JPH04130793A - Soldering implement - Google Patents
Soldering implementInfo
- Publication number
- JPH04130793A JPH04130793A JP25260890A JP25260890A JPH04130793A JP H04130793 A JPH04130793 A JP H04130793A JP 25260890 A JP25260890 A JP 25260890A JP 25260890 A JP25260890 A JP 25260890A JP H04130793 A JPH04130793 A JP H04130793A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- pinhole
- lead
- electronic components
- soldered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 title claims description 10
- 229910000679 solder Inorganic materials 0.000 claims abstract description 19
- 238000007747 plating Methods 0.000 abstract description 4
- 238000009413 insulation Methods 0.000 abstract 2
- 230000008018 melting Effects 0.000 abstract 1
- 238000002844 melting Methods 0.000 abstract 1
- 239000000155 melt Substances 0.000 description 2
- 235000014676 Phragmites communis Nutrition 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明ははんだ付け用具に関し、特に、狭隘なピッチの
電子部品の端子をプリント配線基板にはんだ付けすると
きに使用するはんだ付け用具に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a soldering tool, and particularly to a soldering tool used when soldering narrow pitch terminals of electronic components to a printed wiring board.
狭隘なピッチの電子部品の端子をプリント配線基板には
んだ付けするときの従来の手段は、クリーム状のはんだ
をあらかじめプリント配線基板に印刷によって付着させ
ておくという手段を用いている。A conventional method for soldering narrow pitch terminals of electronic components to a printed wiring board is to apply cream-like solder to the printed wiring board in advance by printing.
上述したような従来のはんだ供給手段は、はんだがクリ
ーム状であるなめ、はんだ付けずべき電子部品の端子間
隔が極めて狭くなる（超狭ピッチ）と、隣接する端子の
はんだが接触するという欠点がある。また、クリーム状
のはんだの印刷原版のスリットの製造限界が、はんだ付
けする電子部品の端子間隔の限界となるという欠点もあ
る。The conventional solder supply means described above has the disadvantage that the solder is creamy, and when the terminal spacing of electronic components that should not be soldered becomes extremely narrow (ultra-narrow pitch), the solder of adjacent terminals will come into contact with each other. be. Another drawback is that the manufacturing limit of the slits in the cream solder printing plate also limits the terminal spacing of electronic components to be soldered.
本発明のはんだ付け用具は、はんだ付けすべき電子部品
の端子と位置と同じ位置にピンホールを設けた絶縁フィ
ルムと、前記絶縁フィルムの両面の前記ピンホールの位
置にめっきしたはんだとを備えている。The soldering tool of the present invention comprises an insulating film having a pinhole at the same position as a terminal of an electronic component to be soldered, and solder plated on both sides of the insulating film at the position of the pinhole. There is.
次に本発明の実施例について図面を参照して説明する。 Next, embodiments of the present invention will be described with reference to the drawings.
第１図は本発明の一実施例を示す斜視図、第２図は第１
図の実施例のＡ−Ａ！断面図である。FIG. 1 is a perspective view showing one embodiment of the present invention, and FIG. 2 is a perspective view showing one embodiment of the present invention.
A-A of the illustrated embodiment! FIG.
第１図および第２図において、１は透明な絶縁フィルム
で、はんだ付けすべき電子部品３の端子（リード）の位
置と同じ位置に極めて小さな直径の穴（ピンホール）を
設けである。２は、絶縁フィルム１の両面の上記のピン
ホールの位置にめっきによって付着したはんだである。In FIGS. 1 and 2, reference numeral 1 denotes a transparent insulating film in which holes (pinholes) of extremely small diameter are provided at the same positions as the terminals (leads) of electronic components 3 to be soldered. 2 is solder attached by plating to the positions of the above-mentioned pinholes on both sides of the insulating film 1.
このように構成したはんだ付け用具を用いて電子部品３
のリードをプリント配線基板４にはんだ付けするときは
、はんだ２をプリント配線基板４に設けであるパッドに
合わせて絶縁フィルム１をプリント配線基板４上に載置
し、その上に電子部品３のリードを載せて加熱する。こ
れによってはんだ２が溶けて電子部品３のリードをプリ
ント配線基板４のパッドに接続する。Electronic components 3 are soldered using the soldering tool configured as described above.
When soldering the leads to the printed wiring board 4, place the insulating film 1 on the printed wiring board 4 by aligning the solder 2 with the pads provided on the printed wiring board 4, and place the electronic components 3 on top of it. Place the reed on it and heat it. This melts the solder 2 and connects the leads of the electronic component 3 to the pads of the printed wiring board 4.
以上説明したように１本発明のはんだ付け用具は、絶縁
フィルムにピンホールを設け、その位置にめっきによっ
てはんだを付着させておき、それを溶かすことによって
はんだの供給を行うため、超狭ピッチの端子間隔の電子
部品もプリント配線基板にはんだ付けできるという効果
があり、しかも電子部品とプリント配線基板との間に絶
縁層を形成できるという効果もある。As explained above, the soldering tool of the present invention provides pinholes in the insulating film, adheres solder to the pinholes by plating, and melts the pinholes to supply the solder. There is an effect that electronic components with terminal spacing can also be soldered to a printed wiring board, and furthermore, an insulating layer can be formed between the electronic components and the printed wiring board.
第１図は本発明の一実施例を示す斜視図、第２図は第１
−図の実施例のＡ−Ａ線断面図である。
１・・・・・・絶縁フィルム、２・・・・・・はんだ、
３・・・・・電子部品、４・・・・・・プリント配線基
板。FIG. 1 is a perspective view showing one embodiment of the present invention, and FIG. 2 is a perspective view showing one embodiment of the present invention.
- is a sectional view taken along the line A-A of the embodiment shown in the figure. 1...Insulating film, 2...Solder,
3...Electronic components, 4...Printed wiring board.
Claims (1)
ンホールを設けた絶縁フィルムと、前記絶縁フィルムの
両面の前記ピンホールの位置にめっきしたはんだとを備
えることを特徴とするはんだ付け用具。A soldering tool comprising: an insulating film provided with pinholes at the same positions as terminals of electronic components to be soldered; and solder plated on both sides of the insulating film at the positions of the pinholes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25260890A JPH04130793A (en) | 1990-09-21 | 1990-09-21 | Soldering implement |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25260890A JPH04130793A (en) | 1990-09-21 | 1990-09-21 | Soldering implement |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04130793A true JPH04130793A (en) | 1992-05-01 |
Family
ID=17239738
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25260890A Pending JPH04130793A (en) | 1990-09-21 | 1990-09-21 | Soldering implement |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04130793A (en) |
-
1990
- 1990-09-21 JP JP25260890A patent/JPH04130793A/en active Pending
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