JPH0224625U - - Google Patents

Info

Publication number
JPH0224625U
JPH0224625U JP10133988U JP10133988U JPH0224625U JP H0224625 U JPH0224625 U JP H0224625U JP 10133988 U JP10133988 U JP 10133988U JP 10133988 U JP10133988 U JP 10133988U JP H0224625 U JPH0224625 U JP H0224625U
Authority
JP
Japan
Prior art keywords
acoustic wave
surface acoustic
lead wire
wave element
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10133988U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10133988U priority Critical patent/JPH0224625U/ja
Publication of JPH0224625U publication Critical patent/JPH0224625U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はこの考案の一実施例の弾性表面波装置
の断面図である。第2図は従来の弾性表面波装置
の断面図である。 10……ステム、11……ステム基板、13…
…リード線、14……ガラス、15……弾性表面
波素子、16……ワイヤ。
FIG. 1 is a sectional view of a surface acoustic wave device according to an embodiment of this invention. FIG. 2 is a sectional view of a conventional surface acoustic wave device. 10... Stem, 11... Stem board, 13...
... Lead wire, 14 ... Glass, 15 ... Surface acoustic wave element, 16 ... Wire.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ステム基板の透孔に誘電率が6.0以下のガラ
スを用いてリード線を気密に封着し、前記ステム
基板上に弾性表面波素子を固着して、弾性表面波
素子の電極を前記リード線に接続してなる弾性表
面波装置。
A lead wire is hermetically sealed in the through hole of the stem substrate using glass with a dielectric constant of 6.0 or less, a surface acoustic wave element is fixed on the stem substrate, and an electrode of the surface acoustic wave element is connected to the lead wire. A surface acoustic wave device connected to a wire.
JP10133988U 1988-07-29 1988-07-29 Pending JPH0224625U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10133988U JPH0224625U (en) 1988-07-29 1988-07-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10133988U JPH0224625U (en) 1988-07-29 1988-07-29

Publications (1)

Publication Number Publication Date
JPH0224625U true JPH0224625U (en) 1990-02-19

Family

ID=31330240

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10133988U Pending JPH0224625U (en) 1988-07-29 1988-07-29

Country Status (1)

Country Link
JP (1) JPH0224625U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5186377A (en) * 1975-01-27 1976-07-28 Seiko Instr & Electronics SUISHOHATSUSHINKINOSEIZOHO

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5186377A (en) * 1975-01-27 1976-07-28 Seiko Instr & Electronics SUISHOHATSUSHINKINOSEIZOHO

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