JPS6344455U - - Google Patents

Info

Publication number
JPS6344455U
JPS6344455U JP13838986U JP13838986U JPS6344455U JP S6344455 U JPS6344455 U JP S6344455U JP 13838986 U JP13838986 U JP 13838986U JP 13838986 U JP13838986 U JP 13838986U JP S6344455 U JPS6344455 U JP S6344455U
Authority
JP
Japan
Prior art keywords
lead
outer ring
large diameter
glass
metal outer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13838986U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP13838986U priority Critical patent/JPS6344455U/ja
Publication of JPS6344455U publication Critical patent/JPS6344455U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の気密ガラス端子を用いた半導
体装置の実施例を示す断面図、第２図は従来の気
密ガラス端子を用いた半導体装置の断面図である
。 図において１……金属製外環、２，２２……リ
ード、３，２３……アースリード、４……ガラス
、５……半導体素子、６……金属細線、７……キ
ヤツプ、８……はんだ、９……スタンドオフ、１
０，２０……半導体装置、１１……プリント回路
基板、１２，２５……導体回路パターン、１３…
…貫通孔、２４……径大部。 FIG. 1 is a sectional view showing an embodiment of a semiconductor device using an airtight glass terminal of the present invention, and FIG. 2 is a sectional view of a semiconductor device using a conventional airtight glass terminal. In the figure, 1...Metal outer ring, 2, 22...Lead, 3, 23...Earth lead, 4...Glass, 5...Semiconductor element, 6...Metal thin wire, 7...Cap, 8... Solder, 9...Standoff, 1
0, 20... Semiconductor device, 11... Printed circuit board, 12, 25... Conductor circuit pattern, 13...
...Through hole, 24...Large diameter part.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 金属製外環にガラスを介してリードを気密に封
着してなる気密ガラス端子において、前記リード
の外部接続側の先端部を径大部に形成したことを
特徴とする気密ガラス端子。 1. An airtight glass terminal comprising a lead hermetically sealed to a metal outer ring via glass, characterized in that the tip of the lead on the external connection side is formed to have a large diameter.
JP13838986U 1986-09-09 1986-09-09 Pending JPS6344455U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13838986U JPS6344455U (en) 1986-09-09 1986-09-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13838986U JPS6344455U (en) 1986-09-09 1986-09-09

Publications (1)

Publication Number Publication Date
JPS6344455U true JPS6344455U (en) 1988-03-25

Family

ID=31043326

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13838986U Pending JPS6344455U (en) 1986-09-09 1986-09-09

Country Status (1)

Country Link
JP (1) JPS6344455U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61101061A (en) * 1984-10-24 1986-05-19 Hitachi Ltd Semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61101061A (en) * 1984-10-24 1986-05-19 Hitachi Ltd Semiconductor device

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