JPH045677U - - Google Patents
Info
- Publication number
- JPH045677U JPH045677U JP4530190U JP4530190U JPH045677U JP H045677 U JPH045677 U JP H045677U JP 4530190 U JP4530190 U JP 4530190U JP 4530190 U JP4530190 U JP 4530190U JP H045677 U JPH045677 U JP H045677U
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- electronic component
- stepped portion
- circuit board
- gap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 5
Landscapes
- Casings For Electric Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図ａは、本考案の実施例に係る表面実装型
電子部品の斜視図であり、第１図ｂは同図ａのＡ
−Ａ線の断面図であり、第１図ｃは絶縁基板の稜
線部分と外部回路基板との接合状態の断面図であ
る。第２図は本考案の他の実施例に係る表面実装
型電子部品の斜視図である。第３図は従来の表面
実装型電子部品の断面図である。
１，３１……表面実装型電子部品、２，３２…
…絶縁基板、３，３３……絶縁性蓋体、４，３４
……端子電極、５，３５……キヤビテイー、６…
…電子部品、９，３９……外部回路基板、１０，
４０……電極パツド、１１……段付部、１３……
面取り部。
FIG. 1a is a perspective view of a surface-mounted electronic component according to an embodiment of the present invention, and FIG. 1b is a perspective view of A in FIG.
FIG. 1C is a cross-sectional view taken along line -A, and FIG. FIG. 2 is a perspective view of a surface-mounted electronic component according to another embodiment of the present invention. FIG. 3 is a cross-sectional view of a conventional surface-mounted electronic component. 1,31...Surface mount electronic component, 2,32...
...Insulating substrate, 3, 33... Insulating lid, 4, 34
...Terminal electrode, 5, 35...Cavity, 6...
...Electronic component, 9,39...External circuit board, 10,
40... Electrode pad, 11... Stepped part, 13...
Chamfered part.
Claims (1)
び絶縁製蓋体で気密性封止し、且つ絶縁基板の底
面に、外部回路基板上の電極パツドに接合する端
子電極を設けて成る表面実装型電子部品において
、 前記端子電極が形成された絶縁基板の稜線部分
に、外部回路基板と隙間を形成する段付部と、該
段付部平面と絶縁基板の底面との間の面取り部と
を設けたことを特徴とする表面実装型電子部品。[Scope of claim for utility model registration] Terminal electrodes in which a desired circuit or electronic component element is hermetically sealed with an insulating substrate and an insulating lid, and which is bonded to the bottom of the insulating substrate to an electrode pad on an external circuit board. A surface-mounted electronic component comprising: a stepped portion forming a gap with the external circuit board on the ridgeline portion of the insulating substrate on which the terminal electrode is formed; and a stepped portion forming a gap between the flat surface of the stepped portion and the bottom surface of the insulating substrate. A surface-mounted electronic component characterized by having a chamfered portion between the parts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4530190U JPH045677U (en) | 1990-04-28 | 1990-04-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4530190U JPH045677U (en) | 1990-04-28 | 1990-04-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH045677U true JPH045677U (en) | 1992-01-20 |
Family
ID=31559356
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4530190U Pending JPH045677U (en) | 1990-04-28 | 1990-04-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH045677U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007027461A (en) * | 2005-07-19 | 2007-02-01 | Sumida Corporation | Core and inductor with core |
| JP2012023410A (en) * | 2011-11-02 | 2012-02-02 | Sumida Corporation | Inductor |
-
1990
- 1990-04-28 JP JP4530190U patent/JPH045677U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007027461A (en) * | 2005-07-19 | 2007-02-01 | Sumida Corporation | Core and inductor with core |
| JP2012023410A (en) * | 2011-11-02 | 2012-02-02 | Sumida Corporation | Inductor |
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