JPH02114580A - Magnetoresistance element - Google Patents
Magnetoresistance elementInfo
- Publication number
- JPH02114580A JPH02114580A JP63267769A JP26776988A JPH02114580A JP H02114580 A JPH02114580 A JP H02114580A JP 63267769 A JP63267769 A JP 63267769A JP 26776988 A JP26776988 A JP 26776988A JP H02114580 A JPH02114580 A JP H02114580A
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- circuit board
- board
- substrate
- magnetoresistive element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims abstract description 16
- 229910000679 solder Inorganic materials 0.000 claims abstract description 10
- 239000000463 material Substances 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 3
- 230000005294 ferromagnetic effect Effects 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 4
- 239000010408 film Substances 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000010137 moulding (plastic) Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000005291 magnetic effect Effects 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910001174 tin-lead alloy Inorganic materials 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Hall/Mr Elements (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は磁電変換素子の一種である磁気抵抗素子に関す
る。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a magnetoresistive element, which is a type of magnetoelectric conversion element.
磁気抵抗効果を利用した磁電変換素子（以下磁気抵抗素
子と呼ぶ）は、特開昭５０−２８９８９号公報で周知で
ある。A magnetoelectric conversion element (hereinafter referred to as a magnetoresistive element) using a magnetoresistive effect is well known from Japanese Patent Laid-Open No. 50-28989.
この種の磁気抵抗素子は、具体的には第７図（Ａ）、（
Ｂ）に示すような構造をしているものがある。 このも
のは、ガラス、シリコンウェハーサファイヤ又はセラミ
ック等の平板状の絶縁性基板１の表面２上に、強磁性磁
気抵抗材料からなる薄膜の抵抗体パターン３と導電材料
からなる複数の電極４とが形成され、金又はアルミニウ
ムの細線８で電極４とワイヤボンディングされたリード
フレーム５を備えていた。 電極４は抵抗体パターン３
の近傍に３間膜けられ、これらの電極４に対応して夫々
リードフレーム５が設けられている。Specifically, this type of magnetoresistive element is shown in FIG. 7(A), (
Some have the structure shown in B). This device has a thin film resistor pattern 3 made of a ferromagnetic magnetoresistive material and a plurality of electrodes 4 made of a conductive material on a surface 2 of a flat insulating substrate 1 made of glass, silicon wafer sapphire, ceramic, etc. A lead frame 5 was formed and wire-bonded to an electrode 4 using a thin wire 8 of gold or aluminum. Electrode 4 is resistor pattern 3
Three electrodes are provided near the electrodes 4, and lead frames 5 are provided corresponding to these electrodes 4, respectively.
９はプラスチックモールディングである。9 is a plastic molding.
磁気抵抗素子の具体的な構造としては第７図（Ａ）、（
Ｂ）に示すもの＼他に、リードフレームを備えていない
で、プリント配線板に直接ハンダ付（リフローハンダ）
されるフリップチップタイプのものもある。The specific structure of the magnetoresistive element is shown in Fig. 7 (A), (
What is shown in B)＼In addition, soldering directly to the printed wiring board without a lead frame (reflow soldering)
There are also flip-chip types.
最近、プリント配線板や厚膜印刷回路基板（以下、これ
らを回路基板という）の表面に、磁気の検出上の都合か
ら、磁気抵抗素子を表面実装技術で実装し、しかも該素
子の抵抗体パターンを有する面を垂直に立てて実装する
要望が出てきた。Recently, magnetoresistive elements have been mounted on the surfaces of printed wiring boards and thick-film printed circuit boards (hereinafter referred to as circuit boards) for the convenience of detecting magnetism, and the resistor pattern of the elements A request has arisen to mount the device with the surface having the surface vertically erected.
この要求は回転磁石等の検出に利用する場合に良くある
ことである。This requirement is common when used for detecting rotating magnets, etc.
