JPH0753301Y2 - Piezoelectric parts - Google Patents
Piezoelectric partsInfo
- Publication number
- JPH0753301Y2 JPH0753301Y2 JP1987137327U JP13732787U JPH0753301Y2 JP H0753301 Y2 JPH0753301 Y2 JP H0753301Y2 JP 1987137327 U JP1987137327 U JP 1987137327U JP 13732787 U JP13732787 U JP 13732787U JP H0753301 Y2 JPH0753301 Y2 JP H0753301Y2
- Authority
- JP
- Japan
- Prior art keywords
- case
- insulating substrate
- conductive portion
- conductive
- extraction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
【考案の詳細な説明】 〈産業上の利用分野〉 この考案はセラミック共振子等に使用されるリードレス
タイプの圧電部品に関する。DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a leadless type piezoelectric component used for a ceramic resonator or the like.
〈従来の技術〉 第4図は従来の圧電部品の分解斜視図、第5図は同じく
組立状態での正面部分断面図、第6図は同じく側面図で
ある。図において、1は圧電振動子、2は圧電振動子1
を支持する絶縁基板、3はケースである。圧電振動子1
は矩形平板状の圧電素体101の板厚方向の両面に互いに
反対方向に導出された振動電極102、103を有する。10
4、105はダミー電極である。<Prior Art> FIG. 4 is an exploded perspective view of a conventional piezoelectric component, FIG. 5 is a front partial sectional view of the same in an assembled state, and FIG. 6 is a side view of the same. In the figure, 1 is a piezoelectric vibrator, 2 is a piezoelectric vibrator 1
An insulating substrate 3 for supporting the is a case. Piezoelectric vibrator 1
Has oscillating electrodes 102 and 103 led out in mutually opposite directions on both sides in the plate thickness direction of a rectangular flat plate-shaped piezoelectric element 101. Ten
Reference numerals 4 and 105 are dummy electrodes.
絶縁基板2の表面には、その一面から両側端面に連続す
るように、取出電極21、22を間隔をおいて被着形成して
あり、これらの取出電極21、22の上に振動電極102の端
部及びダミー電極104が載るようにして、圧電振動子1
を搭載してある。そして、ダミー電極105から取出電極2
1にかけて導電接合部材4を付着させると共に、振動電
極103から取出電極22にかけて導電接合部材5を付着さ
せてある。これにより、振動電極102は取出電極21に導
通接続され、振動電極103は取出電極22に導通接続され
る。Extraction electrodes 21 and 22 are formed on the surface of the insulating substrate 2 so as to be continuous from one surface to both end surfaces of the insulation substrate 2 at intervals, and the vibration electrode 102 is formed on the extraction electrodes 21 and 22. The piezoelectric vibrator 1 is arranged so that the end portion and the dummy electrode 104 are placed.
It is equipped with. Then, the extraction electrode 2 from the dummy electrode 105
The conductive bonding member 4 is attached to the area 1 and the conductive bonding member 5 is attached to the extraction electrode 22 from the vibrating electrode 103. As a result, the vibrating electrode 102 is conductively connected to the extraction electrode 21, and the vibrating electrode 103 is conductively connected to the extraction electrode 22.
ケース3は絶縁体でなり、圧電振動子1を気密を保って
覆うようにして、絶縁基板2の面上に装着されている。
絶縁基板2とケース3との装着に当っては接着等の手段
がとられる。The case 3 is made of an insulating material and is mounted on the surface of the insulating substrate 2 so as to cover the piezoelectric vibrator 1 in an airtight manner.
When mounting the insulating substrate 2 and the case 3, means such as bonding is used.
回路基板への実装に当っては、第7図及び第8図に示す
ように、絶縁基板2側を回路基板上に載せ、取出電極2
1、22のうち、絶縁基板2の側端面に延長して形成した
部分211、221を、回路基板8上の導体パターン81、82に
半田付け6、7する。When mounting on the circuit board, the insulating substrate 2 side is placed on the circuit board as shown in FIG. 7 and FIG.
Of the parts 1 and 22, the parts 211 and 221 formed by extending to the side end surface of the insulating substrate 2 are soldered 6 and 7 to the conductor patterns 81 and 82 on the circuit board 8.
〈考案が解決しようとする問題点〉 しかしながら、上述した従来の圧電部品には次のような
問題点がある。<Problems to be Solved by the Invention> However, the above-described conventional piezoelectric component has the following problems.
