JP3484916B2 - Circuit board and its manufacturing method - Google Patents
Circuit board and its manufacturing methodInfo
- Publication number
- JP3484916B2 JP3484916B2 JP08497297A JP8497297A JP3484916B2 JP 3484916 B2 JP3484916 B2 JP 3484916B2 JP 08497297 A JP08497297 A JP 08497297A JP 8497297 A JP8497297 A JP 8497297A JP 3484916 B2 JP3484916 B2 JP 3484916B2
- Authority
- JP
- Japan
- Prior art keywords
- component
- circuit board
- insertion hole
- component insertion
- diameter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、各種機器、特に電
源回路などのパワー回路に用いられる回路基板に関する
ものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit board used for various devices, particularly for power circuits such as power supply circuits.
【０００２】[0002]
【従来の技術】従来の回路基板としては、図５に示すプ
リント基板が一般的である。プリント基板はフェノール
樹脂またはガラス繊維入り樹脂等で作った基板５１に、
厚さ寸法３５ミクロンメートル（μｍ）程度の銅箔５２
を張り付け、エッチング処理によっ配線パターン部を形
成していた。2. Description of the Related Art A conventional printed circuit board is generally a printed circuit board shown in FIG. The printed board is a board 51 made of phenol resin or resin containing glass fiber,
Copper foil 52 with a thickness of about 35 microns (μm)
And the wiring pattern portion was formed by etching.
【０００３】前記プリント基板に重量部品５４や、発火
の恐れのある部品５４を電気的に接続する場合には、安
全対策として、ハトメを使用していた。また、重量部品
５４や発火の恐れのある部品５４のプリント基板の部品
挿入孔５５には、安全対策として予めハトメ５３が挿入
され、その後、部品５４が挿入される。そして、溶融半
田５６によって半田付けされ、プリント基板銅箔５２と
部品端子５４ａの電気的接続が行われる。Eyelets are used as a safety measure when electrically connecting a heavy component 54 or a component 54 that may cause ignition to the printed circuit board. Further, as a safety measure, an eyelet 53 is inserted in advance into the component insertion hole 55 of the printed circuit board of the heavy component 54 or the component 54 that may cause ignition, and then the component 54 is inserted. Then, it is soldered by the molten solder 56, and the printed board copper foil 52 and the component terminal 54a are electrically connected.
【０００４】また、部品５４をプリント基板に挿入した
後、部品５４が基板５１から抜けるのを防止する方法と
しては、基板５１の裏側に突き出た部品５４の部品端子
５４ａを折り曲げるか、半田等の接着剤で固定してい
た。As a method of preventing the component 54 from coming off the substrate 51 after the component 54 is inserted into the printed circuit board, the component terminal 54a of the component 54 protruding to the back side of the substrate 51 may be bent or soldered. It was fixed with an adhesive.
【０００５】[0005]
【発明が解決しようとする課題】上記の従来のプリント
基板は、以上のように構成されているので、重量部品や
発火の恐れのある部品に対し、半田接合強度維持、安全
対策としてハトメを挿入する必要があり、部品点数の増
加や加工工数の増加が発生していた。また、半田付け部
から部品が抜け落ちるのを防止する対策を要していた。Since the above-mentioned conventional printed circuit board is constructed as described above, the eyelet is inserted as a safety measure to maintain the solder joint strength for heavy parts and parts that may catch fire. It was necessary to increase the number of parts and the number of processing steps. In addition, it is necessary to take measures to prevent the parts from falling out of the soldered portion.
【０００６】[0006]
【課題を解決するための手段】前記課題を解決するため
に、本発明の回路基板は、部品挿入孔が配設された配線
回路パターンを形成した厚みが０．１ｍｍ以上の金属板
と、部品挿入以前に予め前記金属板を加工して前記部品
挿入孔の周辺に形成されたジグザグの歯形状に突起して
いる突出部と、前記金属板と一体化して成形される絶縁
性の支持体とを備え、前記突出部の部品挿入側の孔径が
部品端子径より大きく、突出部側の孔径が前記部品端子
径よりも小さくなるようにしたことを特徴としたもので
ある。Means for Solving the Problems In order to solve the above problems, the circuit board of the present invention, wiring component insertion holes are disposed
A metal plate having a circuit pattern and a thickness of 0.1 mm or more
And, the metal plate is processed in advance before inserting the component.
