JPH0279040U - - Google Patents
Info
- Publication number
- JPH0279040U JPH0279040U JP15825788U JP15825788U JPH0279040U JP H0279040 U JPH0279040 U JP H0279040U JP 15825788 U JP15825788 U JP 15825788U JP 15825788 U JP15825788 U JP 15825788U JP H0279040 U JPH0279040 U JP H0279040U
- Authority
- JP
- Japan
- Prior art keywords
- base
- semiconductor element
- flat surface
- electrically connected
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims 1
- 238000007789 sealing Methods 0.000 description 1
Description
第１図ａは本考案の半導体素子用気密容器の一
例を示す一部破断斜視図、第１図ｂはその背面の
斜視図、第２図は従来の半導体素子用気密容器の
一例を示す一部破断斜視図である。
１０……半導体素子、２０……基体、２１……
気密封止用パターン、２２ａ，２２ｂ，２４ａ，
２４ｂ……導体パターン、２３……基準パターン
、３０……キヤツプ。
FIG. 1a is a partially cutaway perspective view showing an example of an airtight container for semiconductor devices according to the present invention, FIG. 1b is a perspective view of the rear side thereof, and FIG. FIG. 3 is a partially cutaway perspective view. 10...Semiconductor element, 20...Base, 21...
Hermetic sealing pattern, 22a, 22b, 24a,
24b...Conductor pattern, 23...Reference pattern, 30...Cap.
Claims (1)
基体の平坦な面上に設けられて、搭載される半導
体素子の電極に接続される導体パターンと、 誘電体パターンに一端が電気的に接続されるよ
うに該気体を貫通しており、その他端部に外部リ
ード線が電気的に接続される導電性部材と、 該基体に搭載される半導体素子および導体パタ
ーンを覆つてこれらを気密封止するキヤツプと、 を具備する半導体素子用気密容器。[Claims for Utility Model Registration] A base with a flat surface on which a semiconductor element is mounted, a conductor pattern provided on the flat surface of the base and connected to an electrode of the semiconductor element to be mounted, and a dielectric. a conductive member that passes through the gas so that one end is electrically connected to the pattern, and an external lead wire is electrically connected to the other end; a semiconductor element and a conductive pattern that are mounted on the base; An airtight container for semiconductor elements, comprising: a cap that covers and hermetically seals these;
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15825788U JPH0279040U (en) | 1988-12-05 | 1988-12-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15825788U JPH0279040U (en) | 1988-12-05 | 1988-12-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0279040U true JPH0279040U (en) | 1990-06-18 |
Family
ID=31438421
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15825788U Pending JPH0279040U (en) | 1988-12-05 | 1988-12-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0279040U (en) |
-
1988
- 1988-12-05 JP JP15825788U patent/JPH0279040U/ja active Pending
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