JPH01113324U - - Google Patents
Info
- Publication number
- JPH01113324U JPH01113324U JP708888U JP708888U JPH01113324U JP H01113324 U JPH01113324 U JP H01113324U JP 708888 U JP708888 U JP 708888U JP 708888 U JP708888 U JP 708888U JP H01113324 U JPH01113324 U JP H01113324U
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- metal cover
- ceramic capacitor
- lead
- capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 8
- 239000003990 capacitor Substances 0.000 claims description 7
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 3
- 239000003985 ceramic capacitor Substances 0.000 claims 6
- 238000005476 soldering Methods 0.000 claims 2
- 230000002093 peripheral effect Effects 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
Landscapes
- Ceramic Capacitors (AREA)
Description
第１図、第２図は本考案の第１実施例および第
２実施例のそれぞれの正面断面図、平面一部破砕
図であり、第３図は従来の皿型ハーメチツクシー
ル型コンデンサ、第４図は従来の小判型ハーメチ
ツクシール型コンデンサに関する図である。
１１……ハーメチツクシール部、１２……リー
ド、１３……（セラミツク）コンデンサ素地、１
３ａ，１３ｂ……電極、１４……テフロンリング
、１５Ａ……金属箔、１５Ｂ……リード線、１６
……金属カバー、１６ａ……凸部、１７……緩衝
部材。
1 and 2 are a front sectional view and a partially exploded plan view of a first embodiment and a second embodiment of the present invention, respectively, and FIG. 3 shows a conventional dish-shaped hermetically sealed capacitor, FIG. 4 is a diagram of a conventional oval hermetically sealed capacitor. 11... Hermetic seal part, 12... Lead, 13... (ceramic) capacitor base, 1
3a, 13b...electrode, 14...Teflon ring, 15A...metal foil, 15B...lead wire, 16
...Metal cover, 16a...Protrusion, 17...Buffer member.
Claims (1)
メチツクシールケースを用い、前記金属カバーの
偏平面内側に盛り上げた凸部とハーメチツクシー
ル部のリードのケース内端部に形成したリード水
平部との間に、平板状のセラミツクコンデンサ素
地を水平に挾持し、かつセラミツクコンデンサ素
地周側縁を絶縁リングで保持し、前記セラミツク
コンデンサ素地の一方の電極が前記リード水平部
と半田接続され、他方の電極が、電極に接着した
導電部材を電極端部から立上げ、前記金属カバー
の非凸部との間に導電接続されるとともに、前記
金属カバー凸部との間に絶縁性の弾性緩衝部材を
介在させたことを特徴とするハーメチツクシール
型セラミツクコンデンサ。 (2) 前記第１項におけるセラミツクコンデンサ
素地の一方の電極に接着し、電極端部から立上げ
られた導電部材がリード線であつて金属カバーに
設けた穴を貫通し、該穴部で半田により金属カバ
ーと導電接続およびカバー封止がなされ、引出さ
れたリード線がコンデンサリードとなつている実
用新案登録請求の範囲第１項記載のハーメチツク
シール型セラミツクコンデンサ。[Claims for Utility Model Registration] (1) A hermetic seal case having a low, dish-shaped metal cover is used, and a convex portion raised on the inside of the flat surface of the metal cover and a lead of the hermetic seal portion are used. A flat ceramic capacitor base is held horizontally between the lead horizontal portion formed at the inner end of the case, and the peripheral side edge of the ceramic capacitor base is held by an insulating ring, and one electrode of the ceramic capacitor base is is connected to the horizontal part of the lead by soldering, and the other electrode has a conductive member adhered to the electrode raised from the end of the electrode, and is conductively connected to the non-convex part of the metal cover, and the other electrode is connected to the non-convex part of the metal cover by soldering. A hermetically sealed ceramic capacitor characterized by having an insulating elastic buffer member interposed between the capacitor and the capacitor. (2) A conductive member that is attached to one electrode of the ceramic capacitor base in the above item 1 and raised from the end of the electrode is a lead wire that passes through a hole provided in the metal cover and solder in the hole. A hermetically sealed ceramic capacitor according to claim 1, wherein the capacitor is conductively connected to a metal cover and sealed, and the lead wire drawn out serves as a capacitor lead.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP708888U JPH01113324U (en) | 1988-01-25 | 1988-01-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP708888U JPH01113324U (en) | 1988-01-25 | 1988-01-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01113324U true JPH01113324U (en) | 1989-07-31 |
Family
ID=31510747
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP708888U Pending JPH01113324U (en) | 1988-01-25 | 1988-01-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01113324U (en) |
-
1988
- 1988-01-25 JP JP708888U patent/JPH01113324U/ja active Pending
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