Protruding in the zigzag tooth shape formed around the insertion hole
Insulation molded integrally with the protruding part and the metal plate
And a support member that is flexible, and the hole diameter on the component insertion side of the protrusion is
It is larger than the component terminal diameter, and the hole diameter on the protruding side is
The feature is that the diameter is smaller than the diameter .
【０００７】本発明によれば、部品挿入孔の周辺に歯形
状の突出部を形成するので、ハトメを無くすこと、およ
びハトメ挿入工程を省略することができる。また、部品
挿入孔の周辺の歯形状の突出部の高さを高くすることが
でき、その結果、半田付け時に、半田フィレット高さが
高くなり、かつ、突出部が歯形状となることで、溶融半
田が突出部の歯間より部品挿入孔内に入り込み、部品端
子が部品挿入孔周辺の突出部と強固に接合されるので、
接続信頼性と接合強度が向上する。また、部品挿入側の
部品挿入孔径が部品端子径より大きく、突出部の歯形部
先端の内側を通る同心円径を、部品端子径よりも小さく
することで、部品挿入時にしまりばめになり、部品を挿
入するだけで抜け止めができる。さらに、本発明の製造
方法によれば、部品挿入孔の下穴を開ける工程、および
部品挿入後、部品が抜けるのを防止するための部品端子
を折り曲げる工程、もしくは接着剤などで固定する工程
を省略することができる。According to the present invention, since the tooth-shaped protrusion is formed around the component insertion hole, eyelets can be eliminated and the eyelet insertion step can be omitted. Further, the height of the tooth-shaped protrusion around the component insertion hole can be increased, and as a result, the solder fillet height is increased during soldering, and the protrusion is tooth-shaped, Since the molten solder enters the part insertion hole from between the teeth of the protruding part and the part terminal is firmly joined to the protruding part around the part insertion hole,
Connection reliability and joint strength are improved. In addition, the component insertion hole diameter on the component insertion side is larger than the component terminal diameter, and the concentric circle diameter that passes inside the tip of the toothed portion of the protrusion is smaller than the component terminal diameter, resulting in a tight fit during component insertion. It can be prevented by simply inserting. Furthermore, according to the manufacturing method of the present invention, a step of forming a pilot hole for the component insertion hole, and a step of bending the component terminal for preventing the component from coming off after the component is inserted, or a step of fixing the component terminal with an adhesive or the like. It can be omitted.
【０００８】[0008]
【発明の実施の形態】本発明の請求項１に記載の発明
は、配線回路パターンを形成した金属板と絶縁性の支持
体とを一体化してなる回路基板において、前記配線回路
パターンが部品挿入孔を有するとともに前記部品挿入孔
の周辺に前記部品の搭載面側と反対側方向に突出部を備
えた回路基板を、少なくとも３角以上の角錐形状をもつ
金型で押圧加工して前記突出部を設けることを特徴とす
る回路基板の製造方法で、下孔を開けずに押圧（プレ
ス）加工するので、突出部の高さを高くすることがで
き、その結果、半田付け時に、半田フィレット高さが高
くなり、かつ、突出部が歯形状になることで、溶融半田
が突出部の歯間より孔内へ入り込み、部品端子が部品挿
入孔周辺の突出部と強固に接合されるので、接続の信頼
性と接合強度が向上する。また、ハトメの事前の挿入工
程を不要にする。また、部品挿入孔の下孔加工工程を省
略することができる。 BEST MODE FOR CARRYING OUT THE INVENTION The invention according to claim 1 of the present invention is a circuit board in which a metal plate on which a wiring circuit pattern is formed and an insulating support are integrated with each other, wherein the wiring circuit pattern is a component insertion part. A circuit board having a hole and a projecting portion around the component insertion hole in a direction opposite to the mounting surface side of the component, and having a pyramid shape of at least three sides or more.
