JPH02131346U - - Google Patents
Info
- Publication number
- JPH02131346U JPH02131346U JP3996889U JP3996889U JPH02131346U JP H02131346 U JPH02131346 U JP H02131346U JP 3996889 U JP3996889 U JP 3996889U JP 3996889 U JP3996889 U JP 3996889U JP H02131346 U JPH02131346 U JP H02131346U
- Authority
- JP
- Japan
- Prior art keywords
- conductor pattern
- semiconductor
- sealed package
- hermetically sealed
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 14
- 239000000758 substrate Substances 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims 7
- 239000000919 ceramic Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 239000006200 vaporizer Substances 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Wire Bonding (AREA)
Description
第１図は本考案の一実施例を示す側面図、第２
図はその一部拡大図、第３，４図は他の実施例を
示す側断面図、また第５図は公知のセラミツク・
パツケージの側断面図、第６図はその一部の拡大
断面図、第７図は第６図における−線断面図
、第８図は加圧状態を示す図である。
３０，３０Ａ，Ｂ……基板、３２，３２Ａ，Ｂ
……導体パターン、３４……ウインドフレーム、
３６，３６Ｂ……ボンデイング用導体パターン、
３８，５０……スルーホール、４０，４０Ａ，Ｂ
……外部導体パターン、４４……集積回路、５０
……キヤツプ。
Figure 1 is a side view showing one embodiment of the present invention;
The figure is a partially enlarged view, FIGS. 3 and 4 are side sectional views showing other embodiments, and FIG.
FIG. 6 is a side sectional view of the package, FIG. 6 is an enlarged sectional view of a part thereof, FIG. 7 is a sectional view taken along the line -- in FIG. 6, and FIG. 8 is a view showing a pressurized state. 30, 30A, B...Substrate, 32, 32A, B
...Conductor pattern, 34...Wind frame,
36, 36B... conductor pattern for bonding,
38, 50...Through hole, 40, 40A, B
...External conductor pattern, 44...Integrated circuit, 50
...cap.
Claims (1)
レーム内に半導体回路を固定し、このウインドフ
レームの開口を金属製キヤツプで封止した半導体
気密封止パツケージにおいて、 前記ウインドフレームの基板への取付面よりも
基板側の基板内部に導体パターンを形成し、この
導体パターンの一端を前記半導体回路に接続し、
この導体パターンの他端を外部接続端子に接続し
たことを特徴とする半導体気密封止パツケージ。 (2) 導体パターンの内端は、ウインドフレーム
内の基板上面に形成されたワイヤボンデイング用
導体パターンにスルーホールによつて接続されて
いることを特徴とする請求項(1)に記載の半導体
気密封止パツケージ。 (3) 導体パターンの他端はウインドフレーム外
の基板側面および上面に形成された外部導体パタ
ーンに接続され、この外部導体パターンに外部接
続端子が接続されていることを特徴とする請求項
(1)に記載の半導体気密封止パツケージ。 (4) 導体パターンの内端および外端はボンデイ
ング用導体パターンおよび外部導体パターンに直
接接続されていることを特徴とする請求項(1)に
記載の半導体気密封止パツケージ。[Scope of Claim for Utility Model Registration] (1) In a semiconductor hermetically sealed package in which a semiconductor circuit is fixed within a window frame integrally provided on a ceramic substrate, and an opening of the window frame is sealed with a metal cap, the window forming a conductor pattern inside the board on the board side of the mounting surface of the frame to the board, and connecting one end of the conductor pattern to the semiconductor circuit;
A semiconductor hermetically sealed package characterized in that the other end of the conductor pattern is connected to an external connection terminal. (2) The semiconductor vaporizer according to claim (1), wherein the inner end of the conductor pattern is connected to a conductor pattern for wire bonding formed on the upper surface of the substrate in the window frame by a through hole. Sealed package. (3) A claim characterized in that the other end of the conductor pattern is connected to an external conductor pattern formed on the side surface and top surface of the board outside the wind frame, and an external connection terminal is connected to this external conductor pattern.
The semiconductor hermetically sealed package described in (1). (4) The semiconductor hermetically sealed package according to claim (1), wherein the inner and outer ends of the conductor pattern are directly connected to the bonding conductor pattern and the external conductor pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3996889U JPH02131346U (en) | 1989-04-06 | 1989-04-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3996889U JPH02131346U (en) | 1989-04-06 | 1989-04-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02131346U true JPH02131346U (en) | 1990-10-31 |
Family
ID=31549345
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3996889U Pending JPH02131346U (en) | 1989-04-06 | 1989-04-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02131346U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS635238U (en) * | 1986-06-25 | 1988-01-14 |
-
1989
- 1989-04-06 JP JP3996889U patent/JPH02131346U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS635238U (en) * | 1986-06-25 | 1988-01-14 |