前記従来技術のうち、前者のものでは磁気抵抗素子の形
状が大きいばかりでなく、プリント配線基板に実装する
に当たり、リードフレームを曲げたり、曲げたリードフ
レームの先端をプリント配線板の穴に差し込んだりしな
ければならず、曲げ工程や、穴明工程など、組立が面倒
で、コスト高になるという問題点があった。Among the conventional technologies, the former requires not only a large magnetoresistive element, but also requires bending the lead frame and inserting the tip of the bent lead frame into a hole in the printed wiring board when mounting it on a printed wiring board. However, there were problems in that the assembly was troublesome and costly, including the bending process and hole-drilling process.
従来技術のうち、後者のものは、温度変化が大きいとき
に、磁気抵抗素子の基板１とプリント配線板との熱膨張
係数の差によってハンダ付部分にか＼る歪により、電極
が破壊されたり、電極とプリント配線板の電気的接続が
断線するという問題点があった。Among the conventional technologies, the latter one is such that when there is a large temperature change, the electrodes may be destroyed due to the strain exerted on the soldered part due to the difference in thermal expansion coefficient between the substrate 1 of the magnetoresistive element and the printed wiring board. However, there was a problem in that the electrical connection between the electrode and the printed wiring board was broken.
そこで、本発明の目的は、回路基板の表面に垂直に表面
実装し易い小形の磁気抵抗素子であって、しかも温度変
化を受けても回路基板との電気的接続が確実に維持され
る磁気抵抗素子を提案することである。SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a small magnetoresistive element that is easy to surface-mount perpendicularly to the surface of a circuit board, and which also maintains electrical connection with the circuit board reliably even under temperature changes. The goal is to propose an element.
上記目的を達成するために、本発明の磁気抵抗素子は、
電極とリードフレームとがハンダで接続されており、リ
ードフレームは基板を挾むクリップリードフレームであ
り、かつリードフレームは基板の端部において基板の表
面と裏面からそれぞれ直角方向に外側に突設しているこ
とを特徴とする。In order to achieve the above object, the magnetoresistive element of the present invention has the following features:
The electrode and the lead frame are connected by solder, and the lead frame is a clip lead frame that sandwiches the board, and the lead frame protrudes outward at right angles from the front and back sides of the board at the ends of the board. It is characterized by
リードフレームに挿入する基板の隅が約４５度に面取り
されていると基板とリードフレームの組立上効果的であ
る。It is effective to assemble the board and lead frame if the corners of the board to be inserted into the lead frame are chamfered at approximately 45 degrees.
上記のように構成された磁気抵抗素子を回路基板上に表
面実装するときに、リードフレームが素子の表面と裏面
から直角に外側に突設されているため、この突設部分が
働いて磁気抵抗素子が回路基板の表面に自立する。 そ
して抵抗体パターンを有する磁気抵抗素子の面が回路基
板上に垂直に配置される。 又、実長状態で温度変化が
か−り、磁気抵抗素子の基板と回路基板との熱膨張係数
の差による応力歪が発生しても、電極とリードフレーム
を接続するハンダ及びリードフレームがが機械的応力を
吸収し、電極や接続部の破壊を防止する。When the magnetoresistive element configured as described above is surface-mounted on a circuit board, the lead frame protrudes outward at right angles from the front and back surfaces of the element, so these protruding parts act to increase the magnetic resistance. The element stands on the surface of the circuit board. Then, the surface of the magnetoresistive element having the resistor pattern is arranged perpendicularly on the circuit board. In addition, even if the temperature changes in the actual length state and stress strain occurs due to the difference in thermal expansion coefficient between the substrate of the magnetoresistive element and the circuit board, the solder connecting the electrode and the lead frame and the lead frame will not break. Absorbs mechanical stress and prevents damage to electrodes and connections.