In a method for manufacturing a circuit board , which is characterized in that the protrusion is provided by pressing with a die, the pressing (pre-press) is performed without opening a pilot hole.
Process), it is possible to increase the height of the protrusion.
As a result, the solder fillet height is high during soldering.
And the protruding part has a tooth-like shape,
Goes into the hole from between the teeth of the protruding part, and the component terminal is inserted.
Since it is firmly joined to the protruding portion around the entry hole, the reliability of the connection and the joining strength are improved. Moreover, the step of inserting the eyelet in advance is unnecessary. In addition, the preparation process of the component insertion hole is omitted.
It can be abbreviated.
【０００９】請求項２に記載の発明は、部品挿入孔周辺
の突出部が少なくとも３つ以上の歯形状に突起している
ことを特徴とする請求項１記載の回路基板の製造方法と
したもので、突出部の高さを高くすることができ、その
結果、半田付け時に、半田フィレット高さが高くなり、
半田接続の信頼性と接合強度が向上する。また、ハトメ
の事前の挿入工程を不要にする。According to a second aspect of the present invention, there is provided a method of manufacturing a circuit board according to the first aspect, characterized in that the projections around the component insertion hole are projected into at least three tooth shapes. The height of the protrusion can be increased, and as a result, the solder fillet height is increased during soldering.
Reliability of solder connection and joint strength are improved. Moreover, the step of inserting the eyelet in advance is unnecessary.
【００１０】請求項３に記載の発明は、部品挿入側の部
品挿入孔径が部品端子径より大きく、突出部の歯形部先
端の内側を通る同心円径が部品端子径よりも小さく、部
品端子を部品挿入孔に挿入時にしまりばめとなることを
特徴とする回路基板の製造方法としたもので、半田接続
の信頼性と接合強度が向上するとともに、部品挿入後、
部品端子を折り曲げたりせずに簡単に部品の抜けを防止
することができる。According to a third aspect of the present invention, the diameter of the component insertion hole on the component insertion side is larger than the diameter of the component terminal, and the diameter of the concentric circle passing through the inside of the tip of the toothed portion of the protrusion is smaller than the diameter of the component terminal. The circuit board manufacturing method is characterized by a tight fit at the time of insertion into the insertion hole, which improves reliability of solder connection and joint strength, and
It is possible to easily prevent the parts from coming off without bending the parts terminals.
【００１１】請求項４に記載の発明は、金属板の厚み寸
法を０．１ｍｍ以上としたことを特徴とする請求項１〜
３記載の回路基板の製造方法としたもので、部品挿入孔
の周辺に突出部を設けることを可能にし、半田接続の信
頼性と接合強度が向上する。また、ハトメの事前の挿入
工程を不要にする。The invention according to claim 4 is characterized in that the thickness dimension of the metal plate is 0.1 mm or more .
According to the method of manufacturing a circuit board as described in 3, it is possible to provide a protruding portion around the component insertion hole, and reliability of solder connection and joint strength are improved. Moreover, the step of inserting the eyelet in advance is unnecessary.
【００１２】請求項５に記載の発明は、部品挿入孔が配
設された配線回路パターンを形成した厚みが０．１ｍｍ
以上の金属板と、部品挿入以前に予め前記金属板を加工
して前記部品挿入孔の周辺に形成されたジグザグの歯形
状に突起している突出部と、前記金属板と一体化して成
形される絶縁性の支持体とを備え、前記突出部の部品挿
入側の孔径が部品端子径より大きく、突出部側の孔径が
前記部品端子径よりも小さくなるようにしたことを特徴
とする回路基板としたもので、突出部の高さを高くする
ことができ、その結果、半田付け時に、半田フィレット
高さが高くなり、かつ、突出部が歯形状とすることで、
溶融半田が突出部の歯間より孔内へ入り込み、部品端子
が部品挿入孔周辺の突出部と強固に接合されるので、接
続の信頼性と接合強度が向上する。また、部品挿入孔の
下孔加工工程を省略することができる。According to a fifth aspect of the invention, the component insertion hole is arranged.
