JPS6365968U - - Google Patents

Info

Publication number
JPS6365968U
JPS6365968U JP15960786U JP15960786U JPS6365968U JP S6365968 U JPS6365968 U JP S6365968U JP 15960786 U JP15960786 U JP 15960786U JP 15960786 U JP15960786 U JP 15960786U JP S6365968 U JPS6365968 U JP S6365968U
Authority
JP
Japan
Prior art keywords
terminal pin
increasing
diameter
utility
scope
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15960786U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP15960786U priority Critical patent/JPS6365968U/ja
Publication of JPS6365968U publication Critical patent/JPS6365968U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Connections Arranged To Contact A Plurality Of Conductors (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案のハーメチツクシールパツケー
ジの断面図、第2図は本考案のハーメチツクシー
ルパツケージを用いた電気部品をプリント基板に
面実装した時の断面図、第3図は従来のハーメチ
ツクシールパツケージの断面図、第4図は従来の
ハーメチツクシールパツケージを面実装が可能な
よう加工した時の断面図である。 1……アイレツト、3……ガラス、5a,5b
……端子ピン。
Figure 1 is a cross-sectional view of the hermetic seal package of the present invention, Figure 2 is a cross-sectional view of an electrical component using the hermetic seal package of the present invention surface-mounted on a printed circuit board, and Figure 3 is a conventional FIG. 4 is a sectional view of a conventional hermetic seal package processed to enable surface mounting. 1...Eyelet, 3...Glass, 5a, 5b
...terminal pin.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 端子ピンの少なくとも半田付部の直径を太くし
たことを特徴としたハーメチツクシールパツケー
ジ。
A hermetically sealed package characterized by increasing the diameter of at least the soldered portion of the terminal pin.
JP15960786U 1986-10-17 1986-10-17 Pending JPS6365968U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15960786U JPS6365968U (en) 1986-10-17 1986-10-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15960786U JPS6365968U (en) 1986-10-17 1986-10-17

Publications (1)

Publication Number Publication Date
JPS6365968U true JPS6365968U (en) 1988-04-30

Family

ID=31084196

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15960786U Pending JPS6365968U (en) 1986-10-17 1986-10-17

Country Status (1)

Country Link
JP (1) JPS6365968U (en)

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