第１図（Ａ）、 （Ｂ）において、１はガラス等の絶
縁性基板で、その表面２上に強磁性磁気抵抗材料からな
る抵抗体パターン３と導電材料からなる３個の電極４が
形成されている。 ５はリードフレームで、いずれも
クリップリードフレームで基板１を挟んでいる。 リ
ードフレーム、５と電極４とは柔軟で電気的接続を確実
に行なえる材料でハンダ付されている。 符号１０はこ
のためのハンダを示す。 又、５ａ、 ５ａばリードフ
レーム５の突設部で、基板１の端部６において基板１の
表面２と裏面７からそれぞれ直角方向に外側に突設され
ている。In FIGS. 1A and 1B, 1 is an insulating substrate made of glass or the like, on the surface 2 of which a resistor pattern 3 made of a ferromagnetic magnetoresistive material and three electrodes 4 made of a conductive material are formed. has been done. Reference numeral 5 denotes a lead frame, in which the substrate 1 is sandwiched between clip lead frames. The lead frame 5 and the electrode 4 are soldered with a material that is flexible and allows reliable electrical connection. Reference numeral 10 indicates solder for this purpose. Further, 5a and 5a are protruding portions of the lead frame 5, which protrude outward from the front surface 2 and back surface 7 of the substrate 1, respectively, at right angles at the end portion 6 of the substrate 1.
第２図の実施例は、リードフレームの形状が第１図の実
施例と異なるとともに、基板１の隅が同図（Ｃ）、
（Ｄ）の符号１）で示すように約４５度の面取りがされ
ており、リードフレームへの挿入が容易である。In the embodiment shown in FIG. 2, the shape of the lead frame is different from that in the embodiment shown in FIG.
As shown by reference numeral 1) in (D), it is chamfered at approximately 45 degrees, making it easy to insert into the lead frame.
第３図（Ａ）、 （Ｂ）は第１図の実施例に用いるリ
ードフレームを示し、多数明分が連続しているときの形
状を示している。 このリードフレーム（クリップリー
ドフレーム）で、磁気抵抗素子の基板をその電極部分で
表裏から挟み込んで保持し、これを熔融したハンダ槽に
浸して電極とりドフレームをハンダ接続し、その後リー
ドフレムの不要部分を切断する。3(A) and 3(B) show the lead frame used in the embodiment of FIG. 1, and show the shape when a large number of bright parts are continuous. With this lead frame (clip lead frame), the substrate of the magnetoresistive element is held between the front and back sides between the electrode parts, and this is immersed in a molten solder bath to connect the electrode frame with solder, and then the unnecessary parts of the lead frame are cut.
リードフレームは厚膜印刷回路の接続に従来から使われ
ているものと同様に、長尺のリボン状の薄膜を連続的に
切断曲げ加工して安価に製造される。 リードフレーム
はリン青銅板等の弾性のある材料でつ（す、ハンダ付性
を良くするため錫又は錫鉛合金等で表面をメツキすると
良い。Lead frames are manufactured inexpensively by continuously cutting and bending long ribbon-shaped thin films, similar to those traditionally used to connect thick-film printed circuits. The lead frame is made of an elastic material such as a phosphor bronze plate.It is recommended that the surface be plated with tin or a tin-lead alloy to improve solderability.
第４図は第２図の例に用いるリードフレームの長尺での
状態を示す。FIG. 4 shows a long lead frame used in the example of FIG. 2.
第５図（Ａ）、 （Ｂ）は、第１図（Ａ）、 ＣＢ
）のリードフレーム５の突設部５ａを残し、エポキシ樹
脂等のプラスチックで、符号９で示すようにプラスチッ
クモールディングした実施例である。Figure 5 (A) and (B) are the same as Figure 1 (A) and CB.
), the protruding portion 5a of the lead frame 5 is left in place, and is molded with plastic such as epoxy resin as shown by reference numeral 9.