Thickness of the formed wiring circuit pattern is 0.1mm
The above metal plate and the metal plate are processed in advance before inserting parts
Zigzag tooth profile formed around the component insertion hole
-Shaped protrusions and the metal plate
And an insulative support that is
The hole diameter on the entry side is larger than the part terminal diameter, and the hole diameter on the protruding side is
Characterized by being made smaller than the component terminal diameter
With a circuit board to be, it is possible to increase the height of the protrusion , and as a result, when soldering, the solder fillet height becomes high, and the protrusion has a tooth shape,
Molten solder enters the holes from between the teeth of the protrusions, and the component terminals are firmly bonded to the protrusions around the component insertion hole, so that the connection reliability and the bonding strength are improved. Further, the pilot hole processing step of the component insertion hole can be omitted.
【００１３】以下、本発明の実施の形態について、図１
から図４を用いて説明する。
（実施の形態１）図１は、本発明の一実施の形態１にお
ける回路基板に電子部品を半田付けした状態の要部材断
面斜視図を示す。図２に本発明の一実施の形態における
回路基板の部品挿入孔周辺の突出部の形状を示す。図１
において、符号１は金属板、１ａは突出部、２は絶縁性
の支持体、３は部品、３ａは部品端子、４は部品挿入
孔、５は半田である。図２において、１ｂは歯形部であ
る。FIG. 1 shows an embodiment of the present invention.
4 to FIG. (Embodiment 1) FIG. 1 is a sectional perspective view of essential members in a state in which an electronic component is soldered to a circuit board according to Embodiment 1 of the present invention. FIG. 2 shows the shape of the protruding portion around the component insertion hole of the circuit board according to the embodiment of the present invention. Figure 1
In FIG. 1, reference numeral 1 is a metal plate, 1 a is a protruding portion, 2 is an insulating support, 3 is a component, 3 a is a component terminal, 4 is a component insertion hole, and 5 is solder. In FIG. 2, 1b is a tooth profile.
【００１４】本発明の回路基板１００は、金属板１を打
ち抜いて所要の配線回路パターンを形成し、絶縁性の支
持体２で一体的に支持してなる。 また、突出部１ａは金
属板１（配線回路パターン）に設けた部品挿入孔４の周
辺をプレス加工等の手段により、図２のように、ジグザ
グ状の山、谷を有する歯形状にしごき出している。この
ような回路基板１００を用いることで、半田付け時に
は、溶融半田５が前記突出部１ａの歯形間から部品挿入
孔４内の壁面部１ａと部品端子３ａとの間に入り込み、
壁面１ａと強固に接合される。The circuit board 100 of the present invention is formed by punching out a metal plate 1 to form a required wiring circuit pattern and integrally supporting it with an insulating support 2. Further, the protruding portion 1a is squeezed out into a tooth shape having zigzag peaks and troughs as shown in FIG. 2 around the component insertion hole 4 formed in the metal plate 1 (wiring circuit pattern) by means such as press working. ing. By using such a circuit board 100, during soldering, the molten solder 5 enters between the tooth profiles of the protruding portion 1a and between the wall surface portion 1a in the component insertion hole 4 and the component terminal 3a,
It is firmly joined to the wall surface 1a.
【００１５】（実施の形態２）図３は、本発明の一実施
の形態２における回路基板の部品挿入孔周辺の突出部の
形状を示す。図４は、本発明の一実施の形態２における
回路基板の部品挿入孔に部品端子を挿入した時の状態図
を示す。図３において、符号３１は部品挿入孔、３１ａ
は部品挿入孔径、３１ｂは同心円径である。図４におい
て、３２は部品端子、３２ａは部品端子径である。図３
に示している部品挿入孔３１において、部品挿入側の部
品挿入孔径３１ａが部品端子径３２ａより大きく、突出
部の歯形部先端の内側を通る同心円径３１ｂは部品端子
径３２ａより小さく構成されている。このような部品挿
入孔にすることで、部品端子３２挿入時には、歯形部が
部品端子３２に沿うように弾性変形し、部品の抜けを防
止する。(Embodiment 2) FIG. 3 shows a shape of a protruding portion around a component insertion hole of a circuit board according to Embodiment 2 of the present invention. FIG. 4 shows a state diagram when the component terminals are inserted into the component insertion holes of the circuit board according to the second embodiment of the present invention. In FIG. 3, reference numeral 31 is a component insertion hole, 31a
Is a component insertion hole diameter, and 31b is a concentric circle diameter. In FIG. 4, 32 is a component terminal, and 32a is a component terminal diameter. Figure 3
In the component insertion hole 31 shown in FIG. 3, the component insertion hole diameter 31a on the component insertion side is larger than the component terminal diameter 32a, and the concentric circle diameter 31b passing inside the tip of the tooth profile of the protrusion is smaller than the component terminal diameter 32a. . With such a component insertion hole, when the component terminal 32 is inserted, the toothed portion is elastically deformed along the component terminal 32, and the component is prevented from coming off.