(イ)回路基板8への実装する場合に導体パターン81、
82に半田付けされる取出電極21、22の部分211、221が、
下方向に偏った絶縁基板2の側端面に形成されている。
このため、回路基板に実装する場合に、絶縁基板2が下
側となるように、上下方向の方向性を確認する必要があ
る。このような方向性確認は、人間の目であれば比較的
容易に行なうことができるが、自動実装の場合には容易
ではなく、自動実装化の障害となる。(A) Conductor pattern 81 when mounted on the circuit board 8,
The parts 211 and 221 of the extraction electrodes 21 and 22 soldered to 82 are
It is formed on the side end surface of the insulating substrate 2 which is biased downward.
Therefore, when mounting on a circuit board, it is necessary to confirm the vertical directionality so that the insulating substrate 2 is on the lower side. Such direction confirmation can be relatively easily performed by human eyes, but it is not easy in the case of automatic mounting, which is an obstacle to automatic mounting.
(ロ)回路基板への実装に当って、取出電極21、22のう
ち、絶縁基板2の側端面に延長して形成した部分211、2
21を、回路基板8上の導体パターン81、82に半田付け
6、7する構造であるから、半田付代を確保するために
は、第6図及び第8図に示すように、絶縁基板2をケー
ス3よりも大きくする必要があり、小型化を図る場合の
障害となる。(B) For mounting on a circuit board, of the extraction electrodes 21, 22, portions 211, 2 formed by extending to the side end surface of the insulating substrate 2.
Since 21 is soldered 6 and 7 to the conductor patterns 81 and 82 on the circuit board 8, in order to secure the soldering allowance, as shown in FIGS. Is required to be larger than Case 3, which is an obstacle to miniaturization.
(ハ)絶縁基板2の大きさを小さくして小型化を図ろう
とすればする程、半田付代が小さくなり、半田付け強度
が保てなくなる。(C) As the size of the insulating substrate 2 is reduced to reduce the size, the soldering allowance becomes smaller and the soldering strength cannot be maintained.
〈問題点を解決するための手段〉 上述する問題点を解決するため、本考案に係る圧電部品
は、相対向する両端部において厚み方向の一面及び側端
面に連続して形成された取出電極を有する絶縁基板と、
前記絶縁基板の前記一面上に搭載され板厚方向の両面に
設けた振動電極を前記取出電極のそれぞれに導通接続さ
せた圧電振動子と、前記圧電振動子を覆うようにして前
記絶縁基板に取付けられ外側面に前記取出電極に導通さ
せた導電部を有するケースとを備える。前記ケースに前
記絶縁基板を嵌合させてあり、前記ケースの嵌合部に
は、前記ケースの前記導電部と導通する他の導電部が形
成されていて、前記他の導電部を介して、前記絶縁基板
に設けられた前記取出電極を、前記ケースの前記導電部
に導通させてある。<Means for Solving the Problems> In order to solve the above-mentioned problems, the piezoelectric component according to the present invention has extraction electrodes formed continuously on one surface and side end surfaces in the thickness direction at opposite ends. An insulating substrate having
A piezoelectric vibrator in which vibrating electrodes mounted on the one surface of the insulating substrate and provided on both surfaces in the plate thickness direction are conductively connected to the respective extraction electrodes, and attached to the insulating substrate so as to cover the piezoelectric vibrator. And a case having a conductive portion electrically connected to the extraction electrode on its outer surface. The insulating substrate is fitted to the case, the fitting portion of the case is formed with another conductive portion that is conductive with the conductive portion of the case, via the other conductive portion, The extraction electrode provided on the insulating substrate is electrically connected to the conductive portion of the case.
〈作用〉 本考案に係る圧電部品においては、圧電部品を搭載する
絶縁基板が、相対向する両端部において厚み方向の一面
及び側端面に連続して形成された取出電極を有し、圧電
振動子を覆うようにして前記絶縁基板に取付けられるケ
ースの外側面に取出電極に導通させた導電部を設けてあ
るので、回路基板に実装する場合、絶縁基板を下側にし
ても、ケース側を下側にしても、何れの状態でも実装で
きる。このため、圧電部品を回路基板等に実装し半田付
けする際に、上下の方向性を確認する必要がなくなるの
で、自動実装化が容易になる。<Operation> In the piezoelectric component according to the present invention, the insulating substrate on which the piezoelectric component is mounted has extraction electrodes continuously formed on one surface and side end surfaces in the thickness direction at opposite ends, and the piezoelectric vibrator is provided. Since a conductive part that is electrically connected to the extraction electrode is provided on the outer surface of the case attached to the insulating substrate so as to cover Even on the side, it can be mounted in any state. For this reason, when mounting the piezoelectric component on a circuit board or the like and soldering it, it is not necessary to check the vertical direction, so that automatic mounting is facilitated.
