JPS62116533U - - Google Patents
Info
- Publication number
- JPS62116533U JPS62116533U JP295686U JP295686U JPS62116533U JP S62116533 U JPS62116533 U JP S62116533U JP 295686 U JP295686 U JP 295686U JP 295686 U JP295686 U JP 295686U JP S62116533 U JPS62116533 U JP S62116533U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- low thermal
- thermal conductivity
- protruding
- protruding part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 2
- 239000003985 ceramic capacitor Substances 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図、第２図、第３図、第４図及び第５図は
従来の構造を示す電子部品と基板との関係を示す
図、第６図及び第７図は夫々本考案の各実施例を
示す図である。
２……プリント基板、７……電子部品例えばセ
ラミツクスコンデンサ、８……リード、９……突
出部、１０……電子部品例えば抵抗器、１１……
突出部。
1, 2, 3, 4, and 5 are diagrams showing the relationship between electronic components and a board showing a conventional structure, and FIGS. 6 and 7 are diagrams showing respective implementations of the present invention. It is a figure which shows an example. 2...Printed circuit board, 7...Electronic component, e.g. ceramic capacitor, 8...Lead, 9...Protrusion, 10...Electronic component, e.g. resistor, 11...
protrusion.
Claims (1)
部に対応する基板孔径より大きく、該電子部品表
面と同じ材質、もしくは熱伝導率の低い材質より
なる突出部を一体に設け、上記突出部により電子
部品にて発生した熱のプリント基板への伝導率を
小さくなるようにしたことを特徴とする電子部品
。 A protruding part made of the same material as the surface of the electronic component or a material with low thermal conductivity is provided integrally with the diameter of the board hole corresponding to the lead part of the electronic component with the lead formed protruding from the bottom, and the protruding part is made of a material with low thermal conductivity. An electronic component characterized in that the conductivity of heat generated in the process to the printed circuit board is reduced.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP295686U JPS62116533U (en) | 1986-01-13 | 1986-01-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP295686U JPS62116533U (en) | 1986-01-13 | 1986-01-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62116533U true JPS62116533U (en) | 1987-07-24 |
Family
ID=30782279
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP295686U Pending JPS62116533U (en) | 1986-01-13 | 1986-01-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62116533U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5834724B2 (en) * | 1974-08-19 | 1983-07-28 | 松下電器産業株式会社 | Anzensouchi |
-
1986
- 1986-01-13 JP JP295686U patent/JPS62116533U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5834724B2 (en) * | 1974-08-19 | 1983-07-28 | 松下電器産業株式会社 | Anzensouchi |