JPH0415823U - - Google Patents
Info
- Publication number
- JPH0415823U JPH0415823U JP5828990U JP5828990U JPH0415823U JP H0415823 U JPH0415823 U JP H0415823U JP 5828990 U JP5828990 U JP 5828990U JP 5828990 U JP5828990 U JP 5828990U JP H0415823 U JPH0415823 U JP H0415823U
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- terminal electrode
- back surface
- protrusion
- registration request
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Oscillators With Electromechanical Resonators (AREA)
Description
第１図は本考案の一実施例の斜視図、第２図は
その断面図、第３図は実施例の回路の等価回路図
、第４図は端子電極の取着方法を説明するための
図であり、第５図は他の実施例に係る裏面斜視図
である。
１……発振器、２……絶縁基板、３……絶縁性
蓋体、４……端子電極、５ａ，５ｂ……溝、６…
…発振回路、７……外部導出電極、５１……突出
部。
Fig. 1 is a perspective view of an embodiment of the present invention, Fig. 2 is a sectional view thereof, Fig. 3 is an equivalent circuit diagram of the circuit of the embodiment, and Fig. 4 is a diagram for explaining the method of attaching terminal electrodes. FIG. 5 is a rear perspective view of another embodiment. DESCRIPTION OF SYMBOLS 1... Oscillator, 2... Insulating substrate, 3... Insulating lid, 4... Terminal electrode, 5a, 5b... Groove, 6...
...Oscillation circuit, 7...External lead-out electrode, 51...Protrusion part.
Claims (1)
に接続するための端子電極を形成した絶縁基板に
おける該端子電極が絶縁基板裏面よりも０．０５
ｍｍ以上突出して成る表面実装型電子部品。 In an insulating substrate on which an electronic circuit is formed on the top surface and a terminal electrode for connecting to another circuit board on the back surface, the terminal electrode is 0.05% lower than the back surface of the insulating substrate.
A surface-mounted electronic component with a protrusion of mm or more.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5828990U JPH0415823U (en) | 1990-05-31 | 1990-05-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5828990U JPH0415823U (en) | 1990-05-31 | 1990-05-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0415823U true JPH0415823U (en) | 1992-02-07 |
Family
ID=31583766
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5828990U Pending JPH0415823U (en) | 1990-05-31 | 1990-05-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0415823U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6150414A (en) * | 1984-08-20 | 1986-03-12 | Nippon Dempa Kogyo Co Ltd | Composite piezoelectric unit |
-
1990
- 1990-05-31 JP JP5828990U patent/JPH0415823U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6150414A (en) * | 1984-08-20 | 1986-03-12 | Nippon Dempa Kogyo Co Ltd | Composite piezoelectric unit |