また、ケースの外側面に、取出電極に導通させた導電部
を有するので、回路基板上に実装する場合、ケースの導
電部を導体パターンに半田付けし、大きな半田付け面積
を確保できる。しかも、ケースを絶縁基板とほぼ同じ平
面積にしても、ケースの導電部によって大きな半田付け
面積を確保できるので、小型で半田付けの容易な圧電部
品が得られる。Further, since the outer surface of the case has the conductive portion that is electrically connected to the extraction electrode, when mounting on the circuit board, the conductive portion of the case can be soldered to the conductor pattern to secure a large soldering area. Moreover, even if the case has substantially the same plane area as the insulating substrate, a large soldering area can be secured by the conductive portion of the case, so that a small-sized piezoelectric component that can be easily soldered can be obtained.
更に、ケースの内部に絶縁基板を嵌合させてあり、嵌合
部となるケースの内面に、ケースの導電部と導通する他
の導電部が形成されていて、他の導電部を介して、絶縁
基板に設けられた取出電極を、ケースの導電部に導通さ
せてあるので、ケースと絶縁基板とを確実に位置決めし
て組合せ、ケースの導電部と絶縁基板に設けられた取出
電極とを、嵌合によって確実に導通させると共に、全体
の形状を小形化し、薄型化することができる。Furthermore, the insulating substrate is fitted inside the case, and another conductive portion that is conductive with the conductive portion of the case is formed on the inner surface of the case that is the fitting portion, and through the other conductive portion, Since the extraction electrode provided on the insulating substrate is electrically connected to the conductive portion of the case, the case and the insulating substrate are reliably positioned and combined, and the conductive portion of the case and the extraction electrode provided on the insulating substrate are It is possible to ensure electrical conduction by fitting, and to make the overall shape smaller and thinner.
〈実施例〉 第1図は本考案に係る圧電部品の分解斜視図、第2図は
同じく組立状態での部分断面図である。第4図及び第5
図と同一の参照符号は同一性ある構成部分を示してい
る。絶縁基板2は、相対向する両端部に、厚み方向の一
面及び側端面に連続して形成された取出電極21、22を有
している。圧電振動子1は、導電性ペースト等の導電接
合部材4、5によって、振動電極102、103を取出電極2
1、22のそれぞれに導通接続させてある。<Embodiment> FIG. 1 is an exploded perspective view of a piezoelectric component according to the present invention, and FIG. 2 is a partial sectional view of the same in an assembled state. 4 and 5
Reference numerals that are the same as those in the drawings indicate components that are the same. The insulating substrate 2 has extraction electrodes 21 and 22 continuously formed on one surface and side end surfaces in the thickness direction at both end portions facing each other. The piezoelectric vibrator 1 includes the vibrating electrodes 102 and 103 for extracting the vibrating electrodes 102 and 103 by the conductive bonding members 4 and 5 such as a conductive paste.
Conductive connection is made to each of 1 and 22.
ケース3はプラスチック、セラミック等の絶縁体でな
り、絶縁基板2の取出電極21、22を形成した側端面23、
24に対応する外側面31、32に、メタライズ等による導電
部9、10を設けた構造とし、この導電部9、10と、絶縁
基板2に設けた取出電極21、22とを、半田または導電性
ペースト等の導電接合部材11、12によって固着させてあ
る。The case 3 is made of an insulating material such as plastic or ceramic and has a side end surface 23 on which the extraction electrodes 21 and 22 of the insulating substrate 2 are formed.
The outer surface 31, 32 corresponding to 24 is provided with conductive parts 9, 10 by metallization or the like, and the conductive parts 9, 10 and the extraction electrodes 21, 22 provided on the insulating substrate 2 are soldered or conductive. It is fixed by conductive bonding members 11 and 12 such as a conductive paste.
上述のような構造であると、絶縁基板2及びケース3の
相対向する両端部の側面23−31、24−32に、絶縁基板2
からケース3に連続する取出電極21−導電部9、取出電
極22−導電部10及び導電接合部材11、12による導電部が
形成される。このため、上下方向の方向性がなくなり、
回路基板8に実装する場合、第3図に示すように、絶縁
基板2を下側にしても、これとは天地逆転となる如く、
ケース3側を下側にしても、何れの状態でも、導体パタ
ーン81、82に半田付け6、7できる。このため、回路基
板8に実装し半田付けする際に、上下の方向性を確認す
る必要がなくなり、自動実装化が容易になる。With the above-described structure, the insulating substrate 2 and the case 3 are attached to the side surfaces 23-31 and 24-32 of the opposite ends of the insulating substrate 2.