なお、第５図（Ｂ）では、磁気抵抗素子を回路基Ｆｊ、
１２の表面に実装する状態を示しているが、リドフレー
ム５の突設部５ａが、素子を回路基板１２上に自立させ
る作用をする。 この実施例では、第１図の場合と同様
に抵抗体パターン３が回路基板１２に最も接近した位置
をとり得るため、被検出磁石が回路基板１２の裏面に近
く配置される場合に好都合である。In addition, in FIG. 5(B), the magnetoresistive element is connected to the circuit board Fj,
Although the state in which the device is mounted on the surface of the circuit board 12 is shown, the protruding portion 5a of the lid frame 5 functions to make the device stand on its own on the circuit board 12. In this embodiment, the resistor pattern 3 can take the closest position to the circuit board 12 as in the case of FIG. .
第６図（Ａ）、 （Ｂ）、 （Ｃ）の実施例も、プ
ラスチックモールディング９を備えており、第１図や第
２図の実施例と比較して、第５図の実施例と同様に電極
とリードフレームの電気的接続の信幀性が向上し、素子
の取り扱いも容易となり、組立の自動マウントがし易く
なる。The embodiments of FIGS. 6A, 6B and 6C are also provided with a plastic molding 9 and are similar to the embodiment of FIG. 5 compared to the embodiments of FIGS. The reliability of the electrical connection between the electrode and the lead frame is improved, the handling of the device becomes easier, and automatic mounting during assembly becomes easier.
なお、上記実施例では、電極４が抵抗体バタン３を形成
した基板の一面にのみ形成されているが、この電極を基
板１の側面や裏面まで延長すると、電極の強度が増大す
る。In the above embodiment, the electrode 4 is formed only on one surface of the substrate on which the resistor button 3 is formed, but if this electrode is extended to the side or back surface of the substrate 1, the strength of the electrode is increased.
又、磁気抵抗素子にはバンシベーション膜などの表面保
護膜を設けることはいうまでもない。Further, it goes without saying that the magnetoresistive element is provided with a surface protection film such as a bancivation film.
磁気抵抗素子を回路基板に表面実装する際に、磁気抵抗
素子の抵抗体バクーンを形成した面が回路基板表面に垂
直に位置して自立するため、素子を垂直にマウントする
ことが容易となり、リフローハンダ付の方法が使え、組
立費用が安くなる。When surface-mounting a magnetoresistive element on a circuit board, the surface of the magnetoresistive element on which the resistive element is formed is located perpendicular to the circuit board surface and stands on its own, making it easy to mount the element vertically, making it easy to reflow. A soldering method can be used, reducing assembly costs.
又、素子全体が小形にできるため、実装密度を高くでき
る。 又、機械的振動や熱歪による応力をリードフレー
ムとハンダが吸収するため電気的接続の信頼性が向上す
る。Furthermore, since the entire element can be made smaller, the packaging density can be increased. In addition, the lead frame and solder absorb stress caused by mechanical vibration and thermal strain, improving the reliability of electrical connections.
又、クリップリードフレームと電極とのハンダ付は、ハ
ンダ槽に浸漬することで、連続的に多数の磁気抵抗素子
のハンダ付ができるため、この組立費用も安くなり磁気
抵抗素子のコスト低減に役立つ。In addition, the clip lead frame and electrodes can be soldered by immersing them in a solder bath, making it possible to successively solder a large number of magnetoresistive elements, which reduces assembly costs and helps reduce the cost of magnetoresistive elements. .