【００１６】[0016]
【発明の効果】以上のように本発明の回路基板によれ
ば、部品挿入孔の周辺に歯形状の突出部を、形成するの
で、ハトメを無くすこと、およびハトメ挿入工程を省略
することができる。また、部品挿入孔を下孔を開けずに
押圧（プレス）加工により形成するので、突出部の高さ
を高くすることができ、その結果、半田付け時に、半田
フィレット高さが高くなり、かつ、突出部が歯形状とな
ることで、溶融半田が突出部の歯間より孔内に入り込
み、部品端子が部品挿入孔周辺の突出部と強固に接合さ
れるので、接続信頼性と接合強度が向上する。また、部
品挿入側の部品挿入孔径が部品端子径より大きく、突出
部の歯形部先端の内側を通る同心円径を部品端子径より
も小さくすることで、部品挿入時にしまりばめになり、
部品を挿入するだけで抜け止めができる。さらに、本発
明の製造方法によれば、部品挿入孔の下孔を開ける工
程、および部品の挿入後、部品が抜けるのを防止するた
めの部品端子を折り曲げる工程、もしくは接着剤などで
固定する工程を省略することができる。As described above, according to the circuit board of the present invention, since tooth-shaped protrusions are formed around the component insertion holes, eyelets can be eliminated and the eyelet insertion step can be omitted. . Further, since the component insertion hole is formed by pressing (pressing) without opening a pilot hole, the height of the protruding portion can be increased, and as a result, the solder fillet height is increased during soldering, and Since the protruding part has a tooth shape, the molten solder enters the hole from between the teeth of the protruding part and the component terminal is firmly bonded to the protruding part around the component insertion hole, so that the connection reliability and the bonding strength are improved. improves. Also, the component insertion hole diameter on the component insertion side is larger than the component terminal diameter, and the concentric diameter that passes inside the tip of the toothed portion of the protrusion is smaller than the component terminal diameter, resulting in a tight fit during component insertion,
It can be prevented by simply inserting parts. Further, according to the manufacturing method of the present invention, a step of forming a pilot hole of the component insertion hole, and a step of bending the component terminal for preventing the component from coming off after the component is inserted, or a step of fixing the component terminal with an adhesive or the like. Can be omitted.
【図１】本発明の実施の形態１における回路基板に部品
を半田付けした状態の要部断面斜視図FIG. 1 is a cross-sectional perspective view of essential parts of a state in which components are soldered to a circuit board according to Embodiment 1 of the present invention.
【図２】本発明の実施の形態１における回路基板の部品
挿入孔の立設部の形状を示す状態図FIG. 2 is a state diagram showing a shape of a standing portion of a component insertion hole of the circuit board according to the first embodiment of the present invention.
【図３】本発明の実施の形態２における回路基板の部品
挿入孔の立設部の形状を示す状態図FIG. 3 is a state diagram showing a shape of a standing portion of a component insertion hole of a circuit board according to a second embodiment of the present invention.
【図４】本発明の実施の形態２における回路基板の部品
挿入孔に部品端子を挿入した時の状態図FIG. 4 is a state diagram when a component terminal is inserted into a component insertion hole of a circuit board according to the second embodiment of the present invention.
【図５】従来の回路基板の要部断面斜視図FIG. 5 is a cross-sectional perspective view of a main part of a conventional circuit board.