To the case 3, a conductive portion is formed by the extraction electrode 21-conductive portion 9, the extraction electrode 22-conductive portion 10 and the conductive joining members 11 and 12. Therefore, there is no vertical directionality,
When mounted on the circuit board 8, as shown in FIG. 3, even if the insulating board 2 is placed on the lower side, it is upside down.
The conductor patterns 81 and 82 can be soldered 6 and 7 in any state with the case 3 side facing down. Therefore, it is not necessary to confirm the vertical direction when mounting and soldering on the circuit board 8, which facilitates automatic mounting.
しかも、ケース3の導電部9、10により大きな半田付け
面積を確保できるので、充分な半田付け強度が確保でき
るようになると共に、半田付け作業も容易になる。ま
た、ケース3を絶縁基板2とほぼ同じ平面積にしても、
ケース3の導電部9、10によって大きな半田付け面積を
確保できるので、小形で半田付けの容易な圧電部品が得
られる。Moreover, since a large soldering area can be secured by the conductive portions 9 and 10 of the case 3, sufficient soldering strength can be secured and the soldering work becomes easy. In addition, even if the case 3 has substantially the same plane area as the insulating substrate 2,
Since a large soldering area can be secured by the conductive parts 9 and 10 of the case 3, a small-sized and easy-to-solder piezoelectric component can be obtained.
絶縁基板2をケース3の開口部に嵌合させてある。嵌合
部を構成するケース3の内面には、導電部9、10と導通
する導電部13、14が形成されていて、この導電部13、14
を介して、取出電極21、22を、導電部9、10に導通させ
てある。この構造により、ケース3と絶縁基板2とを確
実に位置決めして組合せ、ケース3の導電部(9、1
0)、(13、14)と絶縁基板2に設けられた取出電極2
1、22とを嵌合によって確実に導通させると共に、全体
の形状を小形化し、薄型化することが可能になる。The insulating substrate 2 is fitted in the opening of the case 3. Conductive parts 13 and 14 that are electrically connected to the conductive parts 9 and 10 are formed on the inner surface of the case 3 that constitutes the fitting part.
The extraction electrodes 21 and 22 are electrically connected to the conductive portions 9 and 10 via the. With this structure, the case 3 and the insulating substrate 2 are reliably positioned and combined, and the conductive portion (9, 1
0), (13, 14) and the extraction electrode 2 provided on the insulating substrate 2
It is possible to make sure that 1 and 22 are electrically connected to each other by fitting, and to make the entire shape small and thin.
〈考案の効果〉 以上述べたように、本考案によれば、次のような効果が
得られる。<Effect of the Invention> As described above, according to the present invention, the following effects can be obtained.
(a)上下方向の方向性をなくし、自動実装化に対応で
きるようにした圧電部品を提供できる。(A) It is possible to provide a piezoelectric component which can cope with automatic mounting by eliminating the vertical directionality.
(b)ケースの導電部により大きな半田付け面積を確保
できるので、回路基板等に対する実装時の半田付け強度
が大きく、半田付け作業の容易な圧電部品を提供でき
る。(B) Since a large soldering area can be secured by the conductive portion of the case, it is possible to provide a piezoelectric component that has a large soldering strength when mounted on a circuit board or the like and is easy to solder.
(c)ケースと絶縁基板とを確実に位置決めして組合
せ、ケースの導電部と絶縁基板に設けられた取出電極と
を嵌合によって確実に導通させると共に、全体の形状を
小形化し、薄型化した圧電部品を提供することができ
る。(C) The case and the insulating substrate are surely positioned and combined with each other, the conductive portion of the case and the extraction electrode provided on the insulating substrate are surely brought into conduction by fitting, and the overall shape is made smaller and thinner. A piezoelectric component can be provided.
第1図は本考案に係る圧電部品の分解斜視図、第2図は
同じく組立状態での正面断面図、第3図は本考案に係る
圧電部品を回路基板に実装した状態を示す断面図、第4
図は従来の圧電部品の分解斜視図、第5図は同じく組立
状態での部分断面図、第6図は同じくその側面図、第7
図及び第8図は同じく回路基板への実装状態を示す部分
断面図である。 1……圧電振動子、102、103……振動電極 2……絶縁基板、21、22……取出電極 3……ケース、31、32……外側面 9、10……導電部FIG. 1 is an exploded perspective view of a piezoelectric component according to the present invention, FIG. 2 is a front sectional view in the same assembled state, and FIG. 3 is a sectional view showing a state where the piezoelectric component according to the present invention is mounted on a circuit board, Fourth
FIG. 6 is an exploded perspective view of a conventional piezoelectric component, FIG. 5 is a partial sectional view of the same in an assembled state, FIG. 6 is a side view of the same, and FIG.