第゛１図（Ａ）、 （Ｂ）はこの発明の実施例の正面
図と側面図、第２図（Ａ）、 （Ｂ）、 （Ｃ）。
（Ｄ）は他の実施例の平面図、正面図、側面図及び基板
の一部拡大図、第３図（Ａ）、 （Ｂ）は連続してい
るクリップリードフレームの平面図と、（Ａ）図のＡ−
Ａ断面、第４図（Ａ）、（Ｂ）は同じく他の形状のクリ
ップリードフレームの平面図と側面図、第５図（Ａ）、
（Ｂ）は更に他の実施例の正面図と側面図、第６図
（Ａ）、 （Ｂ）。
（Ｃ）は更に他の実施例の平面図、正面図及び側面図、
第７図（Ａ）、 （Ｂ）は従来技術の正面図と側面図
である。
ｌ・・・基板、２・・・表面、３・・・抵抗体パターン
、４・・・電極、５・・・リードフレーム、６・・・端
部、７・・・裏面、１）・・・面取りFigures 1 (A) and (B) are front and side views of an embodiment of the present invention, and Figures 2 (A), (B), and (C). (D) is a plan view, front view, side view, and partially enlarged view of the board of another embodiment, FIGS. 3(A) and (B) are a plan view of a continuous clip lead frame, and (A ) Figure A-
A cross section, FIGS. 4(A) and (B) are the top and side views of clip lead frames of other shapes, FIG. 5(A),
(B) is a front view and a side view of yet another embodiment, and FIGS. 6(A) and (B). (C) is a plan view, a front view, and a side view of another embodiment,
FIGS. 7(A) and 7(B) are a front view and a side view of the prior art. l... Substrate, 2... Front surface, 3... Resistor pattern, 4... Electrode, 5... Lead frame, 6... End, 7... Back surface, 1)... ·chamfer
Claims (1)
成された強磁性磁気抵抗材料からなる抵抗体パターン（
３）と導電性材料からなる電極（４）と、該電極（４）
と電気的に接続されるリードフレーム（５）とを有する
磁気抵抗素子において、リードフレーム（５）は前記基
板（１）を挾むクリップリードフレームであり、前記電
極（４）とリードフレーム（５）とがハンダで接続され
ており、かつリードフレーム（５）は、磁気抵抗素子が
回路基板上に自立できるように基板（１）の端部（６）
において基板（１）の表面（２）と裏面（７）からそれ
ぞれ直角方向に外側に突設されていることを特徴とする
磁気抵抗素子。 ２、リードフレーム（５）に挿入する基板（１）の隅が
面取りされている請求項１記載の磁気抵抗素子。[Claims] 1. A resistor pattern (made of a ferromagnetic magnetoresistive material) formed on the surface (2) of an insulating substrate (1) such as glass.
3), an electrode (4) made of a conductive material, and the electrode (4)
In the magnetoresistive element, the lead frame (5) is a clip lead frame that sandwiches the substrate (1), and the electrode (4) and the lead frame (5) are electrically connected to each other. ) are connected by solder, and the lead frame (5) is connected to the end (6) of the circuit board (1) so that the magnetoresistive element can stand on the circuit board.
A magnetoresistive element, characterized in that it protrudes outward from the front surface (2) and rear surface (7) of a substrate (1) in a right angle direction, respectively. 2. The magnetoresistive element according to claim 1, wherein the corners of the substrate (1) to be inserted into the lead frame (5) are chamfered.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63267769A JP2711116B2 (en) | 1988-10-24 | 1988-10-24 | Magnetoresistive element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63267769A JP2711116B2 (en) | 1988-10-24 | 1988-10-24 | Magnetoresistive element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02114580A true JPH02114580A (en) | 1990-04-26 |
| JP2711116B2 JP2711116B2 (en) | 1998-02-10 |
Family
ID=17449333
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63267769A Expired - Lifetime JP2711116B2 (en) | 1988-10-24 | 1988-10-24 | Magnetoresistive element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2711116B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08148734A (en) * | 1994-11-24 | 1996-06-07 | Teikoku Tsushin Kogyo Co Ltd | Magnetic sensor |
-
1988
- 1988-10-24 JP JP63267769A patent/JP2711116B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08148734A (en) * | 1994-11-24 | 1996-06-07 | Teikoku Tsushin Kogyo Co Ltd | Magnetic sensor |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2711116B2 (en) | 1998-02-10 |
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