JPS63138726U - - Google Patents
Info
- Publication number
- JPS63138726U JPS63138726U JP2900287U JP2900287U JPS63138726U JP S63138726 U JPS63138726 U JP S63138726U JP 2900287 U JP2900287 U JP 2900287U JP 2900287 U JP2900287 U JP 2900287U JP S63138726 U JPS63138726 U JP S63138726U
- Authority
- JP
- Japan
- Prior art keywords
- acoustic wave
- surface acoustic
- recess
- chip
- external connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 238000010897 surface acoustic wave method Methods 0.000 claims 4
- 239000000758 substrate Substances 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
Description
図は本案の実施例を示すもので、第１図はベー
スの斜視図、第２図はＳＡＷ装置の断面図、第３
図は同平面図、第４図は要部断面図である。
１はＳＡＷ素子チツプ、２は電極、３はベース
、４は凹部、５は接続端子、６は接着剤、７はア
ルミニウムワイヤー、８はカン。
The figures show an embodiment of the present invention. Figure 1 is a perspective view of the base, Figure 2 is a sectional view of the SAW device, and Figure 3 is a sectional view of the SAW device.
The figure is a plan view of the same, and FIG. 4 is a sectional view of a main part. 1 is a SAW element chip, 2 is an electrode, 3 is a base, 4 is a recess, 5 is a connecting terminal, 6 is an adhesive, 7 is an aluminum wire, and 8 is a can.
Claims (1)
性表面波素子チツプを、外部接続端子を付設した
ベース上に装着し、前記素子の電極と外部接続端
子とを接続してなる弾性表面波装置に於て、ベー
スに弾性表面波素子チツプが内置可能な大きさの
凹部を形成し、当該チツプを接着剤を以て前記凹
部内に固着すると共に、接着剤が素子端部表面よ
り盛り上りその一部が素子表面上に位置して硬化
されていることを特徴とする弾性表面波装置。 In a surface acoustic wave device, a surface acoustic wave element chip having a predetermined electrode pattern formed on a piezoelectric substrate is mounted on a base provided with external connection terminals, and the electrodes of the element are connected to the external connection terminals. Then, a recess large enough to accommodate a surface acoustic wave element chip is formed in the base, and the chip is fixed in the recess with an adhesive, and the adhesive rises from the surface of the end of the element and a part of the recess is attached to the element. A surface acoustic wave device characterized in that it is located on a surface and is hardened.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2900287U JPS63138726U (en) | 1987-02-28 | 1987-02-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2900287U JPS63138726U (en) | 1987-02-28 | 1987-02-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63138726U true JPS63138726U (en) | 1988-09-13 |
Family
ID=30832493
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2900287U Pending JPS63138726U (en) | 1987-02-28 | 1987-02-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63138726U (en) |
-
1987
- 1987-02-28 JP JP2900287U patent/JPS63138726U/ja active Pending
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