JPS63156118U - - Google Patents
Info
- Publication number
- JPS63156118U JPS63156118U JP4959487U JP4959487U JPS63156118U JP S63156118 U JPS63156118 U JP S63156118U JP 4959487 U JP4959487 U JP 4959487U JP 4959487 U JP4959487 U JP 4959487U JP S63156118 U JPS63156118 U JP S63156118U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- acoustic wave
- surface acoustic
- external connection
- connection terminals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010897 surface acoustic wave method Methods 0.000 claims 3
- 239000004020 conductor Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
Description
図は本案の実施例を示すもので、第１図は第一
実施例のチツプ装着前の全体の斜視図 第２図は
同ＳＡＷ装置全体の断面図 第３図は第二実施例
の要部断面図 第４図は第三実施例の平面図であ
る。
１はチツプ、２はベース、３は接続端子、４は
接着剤、５は吸音部、６はアルミニウムワイヤー
、７はカン、８はｌＤＴ電極、８′はシールド電
極、９は電極、９′は接続部。
The figures show an embodiment of the present invention. Fig. 1 is an overall perspective view of the first embodiment before the chip is attached. Fig. 2 is a sectional view of the entire SAW device. Fig. 3 is a main part of the second embodiment. Cross-sectional view FIG. 4 is a plan view of the third embodiment. 1 is the chip, 2 is the base, 3 is the connection terminal, 4 is the adhesive, 5 is the sound absorbing part, 6 is the aluminum wire, 7 is the can, 8 is the LDT electrode, 8' is the shield electrode, 9 is the electrode, 9' is the Connection part.
Claims (1)
性表面波素子チツプを外部接続端子が付設された
ベース上に装着し、前記素子の電極と外部接続端
子とを接続してなる弾性表面波装置に於て、チツ
プ端面に導電性材料を以て、チツプ表面からベー
ス面迄達する吸音部を設けてなることを特徴とす
る弾性表面波装置。 In a surface acoustic wave device, a surface acoustic wave element chip having a predetermined electrode pattern formed on a piezoelectric substrate is mounted on a base provided with external connection terminals, and the electrodes of the element are connected to the external connection terminals. A surface acoustic wave device characterized in that a sound absorbing portion extending from the chip surface to the base surface is provided on the end surface of the chip using a conductive material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4959487U JPS63156118U (en) | 1987-03-31 | 1987-03-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4959487U JPS63156118U (en) | 1987-03-31 | 1987-03-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63156118U true JPS63156118U (en) | 1988-10-13 |
Family
ID=30872191
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4959487U Pending JPS63156118U (en) | 1987-03-31 | 1987-03-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63156118U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008146627A1 (en) * | 2007-05-24 | 2008-12-04 | Olympus Corporation | Stirring device and automatic analyzer |
-
1987
- 1987-03-31 JP JP4959487U patent/JPS63156118U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008146627A1 (en) * | 2007-05-24 | 2008-12-04 | Olympus Corporation | Stirring device and automatic analyzer |
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