１ 金属板 １ａ 突出部 １ｂ 歯形部 ２ 支持体 ３ 部品 ３ａ 部品端子 ４ 部品挿入孔 ５ 半田 ３１ 部品挿入孔 ３１ａ 部品挿入孔径 ３１ｂ 同心円径 ３２ 部品端子 ３２ａ 部品端子径 １００ 回路基板 1 metal plate 1a protrusion 1b Tooth profile 2 support 3 parts 3a Parts terminal 4 Parts insertion hole 5 solder 31 Parts insertion hole 31a Parts insertion hole diameter 31b Concentric circle diameter 32 component terminals 32a Parts terminal diameter 100 circuit board
───────────────────────────────────────────────────── フロントページの続き (72)発明者 渡辺 正樹 大阪府門真市大字門真1006番地 松下電 器産業株式会社内 (56)参考文献 特開 平７−74460（ＪＰ，Ａ) 特開 昭58−131798（ＪＰ，Ａ) 特開 昭53−23073（ＪＰ，Ａ) 実開 昭58−142958（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.7，ＤＢ名) H05K 1/18 H05K 3/20 H05K 1/02 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Masaki Watanabe 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (56) Reference JP-A-7-74460 (JP, A) JP-A-58- 131798 (JP, A) JP 53-23073 (JP, A) Actual development 58-142958 (JP, U) (58) Fields investigated (Int.Cl. 7 , DB name) H05K 1/18 H05K 3 / 20 H05K 1/02
Claims (4)
縁性の支持体とを一体化してなる回路基板において、前
記配線回路パターンが部品挿入孔を有するとともに前記
部品挿入孔の周辺に前記部品の搭載面側と反対側方向に
突出部を備えた回路基板を、少なくとも３角以上の角錐
形状をもつ金型で押圧加工して前記突出部を設けること
を特徴とする回路基板の製造方法。1. A circuit board in which a metal plate on which a wiring circuit pattern is formed and an insulating support are integrated with each other, wherein the wiring circuit pattern has a component insertion hole, and the component is provided around the component insertion hole. A method for manufacturing a circuit board, characterized in that a circuit board having a protruding portion in a direction opposite to a mounting surface side is pressed by a metal mold having a pyramid shape of at least three sides to provide the protruding portion.
ることを特徴とする請求項１記載の回路基板の製造方
法。2. The method for manufacturing a circuit board according to claim 1, wherein the protrusion has a zigzag tooth shape.
径より大きく、突出部側の寸法が前記部品端子径よりも
小さく、前記部品端子を前記部品挿入孔に挿入した際、
しまり嵌めとなることを特徴とする請求項１記載の回路
基板の製造方法。3. A component insertion hole dimension on the component insertion side is larger than a component terminal diameter, a protrusion side dimension is smaller than the component terminal diameter, and when the component terminal is inserted into the component insertion hole,
The method for manufacturing a circuit board according to claim 1, wherein the method is a tight fit.
たことを特徴とする請求項１〜３のいずれかに記載の回
路基板の製造方法。4. The method for manufacturing a circuit board according to claim 1, wherein the thickness of the metal plate is 0.1 mm or more.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP08497297A JP3484916B2 (en) | 1997-04-03 | 1997-04-03 | Circuit board and its manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP08497297A JP3484916B2 (en) | 1997-04-03 | 1997-04-03 | Circuit board and its manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH10284819A JPH10284819A (en) | 1998-10-23 |
| JP3484916B2 true JP3484916B2 (en) | 2004-01-06 |
Family
ID=13845551
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP08497297A Expired - Fee Related JP3484916B2 (en) | 1997-04-03 | 1997-04-03 | Circuit board and its manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3484916B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6509043B2 (en) * | 2015-05-28 | 2019-05-08 | 三菱電機株式会社 | Automotive electronic control unit |
| CN108807357B (en) * | 2018-06-19 | 2020-06-23 | 江苏守恒建设集团有限公司 | LED lighting device and manufacturing method thereof |
-
1997
- 1997-04-03 JP JP08497297A patent/JP3484916B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH10284819A (en) | 1998-10-23 |
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