8A and 8B are partial cross-sectional views showing a mounting state on the circuit board. 1 ... Piezoelectric vibrator, 102, 103 ... Vibration electrode 2 ... Insulating substrate, 21, 22 ... Extraction electrode 3 ... Case, 31, 32 ... Outer surface 9, 10 ... Conductive part
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭51−121283(JP,A) 特開 昭57−118419(JP,A) 特開 昭55−13553(JP,A) 実開 昭57−39128(JP,U) 実開 昭59−137633(JP,U) 実公 昭58−7672(JP,Y1) ─────────────────────────────────────────────────── ───Continued from the front page (56) References JP-A-51-121283 (JP, A) JP-A-57-118419 (JP, A) JP-A-55-13553 (JP, A) Actual development Sho-57- 39128 (JP, U) Actually open 59-137633 (JP, U) Actually public 58-7672 (JP, Y1)
Claims (1)
及び側端面に連続して形成された取出電極を有する絶縁
基板と、前記絶縁基板の前記一面上に搭載され板厚方向
の両面に設けた振動電極を前記取出電極のそれぞれに導
通接続させた圧電振動子と、前記圧電振動子を覆うよう
にして前記絶縁基板に取付けられ外側面に前記取出電極
に導通させた導電部を有するケースとを備える圧電部品
であって、前記ケースの内部に前記絶縁基板を嵌合させ
てあり、嵌合部となる前記ケースの内面に、前記ケース
の前記導電部と導通する他の導電部が形成されていて、
前記他の導電部を介して、前記絶縁基板に設けられた前
記取出電極を、前記ケースの前記導電部に導通させてあ
ることを特徴とする圧電部品。1. An insulating substrate having extraction electrodes continuously formed on one surface and side end surfaces in the thickness direction at opposite ends, and on both surfaces in the plate thickness direction mounted on the one surface of the insulating substrate. A piezoelectric vibrator in which vibrating electrodes are conductively connected to each of the extraction electrodes; and a case having a conductive portion attached to the insulating substrate so as to cover the piezoelectric vibrator and having an outer surface in conduction with the extraction electrodes. A piezoelectric component comprising: the case, wherein the insulating substrate is fitted inside the case, and another conductive portion that is conductive with the conductive portion of the case is formed on an inner surface of the case that serves as a fitting portion. And
A piezoelectric component, wherein the extraction electrode provided on the insulating substrate is electrically connected to the conductive portion of the case via the other conductive portion.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987137327U JPH0753301Y2 (en) | 1987-09-08 | 1987-09-08 | Piezoelectric parts |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987137327U JPH0753301Y2 (en) | 1987-09-08 | 1987-09-08 | Piezoelectric parts |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6442619U JPS6442619U (en) | 1989-03-14 |
JPH0753301Y2 true JPH0753301Y2 (en) | 1995-12-06 |
Family
ID=31398650
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987137327U Expired - Lifetime JPH0753301Y2 (en) | 1987-09-08 | 1987-09-08 | Piezoelectric parts |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0753301Y2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000269768A (en) * | 1999-03-16 | 2000-09-29 | Tdk Corp | Piezoelectric resonance component |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2556465Y2 (en) * | 1991-02-28 | 1997-12-03 | 京セラ株式会社 | Surface mount type resonator |
JP2591361Y2 (en) * | 1991-05-15 | 1999-03-03 | 株式会社村田製作所 | Chip type piezoelectric components |
USD997871S1 (en) | 2019-12-18 | 2023-09-05 | Murata Manufacturing Co., Ltd. | Capacitor |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH580337A5 (en) * | 1975-04-02 | 1976-09-30 | Alusuisse | |
JPS6325777Y2 (en) * | 1980-08-14 | 1988-07-13 | ||
JPS57118419A (en) * | 1981-01-14 | 1982-07-23 | Fujitsu Ltd | Flat pack type oscillating circuit parts |
-
1987
- 1987-09-08 JP JP1987137327U patent/JPH0753301Y2/en not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000269768A (en) * | 1999-03-16 | 2000-09-29 | Tdk Corp | Piezoelectric resonance component |
Also Published As
Publication number | Publication date |
---|---|
JPS6442619U (en) | 1989-03-14 |
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