JPH03107822U - - Google Patents
Info
- Publication number
- JPH03107822U JPH03107822U JP1608590U JP1608590U JPH03107822U JP H03107822 U JPH03107822 U JP H03107822U JP 1608590 U JP1608590 U JP 1608590U JP 1608590 U JP1608590 U JP 1608590U JP H03107822 U JPH03107822 U JP H03107822U
- Authority
- JP
- Japan
- Prior art keywords
- recess
- wave oscillator
- case substrate
- chip
- surface wave
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012212 insulator Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims 1
- 238000010897 surface acoustic wave method Methods 0.000 claims 1
Landscapes
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Description
第１図は本考案の一実施例の表面波発振子の断
面図、第２図は表面波発振子エレメントを示す平
面図、第３図はマザーの絶縁体ケース基板を示す
斜視図、第４図はマザーの絶縁体ケース基板に電
極を形成した状態を示す平面図、第５図は第１図
のＶ−Ｖ線に沿う部分に相当する断面図、第６図
は本考案の一実施例の表面波発振子の斜視図、第
７図は本考案の他の実施例の表面波発振子を説明
するための断面図である。
図において、１はチツプ型表面波発振子、２は
絶縁体ケース基板、２ａは凹部、３は蓋材、４は
表面波発振子エレメント、４ｅ，４ｆは入出力電
極パツド、５は接着剤、６ａ，６ｂは接続導電部
、７ａ，７ｂはワイヤーボンデイング、８ａ，８
ｂは外部電極を示す。
Fig. 1 is a sectional view of a surface wave oscillator according to an embodiment of the present invention, Fig. 2 is a plan view showing the surface wave oscillator element, Fig. 3 is a perspective view showing the mother insulator case board, and Fig. 4 The figure is a plan view showing the state in which electrodes are formed on the mother insulator case substrate, Figure 5 is a cross-sectional view corresponding to the portion along line V-V in Figure 1, and Figure 6 is an embodiment of the present invention. FIG. 7 is a perspective view of a surface wave oscillator according to another embodiment of the present invention. FIG. In the figure, 1 is a chip type surface wave oscillator, 2 is an insulator case substrate, 2a is a recess, 3 is a cover material, 4 is a surface wave oscillator element, 4e and 4f are input/output electrode pads, 5 is an adhesive, 6a, 6b are connection conductive parts, 7a, 7b are wire bonding parts, 8a, 8
b indicates an external electrode.
Claims (1)
り該凹部内に固定された弾性表面波発振子エレメ
ントと、 前記凹部を封止するように絶縁体ケース基板に
貼り付けられた蓋材とを備え、 前記絶縁体ケース基板には、凹部内から絶縁体
ケース基板と蓋材とで構成されるケース外表面へ
引出された接続導電部が設けられており、前記接
続導電部と表面波発振子エレメントの電極とが電
気的に接続されており、さらに前記絶縁体ケース
基板と蓋材とで構成されたケース外面に、前記接
続導電部と電気的に接続された外部電極が形成さ
れていることを特徴とするチツプ型表面波発振子
。[Claims for Utility Model Registration] An insulator case substrate having a recess, a surface acoustic wave oscillator element housed in the recess and fixed within the recess with an adhesive, and sealing the recess. and a lid material affixed to the insulator case substrate so as to be connected to the insulator case substrate. The connecting conductive portion is electrically connected to the electrode of the surface wave oscillator element, and the connecting conductive portion is provided on the outer surface of the case composed of the insulating case substrate and the lid material. A chip-type surface wave oscillator characterized in that an external electrode is formed and electrically connected to the surface of the chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1608590U JPH03107822U (en) | 1990-02-19 | 1990-02-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1608590U JPH03107822U (en) | 1990-02-19 | 1990-02-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03107822U true JPH03107822U (en) | 1991-11-06 |
Family
ID=31519370
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1608590U Pending JPH03107822U (en) | 1990-02-19 | 1990-02-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03107822U (en) |
-
1990
- 1990-02-19 JP JP1608590U patent/JPH03107822U/ja active Pending