Kobayashi 320-1, Yamagata, Kiji, Ohara-gun, Shimane Prefecture Shimane Sanyo Kogyo Co., Ltd.

Claims (4)

[Claims] 1. A step of placing solder on a conductive portion formed on a substrate, a step of placing an adhesive on the substrate apart from the conductive portion, and a step of placing an adhesive on the solder and the adhesive A step of mounting a terminal plate on the substrate, and a step of heating the substrate, fixing the adhesive, and melting the solder. 2. The method according to claim 1, wherein after fixing the adhesive, heating is controlled so as to melt the solder. 3. The substrate manufacturing method according to claim 1, wherein a hole is provided in the substrate located near the conductive portion. 4. The method according to claim 1, wherein a groove is provided in the substrate between the conductive portion and the adhesive, and the substrate is divided along the groove.