JPS61191623U - - Google Patents
Info
- Publication number
- JPS61191623U JPS61191623U JP7604485U JP7604485U JPS61191623U JP S61191623 U JPS61191623 U JP S61191623U JP 7604485 U JP7604485 U JP 7604485U JP 7604485 U JP7604485 U JP 7604485U JP S61191623 U JPS61191623 U JP S61191623U
- Authority
- JP
- Japan
- Prior art keywords
- acoustic wave
- surface acoustic
- piezoelectric substrate
- interdigital electrodes
- wave device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010897 surface acoustic wave method Methods 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 238000000465 moulding Methods 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Landscapes
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Description
第１図は本考案の実施例を示す側面断面図、第
２図はそこで用いられる弾性表面波素子の斜視図
である。
１０……基板、１１……インターデジタル電極
、１２……端子接続用電極、１３……絶縁膜、１
４……多孔質性粘弾性樹脂、１５……エポキシ樹
脂、１６……空隙、１７……リード端子。
FIG. 1 is a side sectional view showing an embodiment of the present invention, and FIG. 2 is a perspective view of a surface acoustic wave element used therein. DESCRIPTION OF SYMBOLS 10...Substrate, 11...Interdigital electrode, 12...Terminal connection electrode, 13...Insulating film, 1
4...Porous viscoelastic resin, 15...Epoxy resin, 16...Void, 17...Lead terminal.
Claims (1)
、弾性表面波の伝播路上に空隙を形成して樹脂モ
ールドされて成る弾性表面波装置において、該圧
電基板の表面に該インターデジタル電極を覆う絶
縁膜が形成されたことを特徴とする弾性表面波装
置。 In a surface acoustic wave device comprising interdigital electrodes on the surface of a piezoelectric substrate and resin molding with a gap formed on the propagation path of the surface acoustic wave, an insulating film covering the interdigital electrodes is formed on the surface of the piezoelectric substrate. A surface acoustic wave device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7604485U JPS61191623U (en) | 1985-05-22 | 1985-05-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7604485U JPS61191623U (en) | 1985-05-22 | 1985-05-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61191623U true JPS61191623U (en) | 1986-11-28 |
Family
ID=30617821
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7604485U Pending JPS61191623U (en) | 1985-05-22 | 1985-05-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61191623U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5929822B2 (en) * | 1974-03-11 | 1984-07-23 | 日本電気株式会社 | Digital level measurement circuit |
-
1985
- 1985-05-22 JP JP7604485U patent/JPS61191623U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5929822B2 (en) * | 1974-03-11 | 1984-07-23 | 日本電気株式会社 | Digital level measurement circuit |
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